Patents by Inventor Kris J. Whittenburg

Kris J. Whittenburg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated heat spreader package for heat transfer and for bond line thickness control and process of making
    Patent number: 6867978
    Abstract: A system includes a thermal interface material (TIM) to transfer heat from a die to a heat spreader. The system includes a heat transfer subsystem disposed on the backside surface of the die. In one embodiment, the heat transfer subsystem comprises a first heat transfer material and a second heat transfer material discretely disposed within the first heat transfer material. A method of bonding a die to a heat spreader uses a die-referenced process as opposed to a substrate-referenced process.
    Type: Grant
    Filed: October 8, 2002
    Date of Patent: March 15, 2005
    Assignee: Intel Corporation
    Inventors: Kris J. Whittenburg, Fay Hua, Carl L. Deppisch, Sabina J. Houle, Peter Brandenburger, Kim L. Phillippe
  • Integrated heat spreader package for heat transfer and for bond line thickness control and process of making
    Publication number: 20040066630
    Abstract: A system includes a thermal interface material (TIM) to transfer heat from a die to a heat spreader. The system includes a heat transfer subsystem disposed on the backside surface of the die. In one embodiment, the heat transfer subsystem comprises a first heat transfer material and a second heat transfer material discretely disposed within the first heat transfer material. A method of bonding a die to a heat spreader uses a die-referenced process as opposed to a substrate-referenced process.
    Type: Application
    Filed: October 8, 2002
    Publication date: April 8, 2004
    Inventors: Kris J. Whittenburg, Fay Hua, Carl L. Deppisch, Sabina J. Houle, Peter Brandenburger, Kim L. Phillippe