Patents by Inventor Koyu Ota

Koyu Ota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper powder for conductive paste and conductive paste
    Patent number: 8383015
    Abstract: Copper powder is provided, which, while having fine granularity and resistance to oxidation, does not lose either resistance to oxidation or balance in conductivity, and furthermore, copper powder for conductive paste in which variations in shape and granularity are small and having a low concentration in oxygen content. The copper powder for conductive paste contains 0.05 to 10 atomic % Bi inside each particle.
    Type: Grant
    Filed: August 23, 2010
    Date of Patent: February 26, 2013
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Koyu Ota, Makoto Sekiguchi, Katsuhiko Yoshimaru
  • Copper powder for conductive paste and conductive paste
    Patent number: 8377338
    Abstract: Copper powder is provided, which, while having fine granularity, does not loose either resistance to oxidation or balance in conductivity, and furthermore, copper powder for conductive paste in which variations in shape and granularity are small and having a low concentration in oxygen content. The copper powder for conductive paste contains 0.07 to 10 atomic % Al inside each copper particle in the powder.
    Type: Grant
    Filed: October 14, 2010
    Date of Patent: February 19, 2013
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Koyu Ota, Touru Kurimoto, Yoshiaki Uwazumi, Koichi Miyake, Katsuhiko Yoshimaru
  • COPPER POWDER FOR CONDUCTIVE PASTE AND CONDUCTIVE PASTE
    Publication number: 20110095239
    Abstract: Copper powder is provided, which, while having fine granularity and resistance to oxidation, does not lose either resistance to oxidation or balance in conductivity, and furthermore, copper powder for conductive paste in which variations in shape and granularity are small and having a low concentration in oxygen content. The copper powder for conductive paste contains 0.05 to 10 atomic % Bi inside each particle.
    Type: Application
    Filed: August 23, 2010
    Publication date: April 28, 2011
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Koyu Ota, Makoto Sekiguchi, Katsuhiko Yoshimaru
  • Copper Powder for Conductive Paste and Conductive Paste
    Publication number: 20110031448
    Abstract: Copper powder is provided, which, while having fine granularity, does not loose either resistance to oxidation or balance in conductivity, and furthermore, copper powder for conductive paste in which variations in shape and granularity are small and having a low concentration in oxygen content. The copper powder for conductive paste contains 0.07 to 10 atomic % Al inside each copper particle in the powder.
    Type: Application
    Filed: October 14, 2010
    Publication date: February 10, 2011
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Koyu Ota, Touru Kurimoto, Yoshiaki Uwazumi, Koichi Miyake, Katsuhiko Yoshimaru