Patents by Inventor Kow-Liang Wen

Kow-Liang Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Buck converter with a variable-gain feedback circuit for transient responses optimization
    Patent number: 9602001
    Abstract: A buck converter includes a power stage circuit and a control circuit. The power stage circuit has a pair of switches, an output inductor, and an output capacitor. The control circuit has a current-sensing unit (CCS), an error-amplifying (EA) and transient-holding (TH) unit, a transient-optimized feedback unit (TOF), and a PWM generation unit. The CCS senses an output capacitor current. The EA with the TH receives a feedback voltage and a reference voltage to generate an error signal. The TOF receives the feedback voltage and the reference voltage to generate a proportional voltage signal by a variable gain value. The PWM generation unit receives the proportional voltage signal and a sensing voltage signal to generate a PWM signal. When the proportional voltage signal equals the sensing voltage signal, the switches are controlled by the PWM signal at an optimal time point so that transient responses are optimized.
    Type: Grant
    Filed: November 6, 2015
    Date of Patent: March 21, 2017
    Assignees: NATIONAL CHENG KUNG UNIVERSITY, MEGAWIN TECHNOLOGY CO., LTD.
    Inventors: Ting-Hsuan Hung, Szu-Yu Huang, Tai-Haur Kuo, Kow-Liang Wen
  • High storage capacity, wide data input/output channel, static random access memory device
    Patent number: 5998869
    Abstract: A high storage capacity, wide data channel SRAM having a 64-bit wide data input/output channel, 4 Mbyte or 2 Mbyte of memory, and packaged as a 100-pin QFP or TQFP. The SRAM can be a substitute for a conventional 128 pin QFP or TQFP SRAM because all the functions including pipeline burst transmission are present. Moreover, the SRAM has a comparatively lower package testing and production cost.
    Type: Grant
    Filed: September 26, 1997
    Date of Patent: December 7, 1999
    Assignee: Winbond Electronics Corp.
    Inventors: Hung-Hsueh Lin, Hsin-Chang Lin, Kow-Liang Wen
  • Method for preventing electrostatic discharge failure in an integrated circuit package
    Patent number: 5712753
    Abstract: An integrated circuit package includes a semiconductor chip, bonding pads on the semiconductor chip, a plurality of wired pins wire-bonded respectively to the bonding pads, and at least one non-wired pin. The non-wired pin is connected electrically to an adjacent one of the wired pins to prevent electrostatic discharge failure in the integrated circuit package due to electrostatic discharge stressing of the non-wired pin.
    Type: Grant
    Filed: May 6, 1996
    Date of Patent: January 27, 1998
    Assignee: Winbond Electronics Corp.
    Inventors: Yang-Sen Yeh, Ta-Lee Yu, Kow-Liang Wen