Patents by Inventor Kowtilya Bijjula

Kowtilya Bijjula has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140120293
    Abstract: The present disclosure relates to the field of fabricating microelectronic devices, wherein a microelectronic device substrate, such as a microelectronic wafer, may be diced into individual microelectronic dice using an adhesive tape which reduces the potential of electrostatic discharge damage by the incorporation or anti-static, and may be compatible with a laser scribing process by the incorporation of ultraviolet light absorbing agents into an adhesive layer of the adhesive tape.
    Type: Application
    Filed: December 22, 2011
    Publication date: May 1, 2014
    Inventors: Mohit Gupta, Haiwei Lu, Dingying D. Xu, Ninad Patel, Kowtilya Bijjula, P. Erasenthiran Poonjolai