Abstract: A method for multi-path packet scheduling in a wireless communication system comprises collecting of measurements of queue state information about buffers of a plurality of transmit nodes. A rate budget is calculated based on the collected measurements of queue state information. The rate budget comprises commanded bit rates and/or data volumes for each transmit node for a subsequent sampling period. Data representative for the rate budget is provided from the packet-flow controller node over a packet scheduling interface to a packet scheduler node. Packets to be sent to each of the plurality of transmit nodes in a subsequent sampling period are scheduled depending on the received rate budget. Nodes for multi-path packet scheduling in a wireless communication system are also disclosed.

Abstract: Electronic assemblies and methods including the formation of interconnect structures are described. In one embodiment an apparatus includes semiconductor die and a first metal bump on the die, the first metal bump including a surface having a first part and a second part. The apparatus also includes a solder resistant coating covering the first part of the surface and leaving the second part of the surface uncovered. Other embodiments are described and claimed.

Abstract: Respective embodiments disclosed herein include methods and apparatuses (1) for surveying a mine bench or other material body using at least seismic data obtained via geophone and measurement module data synchronized via a wireless link; (2) for generating hyperspectral panoramic imaging data of a blast hole or other borehole; or (3) for allowing a neural network to facilitate a differential blast design that targets a first bench part more weakly than the differential blast design targets a second bench part (along the same mine bench) at least partly based on data indicative of a much higher concentration of a valuable material in the second bench part than in the first.

Abstract: Electronic assemblies and methods including the formation of interconnect structures are described. In one embodiment an apparatus includes semiconductor die and a first metal bump on the die, the first metal bump including a surface having a first part and a second part. The apparatus also includes a solder resistant coating covering the first part of the surface and leaving the second part of the surface uncovered. Other embodiments are described and claimed.

Abstract: Respective embodiments disclosed herein include methods and apparatuses (1) for surveying a mine bench or other material body using at least seismic data obtained via geophone and measurement module data synchronized via a wireless link; (2) for generating hyperspectral panoramic imaging data of a blast hole or other borehole; or (3) for allowing a neural network to facilitate a differential blast design that targets a first bench part more weakly than the differential blast design targets a second bench part (along the same mine bench) at least partly based on data indicative of a much higher concentration of a valuable material in the second bench part than in the first.

Abstract: Respective embodiments disclosed herein include methods and apparatuses (1) for surveying a mine bench or other material body using at least seismic data obtained via geophone and measurement module data synchronized via a wireless link; (2) for generating hyperspectral panoramic imaging data of a blast hole or other borehole; or (3) for allowing a neural network to facilitate a differential blast design that targets a first bench part more weakly than the differential blast design targets a second bench part (along the same mine bench) at least partly based on data indicative of a much higher concentration of a valuable material in the second bench part than in the first.

Abstract: Electronic assemblies and methods including the formation of interconnect structures are described. In one embodiment an apparatus includes semiconductor die and a first metal bump on the die, the first metal bump including a surface having a first part and a second part. The apparatus also includes a solder resistant coating covering the first part of the surface and leaving the second part of the surface uncovered. Other embodiments are described and claimed.

Abstract: Electronic assemblies and methods including the formation of interconnect structures are described. In one embodiment an apparatus includes semiconductor die and a first metal bump on the die, the first metal bump including a surface having a first part and a second part. The apparatus also includes a solder resistant coating covering the first part of the surface and leaving the second part of the surface uncovered. Other embodiments are described and claimed.

Abstract: A method, according to one embodiment, includes, at a server in communication with a database and a network, receiving from a user a link to an internet webpage, via the network, analyzing, by the server, a Rich Site Summary (RSS) feed of the internet webpage and text in the internet webpage, categorizing, by the server, the internet webpage into a predetermined category based on the RSS feed of the internet webpage and the text in the internet webpage, creating, by the server, a summary of the internet webpage, utilizing the RSS feed of the internet webpage and the text in the internet webpage, identifying, by the server, an image from the internet webpage, resizing, by the server, the image from the internet webpage to create a resized image, including, by the server, the resized image in the summary of the internet webpage, upon determining that the resized image has a minimum size, meets predetermined aspect ratio limits, and is not repeated within the predetermined category, and in a webpage associated w

Abstract: Systems and/or methods for searching and aggregating internet web page updates. The system and/or method may further allow for customization of topics to update. Additionally, social media aspects of the system and/or method may allow for voting and commenting as well as sharing.

Abstract: Electronic assemblies and methods including the formation of interconnect structures are described. In one embodiment an apparatus includes semiconductor die and a first metal bump on the die, the first metal bump including a surface having a first part and a second part. The apparatus also includes a solder resistant coating covering the first part of the surface and leaving the second part of the surface uncovered. Other embodiments are described and claimed.

Abstract: Electronic assemblies and methods including the formation of interconnect structures are described. In one embodiment an apparatus includes semiconductor die and a first metal bump on the die, the first metal bump including a surface having a first part and a second part. The apparatus also includes a solder resistant coating covering the first part of the surface and leaving the second part of the surface uncovered. Other embodiments are described and claimed.

Abstract: A tenant provisioning system. The system allows users to request creation of test tenants for a multi-tenant service targeting specific infrastructure resources and automated bulk creation of test tenants. Test tenants created by the system are clearly identified as test tenants to prevent test tenants from being misreported by business intelligence systems providing information about the multi-tenant service. Automated provisioning of test tenants on a regular schedule provides a mechanism for monitoring the operation of the multi-tenant service. Further, the ability to provision a test tenant in specific infrastructure resources allows comprehensive operational testing of most or all infrastructure resources, as well as targeted testing of individual infrastructure resources. The system may provide test tenants with an expiration allowing automatic removal of out-of-date test tenants. The system reduces the costs and errors inherent with the manual creation of test tenants.

Abstract: A shared account service may be provided to consolidate account creation for one or more service providers. A unified UI is provided to receive a description information of one or more accounts of a tenant. A contract is configured with a service provider based on an analysis of the description information received through the unified UI and a capability information of the service provider. The contract is transmitted to the service provider to cause the service provider to create the account.

Abstract: Systems and method for searching a network, including, via a server in communication with at least one data storage and a network, receiving search criteria via the network, retrieving sub search criteria related to the search criteria from the data storage, retrieving search results from the at least one data storage using the search criteria, retrieving sub search results from the at least one data storage, using the sub search criteria, organizing the search results and sub search results according to the sub search criteria, and causing display, via the network, of the organized search results and sub search results, grouped by sub search criteria.

Abstract: Systems and/or methods for searching and aggregating internet web page updates. The system and/or method may further allow for customization of topics to update. Additionally, social media aspects of the system and/or method may allow for voting and commenting as well as sharing.

Abstract: Electronic assemblies and methods including the formation of interconnect structures are described. In one embodiment an apparatus includes semiconductor die and a first metal bump on the die, the first metal bump including a surface having a first part and a second part. The apparatus also includes a solder resistant coating covering the first part of the surface and leaving the second part of the surface uncovered. Other embodiments are described and claimed.

Abstract: A method and apparatus for managing connections, email messages, and directory harvest attacks at a server is disclosed. The server maintains a count of a parameter and compares the count to a specified maximum value, such that when the specified maximum value is met or exceeded, an action is taken by the server to limit the connections, email messages, or directory harvest attack. Actions include controlling the number of connections to the server from senders, controlling the flow of email messages injected to the server by senders, and controlling when rejection response messages are sent for invalid recipient email addresses to thwart a directory harvest attack. Senders are identified by one or more sender identifiers, which can be used to group senders together so that the same maximum value is applied collectively to all senders in the group.

Abstract: One embodiment of the present invention provides advice for providing a low noise power supply package to an integrated circuit comprising a semiconductor die, input/output power supply terminals, and an array of embedded ceramic capacitors selected from discrete, planar and combinations thereof wherein said capacitors are placed in the locations selected from within the perimeter of the shadow of the semiconductor die, partially within the perimeter of the shadow of the semiconductor die, near the perimeter of the shadow of the semiconductor die, and combinations thereof.

Abstract: An asphalt-based nanocomposite useful as a coating for various applications including building materials products, such as shingles, is provided. The asphalt-based nanocomposites are particle-filled matrices that include an asphalt flux or derivate thereof and a layered clay mineral in an amount ranging from about 1 to about 15 weight %. Coated articles such as shingles including the asphalt-based nanocomposite are also disclosed as well as various methods of preparing the asphalt-based nanocomposite.