Abstract: A semiconductor package comprises a substrate having a first side and the second side, the second side comprising interconnect joints. One or more die stacks are over the first side of the substrate. An inner mold material having a low Young's modulus of less than 2500 MPa encapsulates the one or more die stacks. An outer mold material having a higher Young's modulus encapsulates the inner mold material.

Abstract: Embodiments disclosed herein include an electronic package and methods of forming an electronic package. In an embodiment, the electronic package comprises a package substrate and a die on the package substrate. In an embodiment, the die is attached to the package substrate by a die attach film. In an embodiment, the electronic package further comprises a sidewall bumper surrounding sidewalls of the die. In an embodiment, the electronic package further comprises a mold layer over the die and the package substrate.

Abstract: In one embodiment, a honeycomb structure formed from ceramic material, or ceramic honeycomb structure, includes at least one outer wall defining a perimeter of the honeycomb structure. A plurality of primary zone partitions and secondary zone partitions may extend in an axial direction of the honeycomb structure and across a width of the honeycomb structure. The primary zone partitions and the secondary zone partitions intersect with one another to divide a radial cross section of the honeycomb structure into a plurality of zones. The primary zone partitions and the secondary zone partitions may have a single-wall thickness with a maximum thickness Tzmax. Each zone may comprise a plurality of channel walls intersecting to subdivide the zone into a plurality of through channels extending in the axial direction of the honeycomb structure, the plurality of channel walls within each zone having a thickness of at least tc and TZmax>2tC.

Abstract: Methods of strengthening the edge surfaces of a glass substrate, and particularly glass substrates contained within a display panel, are disclosed. The methods include exposing edges of the display panel to an acid solution for a time and at a temperature effective to remove no more than about 20 micrometers of glass from edge surfaces, rinsing the acid solution from the edge and applying a polymer protective coating the rinsed edge to maintain the post-etching strength of the edge surfaces. Electronics on the display panel that may be exposed to the acid solution are masked with a terminal mask prior to the etching. The edge etching may be combined with etching of a surface of the display panel/cover glass substrate.

Abstract: Methods of strengthening the edge surfaces of a glass substrate, and particularly glass substrates contained within a display panel, are disclosed. The methods include exposing edges of the display panel to an acid solution for a time and at a temperature effective to remove no more than about 20 micrometers of glass from edge surfaces, rinsing the acid solution from the edge and applying a polymer protective coating the rinsed edge to maintain the post-etching strength of the edge surfaces. Electronics on the display panel that may be exposed to the acid solution are masked with a terminal mask prior to the etching. The edge etching may be combined with etching of a surface of the display panel/cover glass substrate.