Patents by Inventor KOYO HOSOKAWA

KOYO HOSOKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210233949
    Abstract: Deformation of a semiconductor chip is to be prevented in a semiconductor device in which a heat releasing plate and a circuit board are disposed. The semiconductor device includes the semiconductor chip, the circuit board, the heat releasing plate, an adhesive member, and a conductive member. The circuit board transmits a signal of the semiconductor chip. The heat releasing plate has the semiconductor chip disposed thereon, and has an opening in a region on the outer side of a semiconductor chip placement region that is a region in which the semiconductor chip is disposed. The adhesive member is disposed in a region on the outer side of the opening on a different surface of the heat releasing plate from the surface on which the semiconductor chip is disposed, and bonds the circuit board and the heat releasing plate to each other. The conductive member connects the semiconductor chip and the circuit board to each other via the opening.
    Type: Application
    Filed: June 21, 2019
    Publication date: July 29, 2021
    Inventors: DAISUKE CHINO, HIROYUKI SHIGETA, SHIGEKAZU ISHII, KOYO HOSOKAWA, HIROHISA YASUKAWA, MITSUHITO KANATAKE, KOSUKE HAREYAMA, YUTAKA OOTAKI, KIYOHISA SAKAI, ATSUSHI TSUKADA, HIROTAKA KOBAYASHI, NINAO SATO, YUKI YAMANE
  • Publication number: 20200321228
    Abstract: [Object] Provided is a method of manufacturing a lead frame capable of forming connection terminals in a plurality of rows around a circuit chip without requiring a complex manufacturing process and many processes. [Solving Means] The method of manufacturing a lead frame includes attaching a tape member to a lead frame member including at least a lead frame rim. A lead frame part including at least one of a die pad or a connection terminal is mounted on the tape member in the lead frame rim.
    Type: Application
    Filed: April 26, 2017
    Publication date: October 8, 2020
    Inventors: KOYO HOSOKAWA, HIROSHI OZAKI