Patents by Inventor Krishna IYER

Krishna IYER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240094488
    Abstract: The present invention is directed to microfluidics systems, instruments, and cartridges including self-aligning optical fiber systems and methods of use thereof. More specifically, the disclosure describes a microfluidics instrument including an optical detection system, microfluidics cartridge, and a self-aligning optical fiber system capable of coupling the microfluidics instrument and the microfluidics cartridge. Further, the disclosure provides methods of optical detection operations using a microfluidics system.
    Type: Application
    Filed: November 27, 2023
    Publication date: March 21, 2024
    Inventors: Krishna Iyer, Eikky Lim Eng Kuan, Gordon H. Hall
  • Patent number: 11927530
    Abstract: A plasmon resonance (PR) system, instrument, and/or device and configurations thereof for measuring molecular interactions is disclosed. In some embodiments, the PR system, instrument, and/or device is a localized surface plasmon resonance (LSPR) system, instrument, and/or device. In other embodiments, the PR system, instrument, and/or device is a surface plasmon resonance (SPR) system, instrument. The PR system, instrument, and/or device may include, for example, force feedback for reliable flow cell sealing, optical feedback for reliable flow cell sealing, local thermal control of an LSPR chip (e.g., a ring Peltier, a continuous Peltier), dual displacement pumps for constant flow delivery to a microfluidic device, a dual channel LSPR sensor, and any combinations thereof.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: March 12, 2024
    Assignee: Nicoya Lifesciences Inc.
    Inventors: Ryan Denomme, Shawn Fitzpatrick, Jason Garr, Krishna Iyer, Gordon Hall, Champika Samarasekera
  • Publication number: 20230330656
    Abstract: A pipette dispenser vision system and method are disclosed. For example, a pipette dispenser vision system is provided for tracking pipettes with respect to dispensing liquid into target fluid wells, vessels, and/or reservoirs. The presently disclosed pipette dispenser vision system may include, for example, a computing device, a red/green/blue (RGB) imaging device, an infrared (IR) imaging device, an IR illumination source, and an IR sensor; all arranged with respect to, for example, a single-channel and/or a multi-channel pipette for dispensing liquid into a dispensing platform. Further, a method of using the presently disclosed pipette dispenser vision system is provided. For example, the method processes image data from the RGB imaging device and/or the IR imaging device to monitor/verify certain operations of the pipetting process and/or dispensing platform.
    Type: Application
    Filed: September 7, 2021
    Publication date: October 19, 2023
    Inventors: Ryan Cameron DENOMME, Krishna IYER, Patrick STERLINA, Gordon H. HALL, Arjun SUDARSAN
  • Publication number: 20230017547
    Abstract: A cartridge for use with an instrument to perform measurement of a fluid, including a digital microfluidics substrate comprising a plurality of electrowetting electrodes operative to perform droplet operations on a liquid droplet in a droplet operations gap; a top plate separated from the digital microfluidics substrate to form a droplet operations gap and comprising openings for injecting liquids into the droplet operations gap; a fiber assembly comprising a fiber optic probe projecting into the droplet operations gap and having a sensing end situated in proximity with one or more of the electrowetting electrodes.
    Type: Application
    Filed: July 21, 2022
    Publication date: January 19, 2023
    Inventors: Krishna IYER, Gordon H. HALL, Champika SAMARASEKERA, Ryan Cameron DENOMME
  • Publication number: 20230009923
    Abstract: A digital microfluidic (DMF) system, DMF cartridge, and method including integrated refractive index (RI) sensing is disclosed. The digital microfluidic DMF system and DMF cartridge may include, for example, a RI sensor (or sensor surface) directly in the droplet operations gap of a DMF cartridge. The digital microfluidic DMF system may include, for example, the DMF cartridge, one or more illumination sources, one or more optical measurement devices, and a controller. Additionally, a method of using the DMF system and DMF cartridge that includes integrated RI sensing is provided.
    Type: Application
    Filed: July 21, 2022
    Publication date: January 12, 2023
    Inventors: Krishna IYER, Ryan DENOMME
  • Publication number: 20220003673
    Abstract: A plasmon resonance (PR) system, instrument, and/or device and configurations thereof for measuring molecular interactions is disclosed. In some embodiments, the PR system, instrument, and/or device is a localized surface plasmon resonance (LSPR) system, instrument, and/or device. In other embodiments, the PR system, instrument, and/or device is a surface plasmon resonance (SPR) system, instrument. The PR system, instrument, and/or device may include, for example, force feedback for reliable flow cell sealing, optical feedback for reliable flow cell sealing, local thermal control of an LSPR chip (e.g., a ring Peltier, a continuous Peltier), dual displacement pumps for constant flow delivery to a microfluidic device, a dual channel LSPR sensor, and any combinations thereof.
    Type: Application
    Filed: September 30, 2019
    Publication date: January 6, 2022
    Inventors: Ryan Denomme, Shawn Fitzpatrick, Jason Garr, Krishna Iyer, Gordon Hall, Champika Samarasekera
  • Publication number: 20220006750
    Abstract: Examples described herein relate to a network interface device comprising a packet transmission scheduler. In some examples, the packet transmission scheduler is to: perform packet transmit arbitration among nodes, wherein based on a first node of the nodes having transmission paused by flow control, the perform packet transmit arbitration among nodes comprises retain relative priority of a packet departure time for the first node with respect to a second packet departure time associated with a second node of the nodes during a duration of flow control. In some examples, retaining relative priority of a packet departure time for the first node with respect to a second packet departure time associated with a second node of the nodes during a duration of flow control comprises adjust the packet departure time and the second packet departure time to stay within a time window but not rollover.
    Type: Application
    Filed: September 14, 2021
    Publication date: January 6, 2022
    Inventors: Sarig LIVNE, Noam ELATI, Hemanth KRISHNAN, Venkidesh KRISHNA IYER, Adam CONYERS, Michael G. LEFEVRE
  • Publication number: 20210117360
    Abstract: Examples described herein include a system comprising: a processing unit package comprising: at least one core and at least one offload processing device communicatively coupled inline between the at least one core and a network interface controller, the at least one offload processing device configurable to perform packet processing. In some examples, the at least one offload processing device is to allow mapping of packet processing pipeline stages of networking applications among software running on the at least one core and the at least one offload processing device to permit flexible entry, exit, and re-entry points among the at least one core and the at least one offload processing device.
    Type: Application
    Filed: December 26, 2020
    Publication date: April 22, 2021
    Inventors: Patrick G. KUTCH, Andrey CHILIKIN, Niall D. MCDONNELL, Brian A. KEATING, Naveen LAKKAKULA, Ilango S. GANGA, Venkidesh KRISHNA IYER, Patrick FLEMING, Lokpraveen MOSUR
  • Patent number: 10458965
    Abstract: A device and system for optically analyzing food products is provided. The device comprises first and second imaging devices respectively sensitive to first and second wavelengths; the imaging devices include a line-scan camera to acquire images of food products at a line in a food-path-facing direction, and a line-scan spectrometer to acquire spectroscopic images at the line. The device includes an optical filter configured to: convey the first wavelengths from the line to the first imaging device; and convey the second wavelengths from the line to the second imaging device. The device includes a frame to align the optical filter and respective optical axes of the first and second imaging devices, relative to each other and the food-path-facing direction, such that the first imaging device and the second imaging device are optically aligned via the optical filter to image the line.
    Type: Grant
    Filed: August 15, 2018
    Date of Patent: October 29, 2019
    Assignee: P & P OPTICA INC.
    Inventors: Krishna Iyer, Olga Ewa Pawluczyk, Bradley Oldenburg, Simon Guthrie, Timothy M. F. Stork, Ewa Osika, David William Lizius, Romuald Pawluczyk, Anthony Robert Shaw, Alexander Baran-Harper
  • Patent number: 10323983
    Abstract: A lamp for illuminating food products along a line is provided. The lamp comprises: a housing having a longitudinal axis and an opening along the longitudinal axis; a light source located in the housing along the longitudinal axis; a reflector positioned in the housing along the longitudinal axis, the reflector to reflect light from the light source through the opening and focus the light along the line; a removeable frame attached to the housing around the opening, the removeable frame having an aperture aligned with the opening along the longitudinal axis; a glass window in the aperture; a transparent polymer film in the aperture at an outward facing side of the glass window, each of the glass window and the transparent polymer film extending into the removeable frame past a perimeter of the aperture; and a seal between the transparent polymer film and the perimeter of the aperture.
    Type: Grant
    Filed: August 15, 2018
    Date of Patent: June 18, 2019
    Assignee: P & P OPTICA INC.
    Inventors: Krishna Iyer, Timothy M. F. Stork, Ewa Osika, David William Lizius, Romuald Pawluczyk, Anthony Robert Shaw, Alexander Baran-Harper
  • Publication number: 20160044520
    Abstract: A system and method are provided for testing mobile applications. A set of mobile devices, a set of applications associated with the mobile devices, and a set of test cases each associated with at least one of the applications are registered at a server. A set of test stations for executing the set of test cases are also registered at the server. Execution of one or more of the test cases on one or more mobile devices at one or more of the test stations is scheduled based on a user request received from at least one client device. Timing of the scheduled test cases is analyzed to determine occurrence of the scheduling time. The scheduled test cases are automatically executed on the test stations with ability to capture necessary logs and screenshot. The execution results are sent to the client device for display to the user for evaluation.
    Type: Application
    Filed: August 11, 2014
    Publication date: February 11, 2016
    Inventors: Krishna IYER, Arulvadivel VENUGOPAL
  • Patent number: 7977758
    Abstract: Disclosed are ferroelectric and ferromagnetic noise isolation structures that reduce electromagnetic interference and noise in integrated circuit devices and system architectures. Representative structures comprise two or more devices that are vertically disposed relative to one another, and a thin ferroelectric or ferromagnetic film layer disposed between the respective devices that isolates electromagnetic energy coupling from one device to another.
    Type: Grant
    Filed: June 20, 2008
    Date of Patent: July 12, 2011
    Assignee: Georgia Tech Research Corporation
    Inventors: Markondeya Raj Pulugurtha, Madhaven Swaminathan, Mahadevan Krishna Iyer, Rao Tummala, Isaac Robin Abothu, Jin Hyun Hwang
  • Publication number: 20100170086
    Abstract: A magnetically-assisted chip assembly unit for assembling at least one chip having a mounting surface and an attachment surface, wherein the attachment surface supports a magnetisable layer thereon and opposes said mounting surface, onto a substrate that has a corresponding chip mounting surface. The unit comprises a template wafer having at least one recess adapted to accommodate therein said chip; and a master wafer having at least one magnetisable element; wherein the template wafer is mounted on the master wafer and said magnetisable element is located at least proximate to the at least one recess such that the magnetisable element is capable of manipulating the chip into the recess, via its magnetisable layer when the magnetisable element is magnetized and generates a magnetic field. Once in the recess, the attachment surface of the chip faces at least a portion of the recess and the mounting surface of the chip faces an opening of the recess.
    Type: Application
    Filed: November 3, 2006
    Publication date: July 8, 2010
    Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
    Inventors: Qasem Ramadan, Seung Uk Yoon, Vaidyanathan Kripesh, Poi Siong Teo, Mahadevan Krishna Iyer
  • Publication number: 20100103639
    Abstract: Disclosed are ferroelectric and ferromagnetic noise isolation structures that reduce electromagnetic interference and noise in integrated circuit devices and system architectures. Representative structures comprise two or more devices that are vertically disposed relative to one another, and a thin ferroelectric or ferromagnetic film layer disposed between the respective devices that isolates electromagnetic energy coupling from one device to another.
    Type: Application
    Filed: June 20, 2008
    Publication date: April 29, 2010
    Inventors: Markondeya Raj Pulugurtha, Jin Hyun Hwang, Isaac Robin Abothu, Mahadevan Krishna Iyer, Rao Tummala, Madhavan Swaminathan
  • Patent number: 7189594
    Abstract: A wafer level package formed on an integrated circuit chip having bondpads and a fabrication method therefor is disclosed. The wafer level package comprises at least one first, second and third separation layer having at least one first and second conductive layer formed in-between the separation layers. The at least one first conductive layer is formed on the at least one first separation layer and is coupled to the bondpads. The at least one second conductive layer is formed on the at last one second separation layer wherein the at least one second conductive layer is electrically coupled to the at least one first conductive layer. The at least one third separation layer allows solder to be attached to the at least one second conductive layer for electrically coupling the solder to the bondpads. A chip ground plane is laid in the integrated circuit chip for providing a ground to the at least one first conductive layer and the solder.
    Type: Grant
    Filed: September 10, 2004
    Date of Patent: March 13, 2007
    Assignee: Agency for Science, Technology and Research
    Inventors: Vaidyanathan Kripesh, Wai Kwan Wong, Mihai Dragos Rotaru, Tai Chong Chai, Mahadevan Krishna Iyer
  • Patent number: 7178711
    Abstract: A method and device to elongate a solder joint are provided. The method begins by forming an elongator on a first substrate. The elongator comprises an expander and an encapsulant to encapsulate the expander. A solder joint is formed to connect the first substrate to a second substrate. Thereafter, the encapsulant is softened to release the expander from a compressed state to elongate the solder joint. The device to elongate a solder joint comprises a substrate having an elongator formed on it. The elongator includes an expander in a compressed state and an encapsulant to encapsulate the expander.
    Type: Grant
    Filed: September 17, 2003
    Date of Patent: February 20, 2007
    Assignees: Agency for Science, Technology and Research, National Univeristy of Singapore, Georgia Tech Research Corporation
    Inventors: Ee Hua Wong, Ranjan Rajoo, Wai Kwan Wong, Mahadevan Krishna Iyer
  • Patent number: 6879287
    Abstract: A high radiation efficiency antenna system in a package is achieved by the provision of a Dielectric Resonator Package. A Dielectric resonator package comprises a dielectric body of the package forming a dielectric resonator that resonates at radio frequency and a feed substrate having an upper and a lower surface, a feed structure formed on the upper surface of the feed substrate, and RF circuitry mounted on the lower surface of the feed substrate. The feed substrate is attached to the dielectric body of the package from the side of the feed structure.
    Type: Grant
    Filed: May 24, 2003
    Date of Patent: April 12, 2005
    Assignee: Agency for Science, Technology and Research
    Inventors: Alexander Pavlovich Popov, Mihai Dragos Rotaru, Mahadevan Krishna Iyer
  • Publication number: 20040233107
    Abstract: A high radiation efficiency antenna system in a package is achieved by the provision of a Dielectric Resonator Package. A Dielectric resonator package comprises a dielectric body of the package forming a dielectric resonator that resonates at radio frequency and a feed substrate having an upper and a lower surface, a feed structure formed on the upper surface of the feed substrate, and RF circuitry mounted on the lower surface of the feed substrate. The feed substrate is attached to the dielectric body of the package from the side of the feed structure.
    Type: Application
    Filed: May 24, 2003
    Publication date: November 25, 2004
    Inventors: Alexander Pavlovich Popov, Mihai Dragos Rotaru, Mahadevan Krishna Iyer
  • Patent number: D983682
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: April 18, 2023
    Assignee: Nicoya Lifesciences, Inc.
    Inventors: Mandy Lubjenka, Trang Tina Thi Thuy Nguyen, Ryan Denomme, Patrick Sterlina, Arjun Sudarsan, Jason Garr, Krishna Iyer, Charles Curbbun, Lee-Anne Stossell