Patents by Inventor Kreistler S. Y. Lau

Kreistler S. Y. Lau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polycarbosilane adhesion promoters for low dielectric constant polymeric materials
    Patent number: 6780517
    Abstract: The adhesion of low k poly(arylene ether) dielectric coating compositions is effectively enhanced by a polycarbosilane promoter additive or primer. A coating composition is prepared by (a) providing a poly(arylene ether) composition; and (b) adding to said composition a small effective adhesion promoting amount of certain polycarbosilanes. The adhesion enhanced coating compositions are cured by heat treatment at temperatures in excess of 50° C. to form a polycarbosilane-modified poly(arylene ether) polymer composition having a low k dielectric constant for use in semiconductor devices.
    Type: Grant
    Filed: June 4, 2002
    Date of Patent: August 24, 2004
    Assignee: Honeywell International Inc.
    Inventors: Tian-An Chen, Anna M. George, Kreistler S. Y. Lau, Hui-Jung Wu
  • Polycarbosilane adhesion promoters for low dielectric constant polymeric materials
    Patent number: 6761975
    Abstract: The adhesion of low k poly(arylene ether) dielectric coating compositions is effectively enhanced by a polycarbosilane promoter additive or primer. A coating composition is prepared by (a) providing a poly(arylene ether) composition; and (b) adding to said composition a small effective adhesion promoting amount of certain polycarbosilanes. The adhesion enhanced coating compositions are cured by heat treatment at temperatures in excess of 50° C. to form a polycarbosilane-modified poly(arylene ether) polymer composition having a low k dielectric constant for use in semiconductor devices.
    Type: Grant
    Filed: December 23, 1999
    Date of Patent: July 13, 2004
    Assignee: Honeywell International Inc.
    Inventors: Tian-An Chen, Anna M. George, Kreistler S. Y. Lau, Hui-Jung Wu
  • Polycarbosilane adhesion promoters for low dielectric constant polymeric materials
    Publication number: 20020198353
    Abstract: The adhesion of low k poly(arylene ether) dielectric coating compositions is effectively enhanced by a polycarbosilane promoter additive or primer. A coating composition is prepared by (a) providing a poly(arylene ether) composition; and (b) adding to said composition a small effective adhesion promoting amount of certain polycarbosilanes. The adhesion enhanced coating compositions are cured by heat treatment at temperatures in excess of 50° C. to form a polycarbosilane-modified poly(arylene ether) polymer composition having a low k dielectric constant for use in semiconductor devices.
    Type: Application
    Filed: June 4, 2002
    Publication date: December 26, 2002
    Applicant: Honeywell International Inc.
    Inventors: Tian-An Chen, Anna M. George, Kreistler S. Y. Lau, Hui-Jung Wu