Patents by Inventor Koya Matsushita

Koya Matsushita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Shield flat cable and manufacturing method thereof
    Patent number: 7868254
    Abstract: A manufacturing method of a flat shield cable has a step of arranging a plurality of flat conductors including a ground line parallel with each other in one plane at a pitch P, a step of forming a flat cable by laminating a first insulating film on the flat conductors from both sides of an arrangement plane of the flat conductors, a step of laminating a shield layer on outside surfaces of the flat cable, and a step of electrically connecting the ground line to the shield layer. The manufacturing method further has a step of cutting the ground line at a portion other than in the conductor exposure portions and folding cutting portions of the ground line to outside the first insulating film before laminating the shield layer, and a step of electrically connecting only the folded ground line among the flat conductors to the shield layer.
    Type: Grant
    Filed: November 14, 2008
    Date of Patent: January 11, 2011
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Koya Matsushita, Tatsuo Matsuda, Ken Yanagida, Hideo Kobayashi
  • SHIELD FLAT CABLE AND MANUFACTURING METHOD THEREOF
    Publication number: 20090126972
    Abstract: A manufacturing method of a flat shield cable has a step of arranging a plurality of flat conductors including a ground line parallel with each other in one plane at a pitch P, a step of forming a flat cable by laminating a first insulating film on the flat conductors from both sides of an arrangement plane of the flat conductors, a step of laminating a shield layer on outside surfaces of the flat cable, and a step of electrically connecting the ground line to the shield layer. The manufacturing method further has a step of cutting the ground line at a portion other than in the conductor exposure portions and folding cutting portions of the ground line to outside the first insulating film before laminating the shield layer, and a step of electrically connecting only the folded ground line among the flat conductors to the shield layer.
    Type: Application
    Filed: November 14, 2008
    Publication date: May 21, 2009
    Inventors: Koya Matsushita, Tatsuo Matsuda, Ken Yanagida, Hideo Kobayashi