Abstract: A Geiger-Muller counter tube includes a cylindrical enclosing tube, an anode electrode, a cylindrical cathode electrode, an inert gas, and a quenching gas. The cylindrical enclosing tube has a sealed space. The anode electrode is disposed inside the space and formed in a rod shape. The cylindrical cathode electrode surrounds a peripheral area of the anode electrode inside the space to have an opening. The inert gas and the quenching gas are sealed inside the space. At least one of the anode electrode and the cathode electrode includes a plurality of electrodes inside the enclosing tube.

Abstract: A Geiger-Muller counter tube includes an enclosing tube, an anode conductor, a cathode conductor, an inert gas, and a quenching gas. The enclosing tube is at least partially cylindrical and has a sealed space. The anode conductor includes an anode electrode and a linear first metal lead portion. The anode electrode is arranged inside the space and formed in a rod shape. The first metal lead portion is connected to the anode electrode and supported at an end of the enclosing tube. The cathode conductor includes a cylindrical cathode electrode and a linear second metal lead portion. The cathode electrode surrounds a peripheral area of the anode electrode inside the space. The second metal lead portion is connected to the cathode electrode and supported at the end of the enclosing tube. The cathode electrode has a side surface through a part of which a through-hole passes.

Abstract: A radiation measurement apparatus for measuring radiation includes a first and second Geiger-Muller counter tubes and a radiation-direction calculating unit. The first Geiger-Muller counter tube seals an electrode within a circular pipe-shaped enclosing tube that extends in a straight line. The first Geiger-Muller counter tube is arranged along a first direction. The second Geiger-Muller counter tube seals an electrode within a circular pipe-shaped enclosing tube that extends in a straight line. The second Geiger-Muller counter tube is arranged in a second direction intersecting with the first direction. The radiation-direction calculating unit is configured to compare a first detection signal and a second detection signal with one another to calculate a direction of radiation to be emitted from the sample. The first detection signal is output from the electrode of the first Geiger-Muller counter tube. The second detection signal is output from the electrode of the second Geiger-Muller counter tube.

Abstract: A Geiger-Muller counter tube includes an enclosing tube, an anode conductor, a cathode conductor, an inert gas, and a quenching gas. The enclosing tube is at least partially cylindrical and has a sealed space. The anode conductor includes an anode electrode and a linear first metal lead portion. The anode electrode is arranged inside the space and formed in a rod shape. The first metal lead portion is connected to the anode electrode and supported at an end of the enclosing tube. The cathode conductor includes a cylindrical cathode electrode and a linear second metal lead portion. The cathode electrode surrounds a peripheral area of the anode electrode inside the space. The second metal lead portion is connected to the cathode electrode and supported at the end of the enclosing tube. The cathode electrode has a side surface through a part of which a through-hole passes.

Abstract: A Geiger-Muller counter tube includes a cylindrical enclosing tube, an anode electrode, a cylindrical cathode electrode, a bead, an inert gas, and a quenching gas. The cylindrical enclosing tube has a sealed space. The anode electrode is disposed inside the space and formed in a rod shape. The cylindrical cathode electrode surrounds a peripheral area of the anode electrode inside the space. The bead is formed of an insulator and having a through-hole in the center, the anode electrode passing through the through-hole. The bead is secured to the anode electrode in a position where the anode electrode is surrounded by the cathode electrode. The inert gas and the quenching gas are sealed inside the space. The bead prevents a direct contact between the anode electrode and the cathode electrode.

Abstract: A Geiger-Muller counter tube includes a cylindrical enclosing tube, an anode electrode, a cylindrical cathode electrode, an inert gas, and a quenching gas. The cylindrical enclosing tube has a sealed space. The anode electrode is disposed inside the space and formed in a rod shape. The cylindrical cathode electrode surrounds a peripheral area of the anode electrode inside the space to have an opening. The inert gas and the quenching gas are sealed inside the space. At least one of the anode electrode and the cathode electrode includes a plurality of electrodes inside the enclosing tube.

Abstract: A radiation measurement apparatus for measuring radiation includes a first and second Geiger-Muller counter tubes and a radiation-direction calculating unit. The first Geiger-Muller counter tube seals an electrode within a circular pipe-shaped enclosing tube that extends in a straight line. The first Geiger-Muller counter tube is arranged along a first direction. The second Geiger-Muller counter tube seals an electrode within a circular pipe-shaped enclosing tube that extends in a straight line. The second Geiger-Muller counter tube is arranged in a second direction intersecting with the first direction. The radiation-direction calculating unit is configured to compare a first detection signal and a second detection signal with one another to calculate a direction of radiation to be emitted from the sample. The first detection signal is output from the electrode of the first Geiger-Muller counter tube. The second detection signal is output from the electrode of the second Geiger-Muller counter tube.

Abstract: A step-up circuit includes a transistor configured to perform switching operation in response to a pulse signal input into a base of the transistor, an inductor disposed between a collector of the transistor and a power source, and a basic step-up circuit connected to a connecting point of the collector of the transistor and the inductor. The basic step-up circuit includes: a first diode, a second diode whose anode is connected to a cathode of the first diode, a third diode whose anode is connected to a cathode of the second diode, a first capacitor disposed between the cathode of the first diode and ground, a second capacitor disposed between an anode of the first diode and the cathode of the second diode, and a third capacitor disposed between a cathode of the third diode and the ground.

Abstract: In an exemplary method for manufacturing a piezoelectric device, a lid wafer, a piezoelectric wafer, and a base wafer are prepared. Each wafer defines multiple lids, multiple piezoelectric vibrating pieces, and multiple bases, respectively. The piezoelectric vibrating pieces comprise respective first and second electrodes, and the base wafer is made of glass. The bases comprise respective first and second metal wires extending therethrough, each wire having a respective end and a respective side surface at the end that protrudes at least partially from the first surface. A wafer sandwich is formed with the three wafers co-aligned with each other, with the protruding ends of the wires contacting respective first and second electrodes. The layers are anodic bonded together, which also bonds the protruding ends of the first and second wires to the respective first and second electrodes. The bonded wafer sandwich is cut into separate individual piezoelectric devices thus formed in the sandwich from each other.

Abstract: Piezoelectric devices and method for making them are disclosed. An exemplary piezoelectric device has a package base defining a cavity on a first surface thereof. An opposing second surface of the package base has at least one through-hole, a mounting electrode on which a piezoelectric vibrating piece is attached, and a respective sealing electrode sealing each through-hole. At least one external electrode is on the second surface, and a lid is bonded to the package base to enclose the piezoelectric vibrating piece. The mounting electrode, sealing electrodes, and external electrodes are formed integrally.

Abstract: An optical filter is provided having an optical plate which has a chamfered section formed on an outer peripheral edge section of one principle surface of the optical plate and has isotropy with respect to wet-etching. The chamfered section is of an arc shape which is cross-sectionally concave in an inward direction of the optical plate.

Abstract: To easily bond substrates even made of materials whose linear expansion coefficients are different from each other when manufacturing an optical component used by transmitting light through an inside thereof. Buffer layers made of an amorphous inorganic substance causing a brittle fracture are formed on bonding surfaces of a plurality of substrates having linear expansion coefficients different from one another, and the substrates to be bonded are stacked so that the buffer layers are faced to each other. Then, a heat treatment is performed for a stack, and thereby direct bonding via an atom is formed between the buffer layers.

Abstract: Devices are disclosed that include a piezoelectric vibrating piece; a glass base and lid form a package enclosing the piezoelectric vibrating piece. The piece has first and second electrodes. The base has first and second opposing surfaces. The base mounts the piezoelectric vibrating piece, and the lid seals the piezoelectric vibrating piece in the package. The base includes first and second metal wires, extending therethrough, whose ends are denuded to the first and second surfaces and connected to the first and second electrodes, respectively. In disclosed methods for making the packaged devices, such as piezoelectric oscillators, multiple packaged devices are made simultaneously by stacking and simultaneously bonding respective wafers on which glass bases, piezoelectric vibrating pieces, and lids have been formed.

Abstract: Devices are disclosed that include a piezoelectric vibrating piece; a glass base and lid form a package enclosing the piezoelectric vibrating piece. The piece has first and second electrodes. The base has first and second opposing surfaces. The base mounts the piezoelectric vibrating piece, and the lid seals the piezoelectric vibrating piece in the package. The base includes first and second metal wires, extending therethrough, whose ends are denuded to the first and second surfaces and connected to the first and second electrodes, respectively. In disclosed methods for making the packaged devices, such as piezoelectric oscillators, multiple packaged devices are made simultaneously by stacking and simultaneously bonding respective wafers on which glass bases, piezoelectric vibrating pieces, and lids have been formed.

Abstract: An object of the invention is to provide an optical filter that prevents an optical thin film formed on an optical plate from being partially removed, and prevents micro-cracks occurring in an outer peripheral edge section of a principle surface of the optical plate, and that has a high yield rate. An optical filter is provided with an optical plate which has a chamfered section formed on an outer peripheral edge section of one principle surface of the optical plate, and has isotropy with respect to wet-etching, and the chamfered section is of an arc shape which is cross-sectionally concave in an inward direction of the optical plate, and is formed by means of wet-etching. A crossing angle between the one principle surface and a concave surface where the chamfered section is formed, and a crossing angle between the concave surface and a side surface of the optical plate 3 where the chamfered section is formed, namely, crossing angles ?G and ?H are respectively 100° or greater and less than 180° .

Abstract: Piezoelectric devices and associated fabrication methods are disclosed. An exemplary piezoelectric device includes a piezoelectric vibrating piece having first and second electrodes and first and second surfaces, a glass base having first and second surfaces, and a lid. These three parts also form the device package. The first surface of the piezoelectric vibrating piece is mounted to the base, and the lid is mounted to the second surface of the piezoelectric vibrating piece to seal the package. The glass base includes first and second metal wires having ends that protrude from the surfaces of the base. The side surfaces of the protruding wire ends are connected to the first and the second electrodes, respectively. Manufacture is performed using whole wafers that are processed, sandwiched, bonded, and then cut to produce individual devices.

Abstract: To easily bond substrates even made of materials whose linear expansion coefficients are different from each other when manufacturing an optical component used by transmitting light through an inside thereof. Buffer layers made of an amorphous inorganic substance causing a brittle fracture are formed on bonding surfaces of a plurality of substrates having linear expansion coefficients different from one another, and the substrates to be bonded are stacked so that the buffer layers are faced to each other. Then, a heat treatment is performed for a stack, and thereby direct bonding via an atom is formed between the buffer layers.

Abstract: Piezoelectric devices and associated fabrication methods are disclosed. An exemplary piezoelectric device includes a piezoelectric vibrating piece having first and second electrodes and first and second surfaces, a glass base having first and second surfaces, and a lid. These three parts also form the device package. The first surface of the piezoelectric vibrating piece is mounted to the base, and the lid is mounted to the second surface of the piezoelectric vibrating piece to seal the package. The glass base includes first and second metal wires having ends that protrude from the surfaces of the base. The side surfaces of the protruding wire ends are connected to the first and the second electrodes, respectively. Manufacture is performed using whole wafers that are processed, sandwiched, bonded, and then cut to produce individual devices.