Patents by Inventor Krishna NMN Darbha

Krishna NMN Darbha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Land grid array stiffener use with flexible chip carriers
    Patent number: 6528892
    Abstract: A flexible chip carrier with contact pads on its upper surface matching those of the chip with said pads conductively connected to land grid array (LGA) pads on its lower surface matching the those of a card or PCB. The chip carrier is provided with a stiffening layer at the LGA interface. The stiffening layer is mechanically attached to the lower surface of the chip carrier. Holes are formed in the stiffening layer to expose the LGA pads. The holes are then filled with a conductive adhesive material. Compliant LGA bumps are applied to the uncured conductive adhesive material which material is then cured.
    Type: Grant
    Filed: June 5, 2001
    Date of Patent: March 4, 2003
    Assignee: International Business Machines Corporation
    Inventors: David Vincent Caletka, Krishna NMN Darbha, William NMN Infantolino, Eric Arthur Johnson