Abstract: A film adhesive containing: an epoxy resin (A); an epoxy resin curing agent (B); and a phenoxy resin (C), wherein a content of the epoxy resin curing agent (B) in the film adhesive is 0.30 to 12.0 mass %; and wherein a light transmittance T1 of the film adhesive at a wavelength of 400 nm is 90% or less, a light transmittance T2 of a cured product obtained by thermally curing the film adhesive at a wavelength of 400 nm is 85% or more, and T1<T2 is satisfied.

Abstract: A resin composition for a flexible device, containing an epoxy resin and a phenoxy resin, wherein a cured product of the resin composition has a glass transition temperature of 60° C. or higher, and the cured product has a storage modulus of 5.0 GPa or less, a film-like adhesive using the resin composition, an adhesive sheet having a laminated structure of the film-like adhesive and a flexible base material, and a method of producing a flexible device.

Abstract: A base material/adhesive layer integrated sheet for a flexible device, containing a flexible film and an adhesive layer, in which the flexible film and the adhesive layer are laminated, an absolute value of a difference between surface free energy of the flexible film and surface free energy of a cured layer obtained by curing the adhesive layer is 30 dyn/cm or less, and the cured layer has a storage modulus of 5.0 GPa or less; and a method of producing a flexible device with the same.

Abstract: A transparent adhesive composition including an epoxy resin (A), an epoxy resin-curing agent (B), and a phenoxy resin (C), wherein the epoxy resin-curing agent (B) satisfies the following (1) and (2): (1) the epoxy resin-curing agent (B) is in a powdery form and has a particle diameter (d90) at 90% cumulative distribution frequency of 2.0 ?m or less; and (2) the epoxy resin-curing agent (B) has solubility in 100 g of methyl ethyl ketone at 25° C. of 0.1 g or less; a film-shaped transparent adhesive processed therefrom; a method of producing a transparent adhesive cured layer-attached member by using the film-shaped transparent adhesive; a method of producing an electronic component; and an electronic component.