Patents by Inventor Krishnaprasad H

Krishnaprasad H has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11443793
    Abstract: Disclosed herein are mechanisms and methods for reducing power consumed by various DRAM technologies (e.g., high-capacity DRAM and/or 3D DRAM) which may impact battery life of the platform. These mechanisms and methods may opportunistically reduce the power consumed by DRAM by inhibiting periodic refresh commands to memory ranks that are not in-use. Since these mechanisms and methods may be based on enhancements to memory controllers, they may accordingly be operating system (OS) agnostic.
    Type: Grant
    Filed: October 12, 2020
    Date of Patent: September 13, 2022
    Assignee: Intel Corporation
    Inventors: Ramkumar Jayaraman, Krishnaprasad H, Kausik Ghosh
  • Publication number: 20220188019
    Abstract: A memory system includes a first set of memory devices, a second set of memory devices, and a memory controller circuit system. The memory controller circuit system groups a first one of the memory devices in each of the first and the second sets into a first virtual memory rank based on eye margins of first data signals sampled by the first virtual memory rank. The memory controller circuit system groups a second one of the memory devices in each of the first and the second sets into a second virtual memory rank based on eye margins of second data signals sampled by the second virtual memory rank. The memory controller circuit system accesses the memory devices in the first virtual memory rank separately from the memory devices in the second virtual memory rank during data access operations.
    Type: Application
    Filed: March 7, 2022
    Publication date: June 16, 2022
    Applicant: Intel Corporation
    Inventors: Ramkumar Jayaraman, Saravanan Sethuraman, Diyanesh Babu Chinnakkonda Vidyapoornachary, Krishnaprasad H
  • Publication number: 20220188001
    Abstract: Methods and apparatus for mapping memory allocation to DRAM dies of a stacked memory modules are described herein. Memory address ranges in a module employing 3DS (three dimensional stacked) DRAMs (Dynamic Random Access Memories) comprising stacked DRAM dies are mapped to DRAM dies in the module based on a layer of the DRAM dies, where dies in different layers have different thermal dissipation characteristic. Chunks of the memory address range are allocated to software entities such as virtual machines (VMs) and/or applications based on a memory access rate of the VMs/applications and the thermal dissipation characteristics of the DRAM die layers, wherein VMs/applications with higher memory access rate are allocated memory on DRAM dies with higher thermal dissipation. In one aspect, memory ranks are associated with respective die layers. In response to detection of change in access rates, memory may be migrated between ranks. Interleaving at multiple levels is also supported.
    Type: Application
    Filed: March 8, 2022
    Publication date: June 16, 2022
    Inventors: Ramkumar JAYARAMAN, Krishnaprasad H, Robert A. BRANCH
  • Publication number: 20210043247
    Abstract: Disclosed herein are mechanisms and methods for reducing power consumed by various DRAM technologies (e.g., high-capacity DRAM and/or 3D DRAM) which may impact battery life of the platform. These mechanisms and methods may opportunistically reduce the power consumed by DRAM by inhibiting periodic refresh commands to memory ranks that are not in-use. Since these mechanisms and methods may be based on enhancements to memory controllers, they may accordingly be operating system (OS) agnostic.
    Type: Application
    Filed: October 12, 2020
    Publication date: February 11, 2021
    Applicant: Intel Corporation
    Inventors: Ramkumar Jayaraman, Krishnaprasad H, Kausik Ghosh
  • Publication number: 20200341776
    Abstract: Methods and apparatus for initializing memory using a hardware engine for minimizing boot time. Booting of firmware in a computer system including one or more memory devices and a processor System on a Chip (SoC) including a central processing unit (CPU) having a plurality of cores and a memory controller coupled to the one or more memory devices is initialized. In parallel with at least a portion of booting the firmware, a plurality of memory ranges in at least one memory devices is initialized using at least one scrub engine. The at least one scrub engine may be embedded in the memory controller or external to the memory controller. Memory devices and ranges within those devices may continue to be initialized in parallel with booting an operating system following firmware booting. The scrub engine includes one or more registers or embedded memory used to program/store descriptor chains describing memory ranges to be initialized.
    Type: Application
    Filed: July 7, 2020
    Publication date: October 29, 2020
    Inventors: Krishnaprasad H, Ramkumar Jayaraman, Jorge Serratos Hernandez
  • Patent number: 10811076
    Abstract: Disclosed herein are mechanisms and methods for reducing power consumed by various DRAM technologies (e.g., high-capacity DRAM and/or 3D DRAM) which may impact battery life of the platform. These mechanisms and methods may opportunistically reduce the power consumed by DRAM by inhibiting periodic refresh commands to memory ranks that are not in-use. Since these mechanisms and methods may be based on enhancements to memory controllers, they may accordingly be operating system (OS) agnostic.
    Type: Grant
    Filed: June 29, 2019
    Date of Patent: October 20, 2020
    Assignee: Intel Corporation
    Inventors: Ramkumar Jayaraman, Krishnaprasad H, Kausik Ghosh
  • Patent number: 10467028
    Abstract: Technologies for reliable software execution include a computing device having a memory that includes multiple ranks. The computing device trains the ranks of the memory and determines a consolidated memory score for each rank. Each consolidated memory score is indicative of a margin of the corresponding rank. The computing device identifies a higher-margin address range using the consolidated memory scores. The higher-margin memory address range is mapped to a higher-margin memory rank. The computing device loads high-priority software into the higher-margin memory address range. The high-priority software may include an operating system or a critical application. A pre-boot firmware environment may publish the consolidated memory scores to a higher-level software component, such as the operating system. The pre-boot firmware environment may map a predetermined address range to the higher-margin memory rank. A critical application may request to be loaded into a higher-margin address range.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: November 5, 2019
    Assignee: Intel Corporation
    Inventors: Krishnaprasad H, Ramkumar Jayaraman
  • Publication number: 20180276010
    Abstract: Technologies for reliable software execution include a computing device having a memory that includes multiple ranks. The computing device trains the ranks of the memory and determines a consolidated memory score for each rank. Each consolidated memory score is indicative of a margin of the corresponding rank. The computing device identifies a higher-margin address range using the consolidated memory scores. The higher-margin memory address range is mapped to a higher-margin memory rank. The computing device loads high-priority software into the higher-margin memory address range. The high-priority software may include an operating system or a critical application. A pre-boot firmware environment may publish the consolidated memory scores to a higher-level software component, such as the operating system. The pre-boot firmware environment may map a predetermined address range to the higher-margin memory rank. A critical application may request to be loaded into a higher-margin address range.
    Type: Application
    Filed: March 21, 2017
    Publication date: September 27, 2018
    Inventors: Krishnaprasad H, Ramkumar Jayaraman