Patents by Inventor Koyo KOBORI

Koyo KOBORI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroconductive adhesive composition
    Patent number: 11401446
    Abstract: An object of the present invention is to provide an electroconductive adhesive composition which has excellent thermal conductivity and which, even when repeatedly undergoing fluctuations in temperature, is less apt to cause adherend separation. The present invention relates to an electroconductive adhesive composition which contains: an electroconductive filler (A) containing metal particles (a1) having an average particle diameter of 0.5-10 ?m and silver particles (a2) having an average particle diameter of 10-200 nm; and particles (B) of a thermoplastic resin which is solid at 25° C.
    Type: Grant
    Filed: July 10, 2018
    Date of Patent: August 2, 2022
    Assignee: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Koyo Kobori, Yoshito Imai, Shintaroh Abe, Takeshi Kondo
  • ELECTROCONDUCTIVE ADHESIVE COMPOSITION
    Publication number: 20210317342
    Abstract: An object of the present invention is to provide an electroconductive adhesive composition which has excellent thermal conductivity and which, even when repeatedly undergoing fluctuations in temperature, is less apt to cause adherend separation. The present invention relates to an electroconductive adhesive composition which contains: an electroconductive filler (A) containing metal particles (a1) having an average particle diameter of 0.5-10 ?m and silver particles (a2) having an average particle diameter of 10-200 nm; and particles (B) of a thermoplastic resin which is solid at 25° C.
    Type: Application
    Filed: July 10, 2018
    Publication date: October 14, 2021
    Applicant: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Koyo KOBORI, Yoshito IMAI, Shintaroh ABE, Takeshi KONDO
  • ELECTROCONDUCTIVE ADHESIVE COMPOSITION
    Publication number: 20190136099
    Abstract: The present invention is to provide an electroconductive adhesive composition which contains a thermoplastic resin and has high heat dissipation properties and which is inhibited from suffering the bleeding-out phenomenon in which a nonpolar solvent undesirably bleeds out after die bonding. The present invention relates to an electroconductive adhesive composition including (A) electroconductive particles, (B) a thermoplastic resin, (C) a nonpolar solvent, and (D) a water-insoluble fluorochemical surfactant.
    Type: Application
    Filed: March 28, 2018
    Publication date: May 9, 2019
    Inventors: Koyo KOBORI, Yoshito IMAI, Shintaro ABE, Takeshi KONDO