Patents by Inventor Krishna V Singh

Krishna V Singh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Carbon nanotube structures for enhancement of thermal dissipation from semiconductor modules
    Patent number: 8933559
    Abstract: Disclosed are embodiments of an improved semiconductor wafer structure having protected clusters of carbon nanotubes (CNTs) on the back surface and a method of forming the improved semiconductor wafer structure. Also disclosed are embodiments of a semiconductor module with exposed CNTs on the back surface for providing enhanced thermal dissipation in conjunction with a heat sink and a method of forming the semiconductor module using the disclosed semiconductor wafer structure.
    Type: Grant
    Filed: March 13, 2012
    Date of Patent: January 13, 2015
    Assignee: International Business Machines Corporation
    Inventors: Veeraraghavan S. Basker, Toshiharu Furukawa, Mark C. Hakey, Steven J. Holmes, Charles W. Koburger, III, Krishna V. Singh
  • Carbon nanotube structures for enhancement of thermal dissipation from semiconductor modules
    Patent number: 8299605
    Abstract: Disclosed are embodiments of an improved semiconductor wafer structure having protected clusters of carbon nanotubes (CNTs) on the back surface and a method of forming the improved semiconductor wafer structure. Also disclosed are embodiments of a semiconductor module with exposed CNTs on the back surface for providing enhanced thermal dissipation in conjunction with a heat sink and a method of forming the semiconductor module using the disclosed semiconductor wafer structure.
    Type: Grant
    Filed: November 14, 2007
    Date of Patent: October 30, 2012
    Assignee: International Business Machines Corporation
    Inventors: Veeraraghavan S Basker, Toshiharu Furukawa, Mark C Hakey, Steven J Holmes, Charles W Koburger, III, Krishna V Singh
  • CARBON NANOTUBE STRUCTURES FOR ENHANCEMENT OF THERMAL DISSIPATION FROM SEMICONDUCTOR MODULES
    Publication number: 20120168931
    Abstract: Disclosed are embodiments of an improved semiconductor wafer structure having protected clusters of carbon nanotubes (CNTs) on the back surface and a method of forming the improved semiconductor wafer structure. Also disclosed are embodiments of a semiconductor module with exposed CNTs on the back surface for providing enhanced thermal dissipation in conjunction with a heat sink and a method of forming the semiconductor module using the disclosed semiconductor wafer structure.
    Type: Application
    Filed: March 13, 2012
    Publication date: July 5, 2012
    Applicant: International Business Machines Corporation
    Inventors: Veeraraghavan S. Basker, Toshiharu Furukawa, Mark C. Hakey, Steven J. Holmes, Charles W. Koburger, III, Krishna V. Singh
  • CARBON NANOTUBE STRUCTURES FOR ENHANCEMENT OF THERMAL DISSIPATION FROM SEMICONDUCTOR MODULES
    Publication number: 20090121343
    Abstract: Disclosed are embodiments of an improved semiconductor wafer structure having protected clusters of carbon nanotubes (CNTs) on the back surface and a method of forming the improved semiconductor wafer structure. Also disclosed are embodiments of a semiconductor module with exposed CNTs on the back surface for providing enhanced thermal dissipation in conjunction with a heat sink and a method of forming the semiconductor module using the disclosed semiconductor wafer structure.
    Type: Application
    Filed: November 14, 2007
    Publication date: May 14, 2009
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Veeraraghavan S. Basker, Toshiharu Furukawa, Mark C. Hakey, Steven J. Holmes, Charles W. Koburger, III, Krishna V. Singh