Patents by Inventor Kripesh Vaidyanathan

Kripesh Vaidyanathan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding stress testing arrangement and method of determining stress
    Patent number: 9506823
    Abstract: A bonding stress testing arrangement and a method of determining stress are provided. The bonding stress testing arrangement includes at least one bond pad; a sensor assembly comprising any one of a first sensor arrangement, a second sensor arrangement and a combination of the first sensor arrangement and the second sensor arrangement; wherein the first sensor arrangement is adapted to measure an average stress on a portion of a bonding area under the at least one bond pad, and the second sensor arrangement is adapted to determine stress distribution over a portion or an entire of the bonding area under the at least one bond pad.
    Type: Grant
    Filed: May 3, 2011
    Date of Patent: November 29, 2016
    Assignee: Agency for Science, Technology and Research
    Inventors: Cheryl Sharmani Selvanayagam, Xiaowu Zhang, Tai Chong Chai, Alastair David Trigg, Cheng Kuo Cheng, Xian Tong Chen, Kripesh Vaidyanathan
  • NEURO-PROBE DEVICE, IMPLANTABLE ELECTRONIC DEVICE AND METHOD OF FORMING A NEURO-PROBE DEVICE
    Publication number: 20150148644
    Abstract: A neuro-probe device is provided. The neuro-probe device includes a carrier including bio-resorbable glass, and a neuro-probe mounted on the carrier.
    Type: Application
    Filed: May 7, 2013
    Publication date: May 28, 2015
    Inventors: Kripesh Vaidyanathan, Ruiqi Lim, Riyas Katayan Fazalul Rahuman, Woo Tae Park, Anupama Vijay Govindarajan, Minkyu Je
  • Bonding Stress Testing Arrangement and Method of Determining Stress
    Publication number: 20130199303
    Abstract: A bonding stress testing arrangement and a method of determining stress are provided. The bonding stress testing arrangement includes at least one bond pad; a sensor assembly comprising any one of a first sensor arrangement, a second sensor arrangement and a combination of the first sensor arrangement and the second sensor arrangement; wherein the first sensor arrangement is adapted to measure an average stress on a portion of a bonding area under the at least one bond pad, and the second sensor arrangement is adapted to determine stress distribution over a portion or an entire of the bonding area under the at least one bond pad.
    Type: Application
    Filed: May 3, 2011
    Publication date: August 8, 2013
    Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
    Inventors: Cheryl Sharmani Selvanayagam, Xiaowu Zhang, Tai Chong Chai, Alastair David Trigg, Cheng Kuo Cheng, Xian Tong Chen, Kripesh Vaidyanathan