Patents by Inventor Koyuki SAKAI

Koyuki SAKAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230295417
    Abstract: A resin composition for a flexible device, containing an epoxy resin and a phenoxy resin, wherein a cured product of the resin composition has a glass transition temperature of 60° C. or higher, and the cured product has a storage modulus of 5.0 GPa or less, a film-like adhesive using the resin composition, an adhesive sheet having a laminated structure of the film-like adhesive and a flexible base material, and a method of producing a flexible device.
    Type: Application
    Filed: May 30, 2023
    Publication date: September 21, 2023
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventor: Koyuki SAKAI
  • Publication number: 20230295470
    Abstract: A base material/adhesive layer integrated sheet for a flexible device, containing a flexible film and an adhesive layer, in which the flexible film and the adhesive layer are laminated, an absolute value of a difference between surface free energy of the flexible film and surface free energy of a cured layer obtained by curing the adhesive layer is 30 dyn/cm or less, and the cured layer has a storage modulus of 5.0 GPa or less; and a method of producing a flexible device with the same.
    Type: Application
    Filed: May 30, 2023
    Publication date: September 21, 2023
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Koyuki SAKAI, Kenji TOKUHISA
  • Publication number: 20220186095
    Abstract: A transparent adhesive composition including an epoxy resin (A), an epoxy resin-curing agent (B), and a phenoxy resin (C), wherein the epoxy resin-curing agent (B) satisfies the following (1) and (2): (1) the epoxy resin-curing agent (B) is in a powdery form and has a particle diameter (d90) at 90% cumulative distribution frequency of 2.0 ?m or less; and (2) the epoxy resin-curing agent (B) has solubility in 100 g of methyl ethyl ketone at 25° C. of 0.1 g or less; a film-shaped transparent adhesive processed therefrom; a method of producing a transparent adhesive cured layer-attached member by using the film-shaped transparent adhesive; a method of producing an electronic component; and an electronic component.
    Type: Application
    Filed: March 3, 2022
    Publication date: June 16, 2022
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Minoru MORITA, Koyuki SAKAI, Keita WATAHIKI