Patents by Inventor Kris A. Slesinger
Kris A. Slesinger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20040003882Abstract: A method of mounting a component on a substrate includes applying a conductive adhesive on a contact pad joined to a substrate, aligning a component with the substrate such that at least one lead of the component is juxtaposed with the conductive adhesive, performing a partial cure of the conductive adhesive, testing performance of the component, and performing a full cure of the conductive adhesive. Another method includes the additional steps of applying a tacky film to the substrate and juxtaposing the component with the tacky film. When the testing in either embodiment shows a defective or misaligned component, the component may be replaced or repositioned by cold separation of the at least one component lead from the partially cured conductive adhesive. Optionally, additional conductive adhesive may be applied, when needed, before replacement or repositioning of a component.Type: ApplicationFiled: April 4, 2003Publication date: January 8, 2004Inventors: John G. Davis, Joseph D. Poole, Kris A. Slesinger, Michael C. Weller
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Patent number: 6633663Abstract: A method and system for determining component dimensional information in a component placement system. The component information is derived from the pick and place equipment which is used to place the components on the substrate. The component is grasped at substantially the centroid position and moved over the aperture of a camera. The edges of the component are located, and from the edges an accurate location of the centroid may be obtained. The centroid, as well as the length, width and thickness of the component is stored in a database for use during placing of the component. Other features derived include orientation indicia obtained from component features which are viewed by the camera. During placement, all features associated with the component necessary to accurately locate the component on a substrate are obtained from the database.Type: GrantFiled: May 5, 1998Date of Patent: October 14, 2003Assignee: International Business Machines CorporationInventor: Kris A. Slesinger
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Patent number: 6589376Abstract: A method of mounting a component on a substrate includes applying a conductive adhesive on a contact pad joined to a substrate, aligning a component with the substrate such that at least one lead of the component is juxtaposed with the conductive adhesive, performing a partial cure of the conductive adhesive, testing performance of the component, and performing a full cure of the conductive adhesive. Another method includes the additional steps of applying a tacky film to the substrate and juxtaposing the component with the tacky film. When the testing in either embodiment shows a defective or misaligned component, the component may be replaced or repositioned by cold separation of the at least one component lead from the partially cured conductive adhesive. Optionally, additional conductive adhesive may be applied, when needed, before replacement or repositioning of a component.Type: GrantFiled: April 28, 1998Date of Patent: July 8, 2003Assignee: International Business Machines CorporationInventors: John G. Davis, Joseph D. Poole, Kris A. Slesinger, Michael C. Weller
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Patent number: 6590285Abstract: A method of mounting a component on a substrate includes applying a conductive adhesive on a contact pad joined to a substrate, aligning a component with the substrate such that at least one lead of the component is juxtaposed with the conductive adhesive, performing a partial cure of the conductive adhesive, testing performance of the component, and performing a full cure of the conductive adhesive. Another method includes the additional steps of applying a tacky film to the substrate and juxtaposing the component with the tacky film. When the testing in either embodiment shows a defective or misaligned component, the component may be replaced or repositioned by cold separation of the at least one component lead from the partially cured conductive adhesive. Optionally, additional conductive adhesive may be applied, when needed, before replacement or repositioning of a component.Type: GrantFiled: November 28, 2000Date of Patent: July 8, 2003Assignee: International Business Machines CorporationInventors: John G. Davis, Joseph D. Poole, Kris A. Slesinger, Michael C. Weller
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Patent number: 6499644Abstract: A method and apparatus for desoldering electronic components from a substrate. A vacuum is used to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor is added to the hot gas to increase the heat capacity of the hot gas. A system for periodically changing the direction of flow of the hot gas and vacuum under the electronic component is used to uniformly heat the solder connections. A method and apparatus for depositing underfill material between an electronic component and the substrate on which the electronic component is mounted. A vacuum is applied to enhance the flow of underfill material into the space between the electronic component and the substrate.Type: GrantFiled: February 14, 2001Date of Patent: December 31, 2002Assignee: International Business Machines CorporationInventors: Wilton L. Cox, Joseph D. Poole, Kris A. Slesinger
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Patent number: 6464125Abstract: A method and apparatus for desoldering electronic components from a substrate. A vacuum is used to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor is added to the hot gas to increase the heat capacity of the hot gas. A system for periodically changing the direction of flow of the hot gas and vacuum under the electronic component is used to uniformly heat the solder connections. A method and apparatus for depositing underfill material between an electronic component and the substrate on which the electronic component is mounted. A vacuum is applied to enhance the flow of underfill material into the space between the electronic component and the substrate.Type: GrantFiled: February 14, 2001Date of Patent: October 15, 2002Assignee: International Business Machines CorporationInventors: Wilton L. Cox, Joseph D. Poole, Kris A. Slesinger
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Patent number: 6457631Abstract: A method and apparatus for desoldering electronic components from a substrate. A vacuum is used, to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor is added to the hot gas to increase the heat capacity of the hot gas. A system for periodically changing the direction of flow of the hot gas and vacuum under the electronic component is used to uniformly heat the solder connections. A method and apparatus for depositing underfill material between an electronic component and the substrate on which the electronic component is mounted. A vacuum is applied to enhance the flow of underfill material into the space between the electronic component and the substrate.Type: GrantFiled: January 31, 2001Date of Patent: October 1, 2002Assignee: International Business Machines CorporationInventors: Wilton L. Cox, Joseph D. Poole, Kris A. Slesinger
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Publication number: 20020117535Abstract: Method and apparatus for desoldering electronic compo from a substrate. A vacuum is used, to enhance the f a hot gas under an electronic component to reflo solder connections attaching the electronic compo o a substrate. Water vapor is added to the hot gas t ease the heat capacity of the hot gas. A system for p cally changing the direction of flow of the hot gas a uum under the electronic component is used to unifo eat the solder connections.Type: ApplicationFiled: February 14, 2001Publication date: August 29, 2002Inventors: Wilton L. Cox, Joseph D. Poole, Kris A. Slesinger
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Patent number: 6264094Abstract: A method and apparatus for desoldering electronic components from a substrate. A vacuum is used to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor is added to the hot gas to increase the heat capacity of the hot gas. A system for periodically changing the direction of flow of the hot gas and vacuum under the electronic component is used to uniformly heat the solder connections. A method and apparatus for depositing underfill material between an electronic component and the substrate on which the electronic component is mounted. A vacuum is applied to enhance the flow of underfill material into the space between the electronic component and the substrate.Type: GrantFiled: February 23, 2000Date of Patent: July 24, 2001Assignee: International Business Machines CorporationInventors: Wilton L. Cox, Joseph D. Poole, Kris A. Slesinger
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Publication number: 20010006185Abstract: A method and apparatus for desoldering electronic components from a substrate. A vacuum is used, to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor is added to the hot gas to increase the heat capacity of the hot gas. A system for periodically changing the direction of flow of the hot gas and vacuum under the electronic component is used to uniformly heat the solder connections.Type: ApplicationFiled: February 14, 2001Publication date: July 5, 2001Inventors: Wilton L. Cox, Joseph D. Poole, Kris A. Slesinger
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Publication number: 20010004990Abstract: A method and apparatus for desoldering electronic components from a substrate. A vacuum is used, to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor is added to the hot gas to increase the heat capacity of the hot gas. A system for periodically changing the direction of flow of the hot gas and vacuum under the electronic component is used to uniformly heat the solder connections.Type: ApplicationFiled: January 31, 2001Publication date: June 28, 2001Inventors: Wilton L. Cox, Joseph D. Poole, Kris A. Slesinger
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Patent number: 6220503Abstract: A method and apparatus for desoldering electronic components from a substrate. A vacuum is used to enhance the flow of a hot gas under an electronic component to reflow the solder connections attaching the electronic component to a substrate. Water vapor is added to the hot gas to increase the heat capacity of the hot gas. A system for periodically changing the direction of flow of the hot gas and vacuum under the electronic component is used to uniformly heat the solder connections. A method and apparatus for depositing underfill material between an electronic component and the substrate on which the electronic component is mounted. A vacuum is applied to enhance the flow of underfill material into the space between the electronic component and the substrate.Type: GrantFiled: February 2, 1999Date of Patent: April 24, 2001Assignee: International Business Machines CorporationInventors: Wilton L. Cox, Joseph D. Poole, Kris A. Slesinger