Patents by Inventor Kripa Chauhan

Kripa Chauhan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240113047
    Abstract: Various embodiments disclosed relate to embedded components in glass core layers for semiconductor assemblies. The present disclosure includes a semiconductor assembly with a glass core having one or more cavities and a component embedded into the glass core at the one or more cavities portion, the component at least partially embedded in the glass core, and a semiconductor die attached to the substrate.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 4, 2024
    Inventors: Srinivasan Raman, Brandon C. Marin, Suddhasattwa Nad, Gang Duan, Benjamin Duong, Srinivas Venkata Ramanuja Pietambaram, Kripa Chauhan