Patents by Inventor Kozaburou Yano

Kozaburou Yano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6946029
    Abstract: An inexpensive sheet with excellent evenness and a desired uniform thickness can be obtained by cooling a base having protrusions, dipping the surfaces of the protrusions of the cooled base into a melt material containing at least one of a metal material and a semiconductor material for crystal growth of the material on the surfaces of the protrusions. In addition, by rotating a roller having on its peripheral surface protrusions and a cooling portion for cooling said protrusions, the surfaces of the cooled protrusions can be dipped into a melt material containing at least one of a metal material and a semiconductor material for crystal growth of the material on the surfaces of the protrusions. Thus, a sheet with a desired uniform thickness can be obtained without slicing process.
    Type: Grant
    Filed: February 25, 2004
    Date of Patent: September 20, 2005
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Yoshihiro Tsukuda, Hiroshi Taniguchi, Kozaburou Yano, Kazuto Igarashi, Hidemi Mitsuyasu, Tohru Nunoi
  • Publication number: 20040175192
    Abstract: An inexpensive sheet with excellent evenness and a desired uniform thickness can be obtained by cooling a base having protrusions, dipping the surfaces of the protrusions of the cooled base into a melt material containing at least one of a metal material and a semiconductor material for crystal growth of the material on the surfaces of the protrusions. In addition, by rotating a roller having on its peripheral surface protrusions and a cooling portion for cooling said protrusions, the surfaces of the cooled protrusions can be dipped into a melt material containing at least one of a metal material and a semiconductor material for crystal growth of the material on the surfaces of the protrusions. Thus, a sheet with a desired uniform thickness can be obtained without slicing process.
    Type: Application
    Filed: February 25, 2004
    Publication date: September 9, 2004
    Applicant: Sharp Kabushiki Kaisha
    Inventors: Yoshihiro Tsukuda, Hiroshi Taniguchi, Kozaburou Yano, Kazuto Igarashi, Hidemi Mitsuyasu, Tohru Nunoi
  • Publication number: 20030111105
    Abstract: An inexpensive sheet with excellent evenness and a desired uniform thickness can be obtained by cooling a base having protrusions, dipping the surfaces of the protrusions of the cooled base into a melt material containing at least one of a metal material and a semiconductor material for crystal growth of the material on the surfaces of the protrusions. In addition, by rotating a roller having on its peripheral surface protrusions and a cooling portion for cooling said protrusions, the surfaces of the cooled protrusions can be dipped into a melt material containing at least one of a metal material and a semiconductor material for crystal growth of the material on the surfaces of the protrusions. Thus, a sheet with a desired uniform thickness can be obtained without slicing process.
    Type: Application
    Filed: December 20, 2002
    Publication date: June 19, 2003
    Applicant: Sharp Kabushiki Kaisha
    Inventors: Yoshihiro Tsukuda, Hiroshi Taniguchi, Kozaburou Yano, Kazuto Igarashi, Hidemi Mitsuyasu, Tohru Nunoi
  • Patent number: 6521827
    Abstract: An inexpensive sheet with excellent evenness and a desired uniform thickness can be obtained by cooling a base having protrusions, dipping the surfaces of the protrusions of the cooled base into a melt material containing at least one of a metal material and a semiconductor material for crystal growth of the material on the surfaces of the protrusions. In addition, by rotating a roller having on its peripheral surface protrusions and a cooling portion for cooling said protrusions, the surfaces of the cooled protrusions can be dipped into a melt material containing at least one of a metal material and a semiconductor material for crystal growth of the material on the surfaces of the protrusions. Thus, a sheet with a desired uniform thickness can be obtained without slicing process.
    Type: Grant
    Filed: November 29, 2000
    Date of Patent: February 18, 2003
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Yoshihiro Tsukuda, Hiroshi Taniguchi, Kozaburou Yano, Kazuto Igarashi, Hidemi Mitsuyasu, Tohru Nunoi
  • Publication number: 20010044163
    Abstract: An inexpensive sheet with excellent evenness and a desired uniform thickness can be obtained by cooling a base having protrusions, dipping the surfaces of the protrusions of the cooled base into a melt material containing at least one of a metal material and a semiconductor material for crystal growth of the material on the surfaces of the protrusions. In addition, by rotating a roller having on its peripheral surface protrusions and a cooling portion for cooling said protrusions, the surfaces of the cooled protrusions can be dipped into a melt material containing at least one of a metal material and a semiconductor material for crystal growth of the material on the surfaces of the protrusions. Thus, a sheet with a desired uniform thickness can be obtained without slicing process.
    Type: Application
    Filed: November 29, 2000
    Publication date: November 22, 2001
    Inventors: Yoshihiro Tsukuda, Hiroshi Taniguchi, Kozaburou Yano, Kazuto Igarashi, Hidemi Mitsuyasu, Tohru Nunoi