Patents by Inventor Kozo Nomura

Kozo Nomura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire electric discharge machining apparatus
    Patent number: 8642915
    Abstract: An object is to enable highly accurate machining by correcting machining conditions by referring to a programmed trajectory to obtain a desired machining shape. A wire electric discharge machining apparatus includes a machining-condition correcting unit that corrects machining conditions in each machining stage corresponding to a circular arc radius of a portion corresponding to a corner portion of a programmed trajectory, in the corner portion formed by changing a direction of relatively moving a wire electrode, when the wire electrode is moved on a wire center trajectory, which is offset from the programmed trajectory prestored in order to obtain a desired machining shape to perform finish machining in each machining stage with an offset amount being changed.
    Type: Grant
    Filed: October 29, 2008
    Date of Patent: February 4, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yasuo Onodera, Takashi Yuzawa, Kozo Nomura
  • WIRE ELECTRIC DISCHARGE MACHINING APPARATUS
    Publication number: 20110226742
    Abstract: An object is to enable highly accurate machining by correcting machining conditions by referring to a programmed trajectory to obtain a desired machining shape. A wire electric discharge machining apparatus includes a machining-condition correcting unit that corrects machining conditions in each machining stage corresponding to a circular arc radius of a portion corresponding to a corner portion of a programmed trajectory, in the corner portion formed by changing a direction of relatively moving a wire electrode, when the wire electrode is moved on a wire center trajectory, which is offset from the programmed trajectory prestored in order to obtain a desired machining shape to perform finish machining in each machining stage with an offset amount being changed.
    Type: Application
    Filed: October 29, 2008
    Publication date: September 22, 2011
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yasuo Onodera, Takashi Yuzawa, Kozo Nomura
  • Process for peeling protective film off a thin article
    Patent number: 4775438
    Abstract: A process for peeling a protective film off a thin article such as a silicon wafer is proposed. The film is peeled by sticking an adhesive tape to the protective film on the article and pulling it away from the article. The protective film is peeled only by the adhesive force of the adhesive tape.
    Type: Grant
    Filed: October 7, 1986
    Date of Patent: October 4, 1988
    Assignee: Nitto Electric Industrial Co., Ltd.
    Inventors: Keigo Funakoshi, Kozo Nomura, Minoru Ametani, Kenji Ohnishi