Patents by Inventor Kozo Fukuzawa

Kozo Fukuzawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of mounting a BGA
    Patent number: 6735857
    Abstract: Solder paste is applied beforehand onto through-hole upper lands (or solder) of a printed circuit board and attachment is effected by inserting solder joined to the BGA-side pads into the holes of the through-hole upper lands; solder and solder paste are then melted by heating, causing them to flow into the through-holes and to wet and spread out upon the through-hole bottom face lands, thereby effecting a soldered joint with the BGA-side pads and through-hole upper lands securely attached, and forming solder fillets. In this way, the quality of the solder joints can be ascertained by an ordinary external inspection method.
    Type: Grant
    Filed: August 17, 2001
    Date of Patent: May 18, 2004
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yuji Saito, Kozo Fukuzawa
  • Method of mounting a BGA
    Publication number: 20020020058
    Abstract: Solder paste is applied beforehand onto through-hole upper lands (or solder) of a printed circuit board and attachment is effected by inserting solder joined to the BGA-side pads into the holes of the through-hole upper lands; solder and solder paste are then melted by heating, causing them to flow into the through-holes and to wet and spread out upon the through-hole bottom face lands, thereby effecting a soldered joint with the BGA-side pads and through-hole upper lands securely attached, and forming solder fillets. In this way, the quality of the solder joints can be ascertained by an ordinary external inspection method.
    Type: Application
    Filed: August 17, 2001
    Publication date: February 21, 2002
    Inventors: Yuji Saito, Kozo Fukuzawa