Patents by Inventor Kozaburo Hayashi

Kozaburo Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6200583
    Abstract: Antimicrobial agents comprise 2,2,6,6-tetramethyl-4-piperidine derivatives. When added to resins, these antimicrobial agents provide antimicrobial resin compositions, which in turn provide antimicrobial articles. These antimicrobial agents provide resins, synthetic fibers or the like with not only outstanding antimicrobial activity but also excellent heat resistance, weatherability and deterioration resistance without impairing the transparency and safety of these materials.
    Type: Grant
    Filed: March 18, 1999
    Date of Patent: March 13, 2001
    Assignee: Dainichiseika Color & Chemicals Mfg. Co., Ltd.
    Inventors: Masayuki Sibata, Kozaburo Hayashi, Akira Hoshino
  • Patent number: 6171673
    Abstract: The present invention provides a protective film with high mechanical strength free from dust. A protective film 14 of an optical recording medium 2 is formed by applying and curing a composition for protective films obtained by dispersing in a curable binder material a first lubricant compatible with said binder material and a second lubricant incompatible with said binder material but compatible with said first lubricant. The incompatible second lubricant is stably and homogeneously dispersed to enhance lubricity and slidability while any excessive amount of the lubricant does not deposit on the surface of the protective film. The binder material is desirably photocurable.
    Type: Grant
    Filed: May 28, 1999
    Date of Patent: January 9, 2001
    Assignee: Sony Chemicals Corp.
    Inventors: Mieko Tanaka, Hiraku Kominami, Kozaburo Hayashi
  • Patent number: 6121339
    Abstract: An epoxy resin composition according to the present invention is one initiating cationic polymerization upon irradiation with energy rays. The epoxy resin composition is formed of at least bisphenol epoxy resin (A) as an active ingredient, epoxy resin (B) shown in the following formula and cationic polymerization catalyst (C).
    Type: Grant
    Filed: February 12, 1998
    Date of Patent: September 19, 2000
    Assignee: Sony Chemicals Corporation
    Inventors: Hiraku Kominami, Kozaburo Hayashi, Kazuki Shibata