Patents by Inventor Koya Matsuura

Koya Matsuura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8084083
    Abstract: A method for manufacturing an anisotropic conductive adhesive sheet is disclosed. The sheet comprises at least a curing agent, a curable insulating resin, and conductive particles. The method comprises providing an adhesive layer on a biaxially stretchable film to form a laminate, densely packing conductive particles having an average particle size of 1 to 8 ?m on the laminate to form a conductive particle-attached film, biaxially stretching and holding the conductive particle-attached film so that the average particle distance between adjacent conductive particles is at least one to five times or less the average particle size of the conductive particles and not greater than 20 ?m. The conductive particles are transferred to an adhesive sheet containing at least a curing agent and a curable insulating resin and having a thickness of at least 1.5 times the average particle distance between the conductive particles but not greater than 40 ?m.
    Type: Grant
    Filed: January 18, 2011
    Date of Patent: December 27, 2011
    Assignee: Asahi Kasei EMD Corporation
    Inventors: Akira Otani, Koya Matsuura
  • Publication number: 20110114256
    Abstract: An anisotropic conductive adhesive sheet comprising at least a curing agent, a curable insulating resin and conductive particles, wherein in a region extending from a one-side surface of the anisotropic conductive adhesive sheet along the thickness direction to a position of not greater than 2.0 times the average diameter of the conductive particles, 90% or more of the sum of conductive particles are present, the 90% or more of the sum of conductive particles being present without contact with other conductive particles, and wherein the average diameter of conductive particles is in the range of 1 to 8 ?m, the average particle distance between adjacent conductive particles being in the range of 1 to 5 times the average particle diameter and not greater than 20 ?m, and wherein the thickness of the anisotropic conductive adhesive sheet is at least 1.5 times the average particle distance but not greater than 40 ?m.
    Type: Application
    Filed: January 18, 2011
    Publication date: May 19, 2011
    Applicant: ASAHI KASEI EMD CORPORATION
    Inventors: Akira OTANI, Koya MATSUURA
  • Publication number: 20070175579
    Abstract: An anisotropic conductive adhesive sheet comprising at least a curing agent, a curable insulating resin and conductive particles, wherein in a region extending from a one-side surface of the anisotropic conductive adhesive sheet along the thickness direction to a position of not greater than 2.0 times the average diameter of the conductive particles, 90% or more of the sum of conductive particles are present, the 90% or more of the sum of conductive particles being present without contact with other conductive particles, and wherein the average diameter of conductive particles is in the range of 1 to 8 ?m, the average particle distance between adjacent conductive particles being in the range of 1 to 5 times the average particle diameter and not greater than 20 ?m, and wherein the thickness of the anisotropic conductive adhesive sheet is at least 1.5 times the average particle distance but not greater than 40 ?m.
    Type: Application
    Filed: December 2, 2004
    Publication date: August 2, 2007
    Applicant: ASAHI KASEI EMD CORPORATION
    Inventors: Akira Otani, Koya Matsuura