Patents by Inventor Kozo Okamoto
Kozo Okamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10796917Abstract: A semiconductor device includes: a first semiconductor layer formed, on a substrate, of a nitride semiconductor; a second semiconductor layer formed, on the first semiconductor layer, of a nitride semiconductor; a source electrode formed on the second semiconductor layer; a drain electrode formed on the second semiconductor layer; a metal oxide film formed, between the source electrode and the drain electrode, on the second semiconductor layer; and a gate electrode formed on the metal oxide film. The metal oxide film includes AlOx and InOx. AlOx/InOx in the metal oxide film is greater than or equal to 3.Type: GrantFiled: April 16, 2019Date of Patent: October 6, 2020Assignee: FUJITSU LIMITEDInventors: Shirou Ozaki, Kozo Makiyama, Naoya Okamoto
-
Publication number: 20200058783Abstract: A compound semiconductor device includes a compound semiconductor laminate structure including an electron transit layer and an electron supply layer, a gate electrode, a source electrode, and a drain electrode that are formed over the electron supply layer, a first insulating layer of diamond formed between the gate electrode and the drain electrode over the compound semiconductor laminate structure, and a second insulating layer formed between the gate electrode and the source electrode over the compound semiconductor laminate structure, wherein a positive compressive stress is applied from the first insulating layer to the electron supply layer, and a compressive stress from the second insulating layer to the electron supply layer is smaller than the compressive stress from the first insulating layer to the electron supply layer.Type: ApplicationFiled: August 2, 2019Publication date: February 20, 2020Applicant: FUJITSU LIMITEDInventors: Shirou OZAKI, Kozo Makiyama, Yuichi Minoura, Yusuke Kumazaki, Toshihiro Ohki, NAOYA OKAMOTO
-
Publication number: 20200018418Abstract: The present invention controls the pressure and flow rate of fluid, in order to obtain uniform performance, configure a closed loop magnetic circuit so as to include an electromagnet, a flapper, and a yoke material, and elastically deform the flapper itself by Maxwell attractive force generated between a magnetic pole of the electromagnet and the flapper to make the separation distance between the nozzle and the flapper variable. As opposed to a rigid flapper structure that swingably moves around a supporting point, like a conventional servo valve, the electromagnet, the magnetic pole, the nozzle, the flapper, and the like are arranged such that a change in magnetic gap directly leads to a change in air gap.Type: ApplicationFiled: September 25, 2019Publication date: January 16, 2020Inventors: Teruo Maruyama, Kozo Okamoto, Takumi Okada, Satoki Yamaguchi, Masataka Nakashima
-
Patent number: 10465816Abstract: The present invention controls the pressure and flow rate of fluid, in order to obtain uniform performance, configure a closed loop magnetic circuit so as to include an electromagnet, a flapper, and a yoke material, and elastically deform the flapper itself by Maxwell attractive force generated between a magnetic pole of the electromagnet and the flapper to make the separation distance between the nozzle and the flapper variable. As opposed to a rigid flapper structure that swingably moves around a supporting point, like a conventional servo valve, the electromagnet, the magnetic pole, the nozzle, the flapper, and the like are arranged such that a change in magnetic gap directly leads to a change in air gap.Type: GrantFiled: February 9, 2016Date of Patent: November 5, 2019Assignee: TOKKYOKIKI CORPORATIONInventors: Teruo Maruyama, Kozo Okamoto, Takumi Okada, Satoki Yamaguchi, Masataka Nakashima
-
Publication number: 20190244821Abstract: A semiconductor device includes: a first semiconductor layer formed, on a substrate, of a nitride semiconductor; a second semiconductor layer formed, on the first semiconductor layer, of a nitride semiconductor; a source electrode formed on the second semiconductor layer; a drain electrode formed on the second semiconductor layer; a metal oxide film formed, between the source electrode and the drain electrode, on the second semiconductor layer; and a gate electrode formed on the metal oxide film. The metal oxide film includes AlOx and InOx. AlOx/InOx in the metal oxide film is greater than or equal to 3.Type: ApplicationFiled: April 16, 2019Publication date: August 8, 2019Applicant: FUJITSU LIMITEDInventors: Shirou OZAKI, Kozo Makiyama, NAOYA OKAMOTO
-
Patent number: 10312094Abstract: A semiconductor device includes: a first semiconductor layer formed, on a substrate, of a nitride semiconductor; a second semiconductor layer formed, on the first semiconductor layer, of a nitride semiconductor; a source electrode formed on the second semiconductor layer; a drain electrode formed on the second semiconductor layer; a metal oxide film formed, between the source electrode and the drain electrode, on the second semiconductor layer; and a gate electrode formed on the metal oxide film. The metal oxide film includes AlOx and InOx. AlOx/InOx in the metal oxide film is greater than or equal to 3.Type: GrantFiled: May 19, 2017Date of Patent: June 4, 2019Assignee: FUJITSU LIMITEDInventors: Shirou Ozaki, Kozo Makiyama, Naoya Okamoto
-
Patent number: 10194491Abstract: The present disclosure, for the prevention of a possible degradation of an induction coil in insulating performance by preventing condensate formation on an induction coil, provides a device that is configured to include a roller main body, an induction heat generator provided in the roller main body and having the induction coil for heating the roller main body inductively, a cooling mechanism configured to introduce a coolant mist into a clearance portion between the roller main body and the induction heat generator for cooling the roller main body, an AC voltage application part configured to apply AC voltage to the induction coil, and a DC voltage application part configured to apply DC voltage to the induction coil.Type: GrantFiled: July 16, 2015Date of Patent: January 29, 2019Assignee: TOKUDEN CO., LTD.Inventors: Kozo Okamoto, Takatsugu Kitano
-
Patent number: 9595768Abstract: A glazing is disclosed comprising at least one ply of glass having an electrically conductive component on at least one surface, and an electrical connector electrically connected to the electrically conductive component through a soldered joint, the solder of the joint having a composition comprising 0.5 wt % or more indium, wherein the electrical connector comprises a nickel plated contact for contacting the solder. Also disclosed are solders having a composition comprising 14 to 75 wt % In, 14 to 75 wt % Sn, to 5 wt % Ag, to 5 wt % Ni, and less than 0.1 wt % Pb. Also disclosed is use of a solder having a composition comprising 0.5 wt % or more indium to solder a nickel plated electrical connector to an electrically conductive component on the surface of a ply of glass. The aspects of the invention improve the durability of electrical connections on glazing.Type: GrantFiled: May 2, 2012Date of Patent: March 14, 2017Assignees: Pilkington Group Limited, Nippon Sheet Glass Co. Ltd., Nishinihon Shoko Co., Ltd.Inventors: Michael Lyon, Naotaka Ikawa, Kazuo Inada, Mamoru Yoshida, Takashi Muromachi, Kazuhisa Ono, Kozo Okamoto, Takashi Suzuki
-
Publication number: 20160228889Abstract: The present invention controls the pressure and flow rate of fluid, in order to obtain uniform performance, configure a closed loop magnetic circuit so as to include an electromagnet, a flapper, and a yoke material, and elastically deform the flapper itself by Maxwell attractive force generated between a magnetic pole of the electromagnet and the flapper to make the separation distance between the nozzle and the flapper variable. As opposed to a rigid flapper structure that swingably moves around a supporting point, like a conventional servo valve, the electromagnet, the magnetic pole, the nozzle, the flapper, and the like are arranged such that a change in magnetic gap directly leads to a change in air gap.Type: ApplicationFiled: February 9, 2016Publication date: August 11, 2016Inventors: Teruo Maruyama, Kozo Okamoto, Takumi Okada, Satoki Yamaguchi, Masataka Nakashima
-
Publication number: 20160021706Abstract: The present disclosure, for the prevention of a possible degradation of an induction coil in insulating performance by preventing condensate formation on an induction coil, provides a device that is configured to include a roller main body, an induction heat generator provided in the roller main body and having the induction coil for heating the roller main body inductively, a cooling mechanism configured to introduce a coolant mist into a clearance portion between the roller main body and the induction heat generator for cooling the roller main body, an AC voltage application part configured to apply AC voltage to the induction coil, and a DC voltage application part configured to apply DC voltage to the induction coil.Type: ApplicationFiled: July 16, 2015Publication date: January 21, 2016Inventors: Kozo Okamoto, Takatsugu Kitano
-
Patent number: 8833511Abstract: In a conventional hard material insulator, reproduced sound can be tuned with use of characteristics of the material; however, various types of acoustic materials have specific high frequency characteristics, and thus their acoustic effects lack versatility, require compatible audio devices, and change with environment, musical genre, etc. To address this, a wind-bell member (resonant member) is arranged in parallel with a main propagation path of vibration transferred from an audio device to an insulator. Accordingly, a vibration system of a wind-bell having a tone determined by many factors such as a fundamental tone, harmonic tones, lingering sound, and fluctuation assists (enhances) high frequency vibration propagated from the audio device. As a result, due to the above assist action that is different in principle from a conventional type, acoustic characteristics such as a sense of localization, resolution, and a sense of transparency and scale a sound image can be dramatically improved.Type: GrantFiled: July 29, 2011Date of Patent: September 16, 2014Assignee: Tokkyokiki CorporationInventors: Teruo Maruyama, Kozo Okamoto, Satoki Yamaguchi, Akio Tajima
-
Publication number: 20140138155Abstract: A glazing is disclosed comprising at least one ply of glass having an electrically conductive component on at least one surface, and an electrical connector electrically connected to the electrically conductive component through a soldered joint, the solder of the joint having a composition comprising 0.5 wt % or more indium, wherein the electrical connector comprises a nickel plated contact for contacting the solder. Also disclosed are solders having a composition comprising 14 to 75 wt % In, 14 to 75 wt % Sn, to 5 wt % Ag, to 5 wt % Ni, and less than 0.1 wt % Pb. Also disclosed is use of a solder having a composition comprising 0.5 wt % or more indium to solder a nickel plated electrical connector to an electrically conductive component on the surface of a ply of glass. The aspects of the invention improve the durability of electrical connections on glazing.Type: ApplicationFiled: May 2, 2012Publication date: May 22, 2014Applicants: PILKINGTON GROUP LIMITED, NIPPON SHEET GLASS CO., LTD., UCHIHASHI ESTEC CO., LTD., NISHINIHON SHOKO CO., LTDInventors: Michael Lyon, Naotaka Ikawa, Kazuo Inada, Mamoru Yoshida, Takashi Muromachi, Kazuhisa Ono, Kozo Okamoto, Takashi Suzuki
-
Publication number: 20130206499Abstract: In a conventional hard material insulator, reproduced sound can be tuned with use of characteristics of the material; however, various types of acoustic materials have specific high frequency characteristics, and thus their acoustic effects lack versatility, require compatible audio devices, and change with environment, musical genre, etc. To address this, a wind-bell member (resonant member) is arranged in parallel with a main propagation path of vibration transferred from an audio device to an insulator. Accordingly, a vibration system of a wind-bell having a tone determined by many factors such as a fundamental tone, harmonic tones, lingering sound, and fluctuation assists (enhances) high frequency vibration propagated from the audio device. As a result, due to the above assist action that is different in principle from a conventional type, acoustic characteristics such as a sense of localization, resolution, and a sense of transparency and scale a sound image can be dramatically improved.Type: ApplicationFiled: July 29, 2011Publication date: August 15, 2013Applicant: TOKKYOKIKI CORPORATIONInventors: Teruo Maruyama, Kozo Okamoto, Satoki Yamaguchi, Akio Tajima
-
Patent number: 7533308Abstract: The semiconductor test system comprises a test device for testing semiconductor devices including redundant circuits to obtain fail information of defective parts of the semiconductor devices; a redundant remedy judging device which includes fail memories for storing the fail information, and a redundant remedy judging unit for judging based on the fail information stored in the fail memories as to whether or not the redundant remedy replacing the defective parts of the semiconductor devices with the redundant circuits can be made, and which is provided independent of the test device, wherein the test device and the redundant remedy judging device are interconnected with each other via a network, and fail information is transmitted from the test device to the redundant remedy judging device.Type: GrantFiled: March 17, 2005Date of Patent: May 12, 2009Assignee: Fujitsu Microelectronics LimitedInventors: Tomomi Yano, Kozo Okamoto, Takumi Morimoto
-
Patent number: 7420141Abstract: A thermal processing roller includes a heat transfer medium flowing path therein and heats a member to be processed abutting against a surface of the roller or absorbs heat therefrom by heat transfer fluid flowing through the heat transfer medium flowing path, wherein a sealed chamber extending in a longitudinal direction of the roller and in which heat transfer medium of vapor-liquid two phases is sealed is formed within a thick portion of the roller.Type: GrantFiled: July 22, 2005Date of Patent: September 2, 2008Assignee: Tokuden Co., Ltd.Inventors: Yoshio Kitano, Toru Tonomura, Kozo Okamoto, Shigeyuki Hirota, Masanobu Heguri, Toshiki Hanafusa
-
Publication number: 20070138162Abstract: In a heating fluid medium passing roller device for heat-treating a object to be processed in contact with the surface of a roller 1, heat exchanger devices 5a, 5b are arranged on a circulating heating fluid medium path, and the heating fluid medium heat-exchanged in the heat exchanger device is passed through the roller 1 having a jacked chamber 1b sealed with a gas-liquid two phase heating medium within its wall to keep the roller 1 at a predetermined temperature. Further, the heating fluid medium passing roller device includes a temperature sensor 13 for detecting the temperature of the heating fluid medium to be supplied into the roller 1 and a temperature sensor 14 for detecting the temperature of the heating fluid medium exhausted from the roller 1. The flow rate of the heating fluid medium to be supplied into the roller is adjusted so that the difference between the temperatures detected by the temperature sensors 13 and 14 is constant.Type: ApplicationFiled: November 1, 2006Publication date: June 21, 2007Inventors: Toru Tonomura, Kozo Okamoto, Yasuhiro Fujimoto, Motomasa Hirao
-
Publication number: 20060289483Abstract: An inductive heating roller device, in which support rods fixed in an inductive heating mechanism are inserted into the drive shafts of a roller and are supported on the inner faces of the drive shafts through bearings so that the inductive heating mechanism is held in a floating manner. Elastic members 14 are arranged between the outer faces of the support rods 7A and 7B and the inner faces of the drive shafts 3A and 3B so that the support rods 7A and 7B are supported on the inner faces of the drive shafts 3A and 3B through the elastic members 14 and the bearings 10A and 10B.Type: ApplicationFiled: June 8, 2006Publication date: December 28, 2006Inventors: Yoshio Kitano, Kozo Okamoto, Yoshihiko Yamamura
-
Publication number: 20060236172Abstract: On a semiconductor wafer 10, semiconductor chip regions 12 including a semiconductor integrated circuit, a scribe line 14 formed adjacent to the semiconductor chip region 12, a test device 18 formed in the scribe line 14, electrically separated from the semiconductor circuit in the semiconductor chip region 12, for controlling a tester signal in testing the semiconductor integrated circuit are provided, and the semiconductor integrated circuit of the semiconductor chip region 12 and the test device 18 are electrically connected to each other through lines 38L, 38R provided in a probe card 16.Type: ApplicationFiled: August 30, 2005Publication date: October 19, 2006Applicant: FUJITSU LIMITEDInventor: Kozo Okamoto
-
Publication number: 20060083084Abstract: The semiconductor test system comprises a test device 10 for testing semiconductor devices including redundant circuits to obtain fail information of defective parts of the semiconductor devices; a redundant remedy judging device 14 which includes fail memories 36a-36d for storing the fail information, and a redundant remedy judging unit 40 for judging based on the fail information stored in the fail memories 36a-36d as to whether or not the redundant remedy for replacing the defective parts of the semiconductor devices with the redundant circuits can be made, and which is provided independent of the test device 10, wherein the test device 10 and the redundant remedy judging device 14 are interconnected with each other via a network 12, and fail information is transmitted from the test device 10 to the redundant remedy judging device 14.Type: ApplicationFiled: March 17, 2005Publication date: April 20, 2006Applicant: FUJITSU LIMITEDInventors: Tomomi Yano, Kozo Okamoto, Takumi Morimoto
-
Patent number: 6992272Abstract: A thermal processing roller includes a heat transfer medium flowing path therein and heats a member to be processed abutting against a surface of the roller or absorbs heat therefrom by heat transfer fluid flowing through the heat transfer medium flowing path, wherein a sealed chamber extending in a longitudinal direction of the roller and in which heat transfer medium of vapor-liquid two phases is sealed is formed within a thick portion of the roller.Type: GrantFiled: September 23, 2003Date of Patent: January 31, 2006Assignee: Tokuden Co., Ltd.Inventors: Yoshio Kitano, Toru Tonomura, Kozo Okamoto, Shigeyuki Hirota, Masanobu Heguri, Toshiki Hanafusa