Patents by Inventor Kreisler S. Lau
Kreisler S. Lau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7049386Abstract: In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arlyene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.Type: GrantFiled: June 19, 2002Date of Patent: May 23, 2006Assignee: Honeywell International Inc.Inventors: Kreisler S. Lau, Feng Quan Liu, Boris A. Korolev, Emma Brouk, Ruslan Zherebin, David Nalewajek
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Patent number: 7049005Abstract: The present invention provides a composition comprising: (a) thermosetting component comprising (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II set forth below where E is a cage compound (defined below); each Q is the same or different and selected from aryl, branched aryl, and substituted aryl wherein the substituents include hydrogen, halogen, alkyl, aryl, substituted aryl, heteroaryl, aryl ether, alkenyl, alkynyl, alkoxyl, hydroxyalkyl, hydroxyaryl, hydroxyalkenyl, hydroxyalkynyl, hydroxyl, or carboxyl; G is aryl or substituted aryl where substituents include halogen and alkyl; h is from 0 to 10; i is from 0 to 10; j is from 0 to 10; and w is 0 or 1; (b) adhesion promoter comprising compound having at least bifunctionality wherein the bifunctionality may be the same or different and the first functionality is capable of interacting with the thermosetting component (a) and the second functionality is capable of interacting with a substrate wheType: GrantFiled: May 30, 2002Date of Patent: May 23, 2006Assignee: Honeywell International Inc.Inventors: Paul G. Apen, William B. Bedwell, Nancy Iwamoto, Boris A. Korolev, Kreisler S. Lau, Bo Li, Ananth Naman
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Patent number: 6998178Abstract: The present invention provides a composition comprising: (a) thermosetling component comprising (1) optionally at least one monomer of Formula I as sel forth below and (2) at least one oligomer or polymer of Formula II set forth below where E is a cage compound (defined below); each Q is the same or different and selected from hydrogen, aryl, branched aryl, and substituted aryl wherein the substituents include hydrogen, halogen, alkyl, aryl, substituted aryl, heteroaryl, aryl ether, alkenyl, alkynyl, alkoxyl, hydroxyalkyl, hydroxyaryl, hydroxyalkenyl, hydroxyalkynyl, hydroxyl, or carboxyl; Gw is aryl or substituted aryl where substituents include halogen and alkyl; h is from 0 to 10; i is from 0 to 10; j is from 0 to 10; and w is 0 or 1; adhesion promoter comprising compound having least bifunctionality wherein the bifunctionality may be the same or different and the first functionality is capable of interacting with the thermosetting component (a) and the second functionality is capable of interacting withType: GrantFiled: April 2, 2003Date of Patent: February 14, 2006Assignee: Honeywell International Inc.Inventors: Paul G. Apen, William B. Bedwell, Nancy Iwamoto, Boris A. Korolev, Kreisler S. Lau, Bo Li, Ananth Naman
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Publication number: 20040192870Abstract: In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arylene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.Type: ApplicationFiled: April 12, 2004Publication date: September 30, 2004Inventors: Kreisler S. Lau, Feng Quan Liu, Boris A. Korolev, Emma Brouk, Ruslan Zherebin, David Nalewajek
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Publication number: 20040102584Abstract: A low dielectric constant material has a polymeric network that is fabricated from a first and a second component. The first component comprises a polymeric strand, and the second component comprises a molecule having a central portion with at least three arms extending from the central portion, wherein each of the arms includes a backbone with a reactive group. The first component and the second component form the polymeric network in a reaction that involves at least one of the reactive groups when the first and second components are thermally activated.Type: ApplicationFiled: November 18, 2003Publication date: May 27, 2004Inventors: Kreisler S. Lau, Feng Quan Liu, Boris Korolev, Emma Brouk, Ruslan Zherebin, David Nalewajek
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Patent number: 6740685Abstract: The present invention provides a composition comprising (a) thermosetting component comprising: (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II as set forth below where E, Q, G, h, l, j, and w are as set forth below and (b) porogen that bonds to thermosetting component (a). Preferably, the porogen is selected from the group consisting of unsubstituted polynorbornene, substituted polynorbornene, polycaprolactone, unsubstituted polystyrene, substituted polystyrene, polyacenaphthylene homopolymer, and polyacenaphthylene copolymer. Preferably, the present compositions may be used as dielectric substrate in microchips, multichip modules, laminated circuit boards, or printed wiring boards.Type: GrantFiled: May 30, 2002Date of Patent: May 25, 2004Assignee: Honeywell International Inc.Inventors: Bo Li, Paul G. Apen, Kreisler S. Lau, Edward J. Sullivan
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Patent number: 6713590Abstract: A low dielectric constant material has a polymeric network that is fabricated from a first and a second component. The first component comprises a polymeric strand, and the second component comprises a molecule having a central portion with at least three arms extending from the central portion, wherein each of the arms includes a backbone with a reactive group. The first component and the second component form the polymeric network in a reaction that involves at least one of the reactive groups when the first and second components are thermally activated. Contemplated low dielectric constant materials are advantageously employed in the fabrication of electronic devices, and particularly contemplated devices include integrated circuits.Type: GrantFiled: December 3, 2001Date of Patent: March 30, 2004Assignee: Honeywell International Inc.Inventors: Kreisler S. Lau, Feng Quan Liu, Boris Korolev, Emma Brouk, Ruslan Zherebin, David Nalewajek
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Publication number: 20040002573Abstract: The present invention provides a composition comprising:Type: ApplicationFiled: April 2, 2003Publication date: January 1, 2004Inventors: Paul G. Apen, William B. Bedwell, Nancy Iwamoto, Boris A. Korolev, Kreisler S. Lau, Bo Li, Ananth Naman
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Publication number: 20030130423Abstract: The present invention provides a composition comprising:Type: ApplicationFiled: May 30, 2002Publication date: July 10, 2003Inventors: Paul G. Apen, William B. Bedwell, Nancy Iwamoto, Boris A. Korolev, Kreisler S. Lau, Bo Li, Ananth Naman
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Publication number: 20030114598Abstract: The present invention provides a composition comprising (a) thermosetting component comprising: (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II as set forth below where E, Q, G, h, I, j, and w are as set forth below and (b) porogen that bonds to thermosetting component (a). Preferably, the porogen is selected from the group consisting of unsubstituted polynorbornene, substituted polynorbornene, polycaprolactone, unsubstituted polystyrene, substituted polystyrene, polyacenaphthylene homopolymer, and polyacenaphthylene copolymer. Preferably, the present compositions may be used as dielectric substrate in microchips, multichip modules, laminated circuit boards, or printed wiring boards.Type: ApplicationFiled: May 30, 2002Publication date: June 19, 2003Inventors: Bo Li, Paul G. Apen, Kreisler S. Lau, Edward J. Sullivan
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Publication number: 20030060590Abstract: In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arylene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.Type: ApplicationFiled: June 19, 2002Publication date: March 27, 2003Applicant: Honeywell International Inc.Inventors: Kreisler S. Lau, Feng Quan Liu, Boris A. Korolev, Emma Brouk, Ruslan Zherebin, David Nalewajek
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Patent number: 6469123Abstract: In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arylene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.Type: GrantFiled: July 19, 2000Date of Patent: October 22, 2002Assignee: Honeywell International Inc.Inventors: Kreisler S. Lau, Feng Quan Liu, Boris A. Korolev, Emma Brouk, Ruslan Zherebin, David Nalewajek
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Patent number: 6423811Abstract: A low dielectric constant material has a polymeric network that is fabricated from a first and a second component. The first component comprises a polymeric strand, and the second component comprises a molecule having a central portion with at least three arms extending from the central portion, wherein each of the arms includes a backbone with a reactive group. The first component and the second component form the polymeric network in a reaction that involves at least one of the reactive groups when the first and second components are thermally activated. Contemplated low dielectric constant materials are advantageously employed in the fabrication of electronic devices, and particularly contemplated devices include integrated circuits.Type: GrantFiled: July 19, 2000Date of Patent: July 23, 2002Assignee: Honeywell International Inc.Inventors: Kreisler S. Lau, Feng Quan Liu, Boris Korolev, Emma Brouk, Ruslan Zherebin, David Nalewajek
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Publication number: 20020037941Abstract: A low dielectric constant material has a polymeric network that is fabricated from a first and a second component. The first component comprises a polymeric strand, and the second component comprises a molecule having a central portion with at least three arms extending from the central portion, wherein each of the arms includes a backbone with a reactive group. The first component and the second component form the polymeric network in a reaction that involves at least one of the reactive groups when the first and second components are thermally activated. Contemplated low dielectric constant materials are advantageously employed in the fabrication of electronic devices, and particularly contemplated devices include integrated circuits.Type: ApplicationFiled: December 3, 2001Publication date: March 28, 2002Inventors: Kreisler S. Lau, Feng Quan Liu, Boris Korolev, Emma Brouk, Ruslan Zherebin, David Nalewajek