Abstract: A method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other module components.

Abstract: A reworkable conductive adhesive composition, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix.

Abstract: Liquid compositions containing a specific hindered phenol or a hindered phenol in combination with an aromatic phosphite are provided which are used as a thermal interface between a heatsink and a chip during a test procedure for electronic components which compositions enhance the thermal conductivity between the heatsink and the chip, are easily removed from the heatsink and the chip after the test procedure without any deleterious residue and which allow the use of high temperatures for extended periods during the test procedure without any significant degradation of the composition. A method for using the compositions in electronic component test procedures such as burn-in procedures is also provided.

Abstract: A method to repair ceramic substrates is disclosed using a novel polyimide polymer which has high thermal stability, resistance to fluxes and flux residue cleaning solvents and processes, good mechanical properties, good adhesion to all contacting surfaces with low moisture uptake and good flow properties suitable for repairing chipped ceramic, filling deep trench or vias and writing passivation lines with automated process The polyimide polymer is made by reacting aromatic dianhydride and aromatic diamine monomers with a stoichiometric offset and end capping the resulting polymer when the reaction is completed. The preferred polyimide is made using a molar excess of diamine which is end-capped using an anhydride.

Abstract: Solvent-free UV-curable polymer materials derived from miscible blends of reactive organic monomeric, oligomeric and low molecular polymeric systems and organic and inorganic fillers such as polytetrafluoroethylene and talc are provided to form polymer-filler composite compositions for use in the fabrication and repair of electronic components and microelectronic assembly processes. The composition contains a preformed thermoplastic or elastomeric polymer/oligomer with reactive end groups, a monofunctional and/or bifunctional acrylate monomer, a multifunctional (more than two reactive groups) acrylated/methacrylated monomer, a photoinitiator and a fluorocarbon polymer powder as an organic filler which is preferably PTFE and an inorganic filler such as talc.

Abstract: A method for temporary chip attach to determine known good die using a reworkable conductive adhesive interconnection between the chip carrier and die. The die is easily separated from the chip carrier after test, without the use of potentially damaging shear forces, by subjecting the TCA assembly to a rework solution.

Abstract: A reworkable conductive adhesive composition, and method of making such, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix. In an additional embodiment an improved method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other module components.

Abstract: This invention relates to water-based alkaline cleaning solutions and their use as an environmentally safer replacement of organic solvents to remove photoresist, polyimide residue and other interlevel dielectric polymer coating residue from polymer film apply equipment, specifically, spin coater bowl and assembly parts consisting of a teflon top shield, stainless steel plate, and a bottom teflon spin coating bowl used in semiconductor device fabrication processes.

Abstract: This invention relates to water-based alkaline cleaning solutions and their use as an environmentally safer replacement of organic solvents to remove photoresist, polyimide residue and other interlevel dielectric polymer coating residue from polymer film apply equipment, specifically, spin coater bowl and assembly parts consisting of a teflon top shield, stainless steel plate, and a bottom teflon spin coating bowl used in semiconductor device fabrication processes.