Abstract: A part feeding device of the present disclosure includes a main body; a conveyor; and a part detector. At a position further upstream than the part detector, the transporting passage includes a guide surface for guiding the lower surface of the part feeding tape, and a ceiling surface which faces the guide surface and is positioned at a position upwardly apart from the guide surface by the dimension larger than the thickness of the part feeding tape having the maximum thickness to be used in the part feeding device. The transporting passage includes a partial guide surface which supports the lower surface of the part feeding tape, and the partial guide surface includes an approaching portion approaching a ceiling surface in a downstream direction.

Abstract: A part feeding device of the present disclosure includes a main body; a conveyor; and a part detector. At a positon further upstream than the part detector, the transporting passage includes a guide surface for guiding the lower surface of the part feeding tape, and a ceiling surface which faces the guide surface and is positioned at a position upwardly apart from the guide surface by the dimension larger than the thickness of the part feeding tape having the maximum thickness to be used in the part feeding device. The transporting passage includes a partial guide surface which supports the lower surface of the part feeding tape, and the partial guide surface includes an approaching portion approaching a ceiling surface in a downstream direction.

Abstract: The pressing tool and the ACF tape cutting device are linked and connected with each other by a link device, and the forcing member is caused to move relatively towards and away from the knife member by lifting up and down the pressing tool so as to form a cut. By allowing the tool lifting device to double as a drive device for causing the forcing member to move relatively towards and away from the knife member, the necessity of the actuator of the ACF tape cutting device which is needed in the related art tape adhering device can be obviated.

Abstract: A tape adhering apparatus and a tape adhering method for adhering an ACF tape formed from an anisotropic conductive film to a target adhering area on a substrate are disclosed. It is an objective of the invention to provide a tape adhering apparatus and a tape adhering method that enable shortening of a time consumed by operation for adhering one cut piece of an ACF tape. According to the present invention, the separator is peeled from the cut piece of the ACF tape by letting the tape conveyor means convey the tape member in synchronism with the transfer action of the transfer base and thereafter a cut portion of the ACF tape to be next adhered is placed at the cutting position of the tape cutting means by letting the tape conveyor means continually convey the tape member in the forward conveyance direction.

Abstract: The pressing tool and the ACF tape cutting device are linked and connected with each other by a link device, and the forcing member is caused to move relatively towards and away from the knife member by lifting up and down the pressing tool so as to form a cut. By allowing the tool lifting device to double as a drive device for causing the forcing member to move relatively towards and away from the knife member, the necessity of the actuator of the ACF tape cutting device which is needed in the related art tape adhering device can be obviated.

Abstract: A tape applying device for applying electrically conductive tape onto a board includes: a applying head for pressing the conductive tape; a tape holding unit including a reel section having a feed reel for feeding the conductive tape laminated with a separator and a wind-up reel to which the separator is to be wound up, and a tape guide section for guiding the conductive tape along with the separator to a position of pressing by the applying head; and a base section which has a tape guide driving unit for moving up and down the tape guide section, and to and from which the tape holding unit is fittable and removable. The tape guide section, while in a fitted state of being fitted to the base section, is separated from the reel section and moved up and down by driving force of the tape guide driving unit.

Abstract: A tape applying device for applying electrically conductive tape onto a board includes: a applying head for pressing the conductive tape; a tape holding unit including a reel section having a feed reel for feeding the conductive tape laminated with a separator and a wind-up reel to which the separator is to be wound up, and a tape guide section for guiding the conductive tape along with the separator to a position of pressing by the applying head; and a base section which has a tape guide driving unit for moving up and down the tape guide section, and to and from which the tape holding unit is fittable and removable. The tape guide section, while in a fitted state of being fitted to the base section, is separated from the reel section and moved up and down by driving force of the tape guide driving unit.

Abstract: It is an objective of the invention to provide a tape adhering apparatus and a tape adhering method that enable shortening of a time consumed by operation for adhering one cut piece of an ACF tape. After a cut piece 4S of an ACF tape 4 is pressed against and adhered to a target adhering area Sa on a substrate 2 by a press tool 22, a transfer base 14 is transferred, and a tape member Tp is then forwardly conveyed in synchronism with transfer of the transfer base 14 in such a way that the press tool 22 comes to an elevated position above the target adhering area Sa on the substrate 2 where the cut piece 4S of the ACF tape 4 is to be adhered, thereby peeling a separator Sp off from the cut piece 4S of the ACF tape 4. A tape cutting unit 24 is disposed downstream of a region Rg of, immediately below the press tool 22, of the tape member Tp conveyed by the tape conveyor unit 23 with respect to a forward conveyance direction of the tape member Tp.

Abstract: A base is removably mounted to a holder mounted on a frame. A feed reel for feeding a tape member formed by lamination of a separator and anisotropic conductive tape, and a wind-up reel which is placed coaxial with the feed reel and which serves for winding up the tape member of which the anisotropic conductive tape has been press-applied to the board by a press-applying head mounted on the holder are mounted on the base.

Abstract: Provided is an apparatus capable of easily splicing ACF tapes that are thin and are hard to handle. The tape splicing apparatus splices two ACF tapes (210) each having an ACF (212), and includes: a first holding unit that holds one of the ACF tapes (210); a second holding unit that holds the other one of the ACF tapes (210); a positioning unit (115) that positions the ACF tapes (210) to be overlapped in a thickness direction; and a pressing unit (116) that presses the overlapped ACF tapes (210) in the thickness direction.

Abstract: An apparatus for applying adhesive sheets includes a sheet applying base which is placed on a placement base so as to be withdrawable from the placement base and which has a sheet applying region to which adhesive sheets positioned closely before and after a junction portion are to be applied. In the sheet applying base, an upstream-side end portion of the sheet applying region in the adhesive sheet feed direction is placed so as to confront an end portion of the sheet applying head, and moreover a sheet escaping space opened downward is set in place.

Abstract: In adhesive tape applying process for transferring, along a tape transfer path, a tape member with an adhesive tape applied on one side of a release tape, cutting the adhesive tape into a specified length, peeling the adhesive tape from the release tape, and applying the adhesive tape to a substrate, the process includes: placing a terminal end portion of an in-use first tape member and a leading end portion of a newly added second tape member in superimposition on each other in their thicknesswise direction by an apparatus for applying adhesive tape; and pressuring and heating a superposition region of end portions of the first and second tape members at least partly in a widthwise direction of the tape members to partly fuse and join together the terminal end portion of the first tape member and the leading end portion of the second tape member at their superposition regions.

Abstract: A method for transferring a substrate includes moving first and second substrate holding sections opposite each other, moving a first substrate stage holding the substrate so as to be disposed between the first and second substrate holding sections, delivering the substrate from the first substrate stage to the first and second substrate holding sections by releasing the holding of the substrate by the first substrate stage and holding the substrate by the first and second substrate holding sections, moving the first and second substrate holding sections from a first substrate taking-over position to a second substrate taking-over position, moving a second substrate stage so as to be disposed in the interval between the first and second substrate holding sections at the second substrate taking-over position, and delivering the substrate to the second substrate stage by releasing the substrate and holding the substrate by the second substrate stage.

Abstract: The final-bonder is equipped with a warping correction unit that is equipped in parallel with a backup stage with a distance of about 20 mm from such backup stage, and that includes accordion pads for sucking a liquid crystal panel; the backup stage that supports, from the back, the liquid crystal panel when pressure is applied to its outer edge portion at the bonding of semiconductor components; and a pressure head that carries out final bonding of the semiconductor components onto the outer edge portion of the liquid crystal panel by applying pressure and heat to them.

Abstract: The apparatus for applying adhesive sheets includes a sheet applying base which is placed on a placement base so as to be withdrawable from the placement base and which has a sheet applying region to which adhesive sheets closely before and after a junction portion is to be applied. In the sheet applying base, an upstream-side end portion of the sheet applying region in the adhesive sheet feed direction is placed so as to confront an end portion of the sheet applying head, and moreover a sheet escaping space opened downward is set in place.

Abstract: Provided is an apparatus capable of easily splicing ACF tapes that are thin and are hard to handle. The tape splicing apparatus splices two ACF tapes (210) each having an ACF (212), and includes: a first holding unit that holds one of the ACF tapes (210); a second holding unit that holds the other one of the ACF tapes (210); a positioning unit (115) that positions the ACF tapes (210) to be overlapped in a thickness direction; and a pressing unit (116) that presses the overlapped ACF tapes (210) in the thickness direction.

Abstract: The final-bonder (103) is equipped with: a warping correction unit (201) that is equipped in parallel with a backup stage (203) with a distance of about 20 mm from such backup stage (203), and that includes accordion pads (202) for sucking a liquid crystal panel; the backup stage (203) that supports, from the back, the liquid crystal panel when pressure is applied to its outer edge portion at the boding of semiconductor components; and a pressure head (204) that carries out final bonding of the semiconductor components onto the outer edge portion of the liquid crystal panel by applying pressure and heat to them.

Abstract: A substrate transfer apparatus 24A of a component mounting equipment has linear motion guides 78A and 78B and substrate holding sliders 79A and 79B. The linear motion guides 78A and 78B extend in a transfer direction “C” from a first substrate taking-over position P1 to a second substrate taking-over position P2 and are opposed to each other with an interval G1 in a direction orthogonal to the transfer direction “C”. The substrate holding sliders 79A and 79B can move along the linear motion guides 78A and 78B, are opposed to each other with an interval G2 in the direction orthogonal to the transfer direction C, and releasably hold a lower surface of the substrate 12. The substrate holding sliders 79A and 79B move reciprocatingly in the transfer direction of the substrate 12 between the first and second substrate taking-over positions by an X-axis drive mechanism 87.

Abstract: A multilayer wiring structure comprising a plurality of groups of patterns each having a multiplicity of wirings formed on the opposite sides of an intervening insulation film. The intervening insulation film is formed with a void exposed to both an upper pattern of a multiplicity of wirings and a lower pattern of a multiplicity of wirings, the upper and lower patterns being formed on and beneath the intervening insulation film and arranged to form a matrix. The void extends longitudinally across one of the patterns, and the upper and lower patterns are connected together through the void at crossing points of the matrix.

Abstract: A non-conductive sealing glass consists of 100 parts by weight of a composition containing 20-30 mole % of B.sub.2 O.sub.3, 60-69 mole % of PbO, 0-10 mole % of ZnO, O-6 mole % of CuO and 0.5-2.0 mole % of Bi.sub.2 O.sub.3 ; and 1-5 parts by weight of either one or both of SiO.sub.2 and Al.sub.2 O.sub.3. The sealing glass is suitable for bonding together and sealing soda-lime-silica glass plates utilized to manufacture panel display devices.