Abstract: An alignment sensor apparatus includes an illumination system, a first optical system, a second optical system, a detector system, and a processor. The illumination system is configured to transmit an illumination beam along an illumination path. The first optical system is configured to transmit the illumination beam toward a diffraction target on a substrate. The second optical system includes a first polarizing optic configured to separate and transmit an irradiance distribution. The detector system is configured to measure a center of gravity of the diffraction target based on the irradiance distribution outputted from a first polarization branch and a second polarization branch. The processor is configured to measure a shift in the center of gravity of the diffraction target caused by an asymmetry variation in the diffraction target and determine a sensor response function of the alignment sensor apparatus based on the center of gravity shift.

Abstract: An apparatus and system for determining alignment of a substrate in which a periodic alignment mark is illuminated with spatially coherent radiation which is then provided to a compact integrated optical device to create self images of the alignment mark which may be manipulated (e.g., mirrored, polarized) and combined to obtain information on the position of the mark and distortions within the mark. Also disclosed is a system for determining alignment of a substrate in which a periodic alignment mark is illuminated with spatially coherent radiation which is then provided to an optical fiber arrangement to obtain information such as the position of the mark and distortions within the mark.

Abstract: A method including illuminating a product test substrate with radiation from a component, wherein the product test substrate does not have a device pattern etched therein and yields a non-zero sensitivity when illuminated, the non-zero sensitivity representing a change in an optical response characteristic of the product test substrate with respect to a change in a characteristic of the radiation; measuring at least a part of the radiation redirected by the product test substrate to determine a parameter value; and taking an action with respect to the component based on the parameter value.

Abstract: An alignment sensor apparatus includes an illumination system, a first optical system, a second optical system, a detector system, and a processor. The illumination system is configured to transmit an illumination beam along an illumination path. The first optical system is configured to transmit the illumination beam toward a diffraction target on a substrate. The second optical system includes a first polarizing optic configured to separate and transmit an irradiance distribution. The detector system is configured to measure a center of gravity of the diffraction target based on the irradiance distribution outputted from a first polarization branch and a second polarization branch. The processor is configured to measure a shift in the center of gravity of the diffraction target caused by an asymmetry variation in the diffraction target and determine a sensor response function of the alignment sensor apparatus based on the center of gravity shift.

Abstract: A system for and method of processing a wafer in which a scan signal is analyzed locally to extract information about alignment, overlay, mark quality, wafer quality, and the like.

Abstract: An optical system for improving alignment measurement accuracy is discussed. The optical system includes first and second optical elements. The first optical element may be configured to change a first beam having a first polarization state into a second beam having a second polarization state. The second optical element may be configured to provide total internal reflection of the second beam and to change the second beam into a third beam having a third polarization state. The first, second, and third polarization states may be different from each other.

Abstract: A method including illuminating a product test substrate with radiation from a component, wherein the product test substrate does not have a device pattern etched therein and yields a non-zero sensitivity when illuminated, the non-zero sensitivity representing a change in an optical response characteristic of the product test substrate with respect to a change in a characteristic of the radiation; measuring at least a part of the radiation redirected by the product test substrate to determine a parameter value; and taking an action with respect to the component based on the parameter value.

Abstract: A metrology system includes a radiation source that generates light, an optical modulation unit, a reflector, an interferometer, and a detector. The optical modulating unit temporally separates a first polarization mode of the light from a second polarization mode of the light. The reflector directs the light towards a substrate. The interferometer interferes the diffracted light from a pattern on the substrate, or reflected light from the substrate, and produces output light from the interference. The detector receives the output light from the interferometer. The first and second polarization modes of the output light are temporally separated at the detector. Additionally, an optical rotator can be configured to receive the first polarized light and rotate the polarization of the first polarized light.

Abstract: An alignment system obtains the characteristics of the light coming back from a wafer stack. A beam analyzer measures changes in wavelength, polarization, and beam profile. This measured information allows for in-line process variation corrections. The correction provides optical monitoring of individual mark stack variations, and in turn provides information to reduce individual mark process variation-induced accuracy error.

Abstract: A metrology system includes a radiation source that generates light, an optical modulation unit, a reflector, an interferometer, and a detector. The optical modulating unit temporally separates a first polarization mode of the light from a second polarization mode of the light. The reflector directs the light towards a substrate. The interferometer interferes the diffracted light from a pattern on the substrate, or reflected light from the substrate, and produces output light from the interference. The detector receives the output light from the interferometer. The first and second polarization modes of the output light are temporally separated at the detector. Additionally, an optical rotator can be configured to receive the first polarized light and rotate the polarization of the first polarized light.

Abstract: An alignment system obtains the characteristics of the light coming back from a wafer stack. A beam analyzer measures changes in wavelength, polarization, and beam profile. This measured information allows for in-line process variation corrections. The correction provides optical monitoring of individual mark stack variations, and in turn provides information to reduce individual mark process variation-induced accuracy error.

Abstract: A metrology system includes a radiation source that generates light, an optical modulation unit, a reflector, an interferometer, and a detector. The optical modulating unit temporally separates a first polarization mode of the light from a second polarization mode of the light. The reflector directs the light towards a substrate. The interferometer interferes the diffracted light from a pattern on the substrate, or reflected light from the substrate, and produces output light from the interference. The detector receives the output light from the interferometer. The first and second polarization modes of the output light are temporally separated at the detector.

Abstract: A metrology system includes a radiation source that generates light, an optical modulation unit, a reflector, an interferometer, and a detector. The optical modulating unit temporally separates a first polarization mode of the light from a second polarization mode of the light. The reflector directs the light towards a substrate. The interferometer interferes the diffracted light from a pattern on the substrate, or reflected light from the substrate, and produces output light from the interference. The detector receives the output light from the interferometer. The first and second polarization modes of the output light are temporally separated at the detector.

Abstract: An optical system for improving alignment measurement accuracy is discussed. The optical system includes first and second optical elements. The first optical element may be configured to change a first beam having a first polarization state into a second beam having a second polarization state. The second optical element may be configured to provide total internal reflection of the second beam and to change the second beam into a third beam having a third polarization state. The first, second, and third polarization states may be different from each other.