Patents by Inventor Kris Vanstreels

Kris Vanstreels has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • FABRICATION OF POROGEN RESIDUES FREE AND MECHANICALLY ROBUST LOW-K MATERIALS
    Publication number: 20110006406
    Abstract: A method is provided for producing a porogen-residue-free ultra low-k film with porosity higher than 50% and a high elastic modulus above 5 GPa. The method starts with depositing a SiCOH film using Plasma Enhanced Chemical Vapor Deposition (PE-CVD) or Chemical Vapor Deposition (CVD) onto a substrate and then first Performing an atomic hydrogen treatment at elevated wafer temperature in the range of 200° C. up to 350° C. to remove all the porogens and then performing a UV assisted thermal curing step.
    Type: Application
    Filed: July 7, 2010
    Publication date: January 13, 2011
    Applicants: IMEC, Katholieke Universiteit Leuven, K.U. LEUVEN R&D
    Inventors: Adam Michal Urbanowicz, Patrick Verdonck, Denis Shamiryan, Kris Vanstreels, Mikhail Baklanov, Stefan De Gendt