Patents by Inventor Kozo Morita
Kozo Morita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220256223Abstract: An information processing apparatus according to the present disclosure includes: a generator configured to generate control information to be used to perform light emission control of a light-emitting unit provided in an operation terminal; and a transmitter configured to transmit the control information to the operation terminal.Type: ApplicationFiled: May 21, 2020Publication date: August 11, 2022Inventors: NATSUKI ISHIMOTO, TARO SUNADA, SATOSHI YAMADA, YUSUKE AOSHIMA, KOZO MORITA, NAOKI SAITO
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Patent number: 7728710Abstract: An electronic component substrate (1-1) includes an insulating base (10) and a flexible circuit board (20) mounted on the insulating base (10). The flexible circuit board (20) is a synthetic resin film provided thereon with terminal patterns (29) and a conductor pattern (25) whose surface is slidingly contacted with a slider. The insulating base (10) is a synthetic resin molded piece. The flexible circuit board (20) is insert-molded to the insulating base (10). The electronic component substrate (1-1) is produced by preparing the flexible circuit board (20) and first and second mold members (41, 45) having a cavity (C1) with a shape that corresponds to the external shape of the electronic component substrate (1-1). Then, the flexible circuit board (20) is accommodated in the cavity (C1) between the first and second mold members (41,45), and the cavity (C1) is filled with a molten molding resin. After the molding resin has solidified, the first and second mold members (41, 45) are removed.Type: GrantFiled: February 5, 2004Date of Patent: June 1, 2010Assignee: Teikoku Tsushin Kogyo Co., Ltd.Inventors: Shinji Mizuno, Koji Mitsui, Katsutoshi Yanoshita, Shinichi Suzuki, Takashi Shinoki, Kazutaka Nakagome, Naoki Fukuda, Kozo Morita, Daisuke Makino
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Publication number: 20090318632Abstract: An insulating polymer material composition is obtained by adequately adding a curing agent, a curing accelerator or the like to an epoxidized vegetable oil (such as an epoxidizable vegetable oil and fat which is an ester of glycerin and a fatty acid having a double bond portion therein), and heating and three-dimensionally crosslinking the resulting. As the curing agent, the curing accelerator or the like, those used for petroleum-derived polymer materials such as epoxy resins can be used. This polymer material composition is applied to, for example, insulating structures for high-voltage devices including a switching device such as a circuit breaker or disconnector in the casing.Type: ApplicationFiled: August 2, 2007Publication date: December 24, 2009Applicant: MEIDENSHA CORPORATIONInventors: Yasuyuki Kurata, Kozo Morita, Takehiro Mizuno
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Publication number: 20060040094Abstract: An electronic component substrate 1-1 includes an insulating base 10 and a flexible circuit board 20 mounted on the insulating base 10. The flexible circuit board 20 is a synthetic resin film provided thereon with terminal patterns 29 and a conductor pattern 25 whose surface is slidingly contacted with a slider. The insulating base 10 is a synthetic resin molded piece. The flexible circuit board 20 is insert-molded to the insulating base 10. The electronic component substrate 1-1 is produced by preparing the flexible circuit board 20 and first and second mold members 41 and 45 having a cavity C1 with a shape that corresponds to the external shape of the electronic component substrate 1-1. Then, the flexible circuit board 20 is accommodated in the cavity C1 between the first and second mold members 41 and 45, and a molten molding resin is filled into the cavity C1. After the filled molding resin has been solidified, the first and second mold members 41 and 45 are removed.Type: ApplicationFiled: February 5, 2004Publication date: February 23, 2006Inventors: Shinji Mizuno, Koji Mitsui, Katsutoshi Yanoshita, Shinichi Suzuki, Takashi Shinoki, Kazutaka Nakagawa, Naoki Fukuda, Kozo Morita, Daisuke Makino
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Patent number: 6388211Abstract: A substrate (10), a first mold (200) and a second mold (250) are prepared, and a plurality of switch patterns (14), (18) are provided by providing openings (pattern-removal portions) (A) in such a manner that a pattern (11), which has been formed on the surface of the substrate (10), is divided into a plurality of patterns to form A switch substrate. Next, the switch substrate (1) is clamped between the first mold (200) and the second mold (250). At such time, the side of the switch substrate (1) provided with the switch patterns (14), (18) is brought into surface contact with an abutting surface (201) of the first mold (200) and, at the same time, a cavity (253) provided in the second mold (250) opposes the other side of the switch substrate. Next, a molten molding resin is charged into the cavity (253) provided in the second mold (250) to thereby fill the cavity (253) and the openings (A) of the substrate with the molding resin.Type: GrantFiled: December 23, 1999Date of Patent: May 14, 2002Assignee: Teikoku Tsushin Kogyo Co., Ltd.Inventors: Osamu Nomura, Nobuyuki Yagi, Kozo Morita
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Patent number: 5794766Abstract: A rotary switch includes a contact forming member including a switch contact and a land contact and an elastic plate including a base portion mounted on the land contact and an abutment portion disposed above the switch contact. A rotor is disposed above the elastic plate for pivotal movement and includes depresser portions provided in the lower surface of the rotor for depressing the elastic plate. When the rotor is rotated, the depresser portions of the rotor cause the elastic plate to be depressed, so that the abutment portion is engaged with the switch contact.The contact forming member may be constructed by forming the switch contact and the land contact on a circuit substrate.The contact forming member may be constructed by a metal plate on which the switch contact is formed, a metal plate on which the land contact is formed, and a stationary member on which the metal plates are secured.Type: GrantFiled: August 8, 1996Date of Patent: August 18, 1998Assignee: Teikoku Tsushin Kogyo Co., Ltd.Inventors: Kozo Morita, Shigeaki Kinoshita, Katsuyuki Tame, Osamu Nomura
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Patent number: 5479443Abstract: A digital radio-relay system has a transmitting terminal station, at least one repeater station a receiving terminal station, a non-regenerative repeater station which does not regenerate a digital signal in order to simplify and reduce cost of the system, while keeping excellent signal quality in transmission. Each repeater station has a plurality of sub-units relating to respective sub-system signals each having a plurality of carriers so that the frequency spectrum of each sub-system signal is allocated on a frequency axis based upon a frequency division multiplex system.Type: GrantFiled: October 8, 1993Date of Patent: December 26, 1995Assignee: Nippon Telegraph and Telephone CorporationInventors: Osamu Kagami, Kazuji Watanabe, Kozo Morita
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Patent number: 5111363Abstract: A mount for electronic parts includes a flexible board made of a thermoplastic resin film and having electrically conductive patterns formed thereon, and an electrically conductive bonding agent for bonding terminals of the electronic parts to the conductive patterns. Some or all of the electronic parts to be mounted are resin-molded to the flexible board so as to be integrated therewith.Type: GrantFiled: June 12, 1989Date of Patent: May 5, 1992Assignee: Teikoku Tsushin Kogyo Co., Ltd.Inventors: Nobuyuki Yagi, Jiroh Inagaki, Kozo Morita, Yosutoshi Kaku, Shinji Mizuno, Akiko Yamanaka
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Patent number: 5071611Abstract: A molded resin casing of an electronic part equipped with a flat cable and internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part. A flexible board having various electric conductor patterns formed on a synthetic resin film is used as the board, the flexible board is formed integral with a flat cable including a synthetic resin film on which are formed electric conductor patterns electrically connected to the aforementioned various electric conductor patterns, and when the molded resin casing is molded by injecting a molten synthetic resin, the flexible board is inserted in such a manner that the electric conductor patterns are exposed within the casing, thereby integrating the flexible board and synthetic resin casing, with the flat cable extending outwardly from a side portion of the synthetic resin casing.Type: GrantFiled: December 7, 1989Date of Patent: December 10, 1991Assignee: Teikoku Tsuhin Kogyo Co., Ltd.Inventors: Nobuyuki Yagi, Jiroh Inagaki, Kozo Morita, Yasutoshi Kaku, Nobuyuki Kikuchi, Shinji Mizuno
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Patent number: 4978491Abstract: Disclosed is a molded resin casing of a rotary- or sliding-type electronic part internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part, wherein a flexible board having the electric conductor patterns formed on a film comprising a synthetic resin material is used as the board, and the flexible board is inserted inside the synthetic resin casing in such a manner that the electric conductor patterns are exposed to the interior of the casing.Type: GrantFiled: September 13, 1988Date of Patent: December 18, 1990Assignee: Teikoku Tsushin Kogyo Co., Ltd.Inventors: Nobuyuki Yagi, Jiroh Inagaki, Kozo Morita, Yasutoshi Kaku, Nobuyuki Kikuchi, Shinji Mizuno
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Patent number: 4935718Abstract: A molded resin casing of a rotary- or sliding-type electronic part internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part, wherein a flexible board having the electric conductor patterns formed on a film comprising a synthetic resin material is used as the board, and the flexible board is inserted inside the synthetic resin casing in such as manner that the electric conductor patterns are exposed to the interior of the casing.Type: GrantFiled: August 22, 1988Date of Patent: June 19, 1990Assignee: Teikoku Tsushin Kogyo Co., Ltd.Inventors: Nobuyuki Yagi, Jiroh Inagaki, Kozo Morita, Yasutoshi Kaku, Nobuyuki Kikuchi, Shinji Mizuno
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Patent number: 4928082Abstract: A molded resin casing of an electronic part equipped with a flexible flat cable and internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part, includes a flexible board having various electric conductor patterns formed on a synthetic resin film used as the board. The flexible board is formed integrally with a flexible flat cable comprising a synthetic resin film on which are formed electric conductor patterns electrically connected to the aforementioned various electric conductor patterns. When the molded resin casing is molded by injecting a molten synthetic resin, the flexible board is inserted in such a manner that the electric conductor patterns are exposed within the casing, thereby integrating the flexible board and synthetic resin casing, with the flexible flat cable extending outwardly from a side portion of the synthetic resin casing.Type: GrantFiled: August 22, 1988Date of Patent: May 22, 1990Assignee: Teikoku Tsushin Kogyo Co., Ltd.Inventors: Nobuyuki Yagi, Jiro Inagaki, Kozo Morita, Yasutoshi Kaku, Nobuyuki Kikuchi, Shinji Mizuno
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Patent number: 4251783Abstract: A variable resistance device in the form of a PIN diode is connected between one of a pair of input terminals and one of a pair of output terminals, and the other input and output terminals are connected to a common terminal.A distributed constant line is connected between the output terminal of the PIN diode and the common terminal, and variable capacitance diodes are connected between the opposite ends of the distributed constant line and the common terminal. By applying a control voltage applied to the PIN diode and the variable capacitance diodes, the steepness and the center frequency of the variable resistance device are varied.Type: GrantFiled: April 4, 1979Date of Patent: February 17, 1981Assignees: Nippon Electric Co., Ltd., Nippon Telegraph and Telephone Public CorporationInventors: Takahiko Yamada, Kozo Morita