Patents by Inventor Kow Siew TING

Kow Siew TING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface mount semiconductor device and method of manufacture
    Patent number: 11728179
    Abstract: A surface mount semiconductor device and method of manufacture. A semiconductor die is mounted on a first support surface; a leadframe is attached to the semiconductor die, the leadframe comprising: an electrical lead having a first lead region connected to the semiconductor die; and a second lead region distal the first lead region, wherein the second lead region is connected to a second support surface; encapsulating the semiconductor die, first support surface and the first lead region; the second lead region is severed from the second support surface to expose a lead end; and the second lead region is electro-plated with a metallic material, such that the lead end is coated with said metallic material.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: August 15, 2023
    Assignee: Nexperia B.V.
    Inventors: Ricardo Yandoc, Adam Richard Brown, Haibo Fan, Kow Siew Ting, Nam Khong Then, Wei Leong Tan
  • Surface Mount Semiconductor Device and Method of Manufacture
    Publication number: 20190067033
    Abstract: A surface mount semiconductor device and method of manufacture. A semiconductor die is mounted on a first support surface; a leadframe is attached to the semiconductor die, the leadframe comprising: an electrical lead having a first lead region connected to the semiconductor die; and a second lead region distal the first lead region, wherein the second lead region is connected to a second support surface; encapsulating the semiconductor die, first support surface and the first lead region; the second lead region is severed from the second support surface to expose a lead end; and the second lead region is electro-plated with a metallic material, such that the lead end is coated with said metallic material.
    Type: Application
    Filed: August 24, 2018
    Publication date: February 28, 2019
    Inventors: Ricardo YANDOC, Adam Richard BROWN, Haibo FAN, Kow Siew TING, Nam Khong THEN, Wei Leong TAN