Patents by Inventor Kris Rexroad

Kris Rexroad has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080142252
    Abstract: An epoxy filled via hole in a printed circuit board is presented. The epoxy filled via hole may have metal plating between the epoxy and the via hole walls of the printed circuit board. The epoxy filled via hole may have a land pad directly over the epoxy filling, creating a compact contact area for an ATE interposer.
    Type: Application
    Filed: December 13, 2006
    Publication date: June 19, 2008
    Inventors: Romi Mayder, Kris Rexroad, Pamela Stellmacher