Patents by Inventor Kozo Ishihara

Kozo Ishihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8288458
    Abstract: An aggregate of functional particles includes a plurality of functional particles and an insulating material for covering the plurality of functional particles, and a large number of aggregates of functional particles are filled in a resin. Alternatively, insulating functional particles are added to the plurality of functional particles by an amount less than 50% of that of the functional particles in volume ratio.
    Type: Grant
    Filed: March 28, 2005
    Date of Patent: October 16, 2012
    Assignee: Nippon Kagaku Yakin Co., Ltd.
    Inventors: Kiyotaka Matsukawa, Kozo Ishihara, Kazuhiro Masano, Toshikazu Tanaka
  • Patent number: 7785424
    Abstract: Magnetic powder contained in a resin composition for use in injection molding is coated with an insulating material, and a soft magnetic green compact or a hard magnetic green compact is insert molded into the resin composition. Increased magnetic flux destiny, reduced size, a simplified shape, and/or increased filling density can be achieved in a core part of an electric instrument.
    Type: Grant
    Filed: August 23, 2005
    Date of Patent: August 31, 2010
    Assignee: Nippon Kagaku Yakin Co., Ltd.
    Inventors: Kiyotaka Matsukawa, Kozo Ishihara, Kazuo Ishikawa, Tomohiro Toyoda, Toshikazu Tanaka
  • Patent number: 7390567
    Abstract: A soft magnetic compact which is produced by using soft magnetic composite powder in which the surface of magnetic powder is covered with an electrical insulating material containing at least an inorganic insulating material, and a resin material is fusion-bonded to the surface of the inorganic insulating material so as to partially cover the surface of the soft magnetic powder. Accordingly, it is possible to ensure an electrical insulating property between pieces of soft magnetic material powder to secure a good magnetic characteristics and to easily mold a compact.
    Type: Grant
    Filed: April 22, 2004
    Date of Patent: June 24, 2008
    Assignee: Nippon Kagaku Yakin Co., Ltd.
    Inventors: Kiyotaka Matsukawa, Kozo Ishihara, Ikuo Uemoto, Masafumi Taniguchi
  • Publication number: 20080035879
    Abstract: An aggregate of functional particles includes a plurality of functional particles and an insulating material for covering the plurality of functional particles, and a large number of aggregates of functional particles are filled in a resin. Alternatively, insulating functional particles are added to the plurality of functional particles by an amount less than 50% of that of the functional particles in volume ratio.
    Type: Application
    Filed: March 28, 2005
    Publication date: February 14, 2008
    Inventors: Kiyotaka Matsukawa, Kozo Ishihara, Kazuhiro Masano, Toshikazu Tanaka
  • Publication number: 20070256759
    Abstract: Magnetic powder contained in a resin composition for use in injection molding is coated with an insulating material, and a soft magnetic green compact or a hard magnetic green compact is insert molded into the resin composition.
    Type: Application
    Filed: August 23, 2005
    Publication date: November 8, 2007
    Inventors: Kiyotaka Matsukawa, Kozo Ishihara, Kazuo Ishikawa, Tomohiro Toyoda, Toshikazu Tanaka
  • Publication number: 20060165985
    Abstract: A soft magnetic compact which is produced by using soft magnetic composite powder in which the surface of magnetic powder is covered with an electrical insulating material containing at least an inorganic insulating material, and a resin material is fusion-bonded to the surface of the inorganic insulating material so as to partially cover the surface of the soft magnetic powder. Accordingly, it is possible to ensure an electrical insulating property between pieces of soft magnetic material powder to secure a good magnetic characteristics and to easily mold a compact.
    Type: Application
    Filed: April 22, 2004
    Publication date: July 27, 2006
    Inventors: Kiyotaka Matsukawa, Kozo Ishihara, Ikuo Uemoto, Masafumi Taniguchi
  • Patent number: 6995205
    Abstract: A resin composition having high thermal conductivity and excellent moldability and a method of producing the same is provided. The composition includes 40 vol % or more of a matrix resin, 10 to 55 vol % of a thermally conductive filler dispersed in the matrix resin and the balance of a low-melting point alloy connecting the thermally conductive filler to each other and having a melting point not higher than 500° C. The proportion of the volume ratio of the low-melting point alloy to that of the thermally conductive filler is set in a range from 1/30 to 3/1.
    Type: Grant
    Filed: August 27, 2002
    Date of Patent: February 7, 2006
    Assignees: Nippon Kagaku Yakin Co., Ltd., Osaka Municipal Government
    Inventors: Kiyotaka Matsukawa, Kozo Ishihara, Tsuneo Kamiyahata, Yoshikazu Inada, Yasuyuki Agari, Masayuki Shimada
  • Publication number: 20040204526
    Abstract: A resin composition having high thermal conductivity and excellent moldability and a method of producing the same is provided. The composition includes 40 vol % or more of a matrix resin, 10 to 55 vol % of a thermally conductive filler dispersed in the matrix resin and the balance of a low-melting point alloy connecting the thermally conductive filler to each other and having a melting point not higher than 500° C. The proportion of the volume ratio of the low-melting point alloy to that of the thermally conductive filler is set in a range from 1/30 to 3/1.
    Type: Application
    Filed: March 25, 2004
    Publication date: October 14, 2004
    Inventors: Kiyotaka Matsukawa, Kozo Ishihara, Tsuneo Kamiyahata, Yoshikazu Inada, Yasuyuki Agari, Masayuki Shimada