Patents by Inventor Krishna Tunga
Krishna Tunga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11756911Abstract: The present invention provides a structure. In an exemplary embodiment, the structure includes a base material, at least one metal pad, where a first surface of the metal pad is in contact with the base material, and a metal pedestal, where the metal pedestal is in contact with the metal pad, where a radial alignment of the metal pad is shifted by an offset distance, with respect to the metal pedestal, such that the metal pad is shifted towards a center axis of the base material, where a first dimension of the metal pad is smaller than a second dimension of the metal pad, where the second dimension is orthogonal to a line running from a center of the metal pad to the center axis of the base material, where the first dimension is parallel to the line.Type: GrantFiled: June 12, 2019Date of Patent: September 12, 2023Assignee: International Business Machines CorporationInventors: Krishna Tunga, Ekta Misra
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Patent number: 10593639Abstract: The present invention provides a structure. In an exemplary embodiment, the structure includes a base material, at least one metal pad, where a first surface of the metal pad is in contact with the base material, and a metal pedestal, where the metal pedestal is in contact with the metal pad, where a radial alignment of the metal pad is shifted by an offset distance, with respect to the metal pedestal, such that the metal pad is shifted towards a center axis of the base material, where a first dimension of the metal pad is smaller than a second dimension of the metal pad, where the second dimension is orthogonal to a line running from a center of the metal pad to the center axis of the base material, where the first dimension is parallel to the line.Type: GrantFiled: April 22, 2019Date of Patent: March 17, 2020Assignee: International Business Machines CorporationInventors: Krishna Tunga, Ekta Misra
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Publication number: 20190295978Abstract: The present invention provides a structure. In an exemplary embodiment, the structure includes a base material, at least one metal pad, where a first surface of the metal pad is in contact with the base material, and a metal pedestal, where the metal pedestal is in contact with the metal pad, where a radial alignment of the metal pad is shifted by an offset distance, with respect to the metal pedestal, such that the metal pad is shifted towards a center axis of the base material, where a first dimension of the metal pad is smaller than a second dimension of the metal pad, where the second dimension is orthogonal to a line running from a center of the metal pad to the center axis of the base material, where the first dimension is parallel to the line.Type: ApplicationFiled: June 12, 2019Publication date: September 26, 2019Inventors: Krishna Tunga, Ekta Misra
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Publication number: 20190244923Abstract: The present invention provides a structure. In an exemplary embodiment, the structure includes a base material, at least one metal pad, where a first surface of the metal pad is in contact with the base material, and a metal pedestal, where the metal pedestal is in contact with the metal pad, where a radial alignment of the metal pad is shifted by an offset distance, with respect to the metal pedestal, such that the metal pad is shifted towards a center axis of the base material, where a first dimension of the metal pad is smaller than a second dimension of the metal pad, where the second dimension is orthogonal to a line running from a center of the metal pad to the center axis of the base material, where the first dimension is parallel to the line.Type: ApplicationFiled: April 22, 2019Publication date: August 8, 2019Inventors: Krishna Tunga, Ekta Misra
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Patent number: 10373925Abstract: The present invention provides a structure. In an exemplary embodiment, the structure includes a base material, at least one metal pad, where a first surface of the metal pad is in contact with the base material, and a metal pedestal, where the metal pedestal is in contact with the metal pad, where a radial alignment of the metal pad is shifted by an offset distance, with respect to the metal pedestal, such that the metal pad is shifted towards a center axis of the base material, where a first dimension of the metal pad is smaller than a second dimension of the metal pad, where the second dimension is orthogonal to a line running from a center of the metal pad to the center axis of the base material, where the first dimension is parallel to the line.Type: GrantFiled: June 18, 2018Date of Patent: August 6, 2019Assignee: International Business Machines CorporationInventors: Krishna Tunga, Ekta Misra
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Publication number: 20190006304Abstract: The present invention provides a structure. In an exemplary embodiment, the structure includes a base material, at least one metal pad, where a first surface of the metal pad is in contact with the base material, and a metal pedestal, where the metal pedestal is in contact with the metal pad, where a radial alignment of the metal pad is shifted by an offset distance, with respect to the metal pedestal, such that the metal pad is shifted towards a center axis of the base material, where a first dimension of the metal pad is smaller than a second dimension of the metal pad, where the second dimension is orthogonal to a line running from a center of the metal pad to the center axis of the base material, where the first dimension is parallel to the line.Type: ApplicationFiled: June 18, 2018Publication date: January 3, 2019Inventors: Krishna Tunga, Ekta Misra
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Patent number: 10096557Abstract: Structure and method for reducing thermal-mechanical stresses generated for a semiconductor device are provided, which includes a tiled-stress-alleviating pad structure.Type: GrantFiled: October 24, 2017Date of Patent: October 9, 2018Assignee: GLOBALFOUNDRIES INC.Inventors: Ekta Misra, Mukta G. Farooq, Krishna Tunga
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Patent number: 10090271Abstract: The present invention provides a structure. In an exemplary embodiment, the structure includes a base material, at least one metal pad, where a first surface of the metal pad is in contact with the base material, and a metal pedestal, where the metal pedestal is in contact with the metal pad, where a radial alignment of the metal pad is shifted by an offset distance, with respect to the metal pedestal, such that the metal pad is shifted towards a center axis of the base material, where a first dimension of the metal pad is smaller than a second dimension of the metal pad, where the second dimension is orthogonal to a line running from a center of the metal pad to the center axis of the base material, where the first dimension is parallel to the line.Type: GrantFiled: June 28, 2017Date of Patent: October 2, 2018Assignee: International Business Machines CorporationInventors: Krishna Tunga, Ekta Misra
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Publication number: 20180061777Abstract: Structure and method for reducing thermal-mechanical stresses generated for a semiconductor device are provided, which includes a tiled-stress-alleviating pad structure.Type: ApplicationFiled: October 24, 2017Publication date: March 1, 2018Applicant: GLOBALFOUNDRIES INC.Inventors: Ekta MISRA, Mukta G. FAROOQ, Krishna TUNGA
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Publication number: 20170358541Abstract: Structure and method for reducing thermal-mechanical stresses generated for a semiconductor device are provided, which includes a tiled-stress-alleviating pad structure.Type: ApplicationFiled: June 8, 2016Publication date: December 14, 2017Applicant: GLOBALFOUNDRIES INC.Inventors: Ekta MISRA, Mukta G. FAROOQ, Krishna TUNGA
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Patent number: 9842810Abstract: Structure and method for reducing thermal-mechanical stresses generated for a semiconductor device are provided, which includes a tiled-stress-alleviating pad structure.Type: GrantFiled: June 8, 2016Date of Patent: December 12, 2017Assignee: GLOBALFOUNDRIES INC.Inventors: Ekta Misra, Mukta G. Farooq, Krishna Tunga