Abstract: A collaborative aviation information collection and distribution system includes a plurality of aircraft data transmitters and an aircraft data processing system. Each aircraft data transmitter is configured to selectively transmit aircraft data associated with a subscribing aircraft. The aircraft data processing system is in operable communication with each of the aircraft data transmitters and includes a data receiver, a data transmitter, and a data processor. The data receiver receives aircraft data transmitted from each of the aircraft transmitters. The data transmitter selectively transmits actionable aircraft data to one or more of the subscribing aircraft or subscribing ground-based users.

Abstract: A collaborative aviation information collection and distribution system includes a plurality of aircraft data transmitters and an aircraft data processing system. Each aircraft data transmitter is configured to selectively transmit aircraft data associated with a subscribing aircraft. The aircraft data processing system is in operable communication with each of the aircraft data transmitters and includes a data receiver, a data transmitter, and a data processor. The data receiver receives aircraft data transmitted from each of the aircraft transmitters. The data transmitter selectively transmits actionable aircraft data to one or more of the subscribing aircraft or subscribing ground-based users.

Abstract: A collaborative aviation information collection and distribution system includes a plurality of aircraft data transmitters and an aircraft data processing system. Each aircraft data transmitter is configured to selectively transmit aircraft data associated with a subscribing aircraft. The aircraft data processing system is in operable communication with each of the aircraft data transmitters and includes a data receiver, a data transmitter, and a data processor. The data receiver receives aircraft data transmitted from each of the aircraft transmitters. The data transmitter selectively transmits actionable aircraft data to one or more of the subscribing aircraft or subscribing ground-based users.

Abstract: A collaborative aviation information collection and distribution system includes a plurality of aircraft data transmitters and an aircraft data processing system. Each aircraft data transmitter is configured to selectively transmit aircraft data associated with a subscribing aircraft. The aircraft data processing system is in operable communication with each of the aircraft data transmitters and includes a data receiver, a data transmitter, and a data processor. The data receiver receives aircraft data transmitted from each of the aircraft transmitters. The data transmitter selectively transmits actionable aircraft data to one or more of the subscribing aircraft or subscribing ground-based users.

Abstract: A dielectric substrate useful in the manufacture of printed wiring boards is disclosed wherein the dielectric substrate comprises at least one organic polymer having a Tg greater than 140° C. and at least one filler material. The dielectric substrate of this invention has a dielectric constant that varies less than 15% over a temperature range of from −55 to 125° C. Additionally, a method for producing integral capacitance components for inclusion within printed circuit boards. Hydrothermally prepared nanopowders permit the fabrication of very thin dielectric layers that offer increased dielectric constants and are readily penetrated by microvias. Disclosed is a method of preparing a slurry or suspension of a hydrothermally prepared nanopowder and solvent. A suitable bonding material, such as a polymer is mixed with the nanopowder slurry, to generate a composite mixture that is formed into a dielectric layer.

Abstract: A method for producing integral capacitance components for inclusion within printed circuit boards. Hydrothermally prepared nanopowders permit the fabrication of a very thin dielectric layers that offer increased dielectric constants and are readily penetrated by microvias. Disclosed is a method of preparing a slurry or suspension of a hydrothermally prepared nanopowder and solvent. A suitable bonding material, such as a polymer is mixed with the nanopowder slurry, to generate a composite mixture which is formed into a dielectric layer. The dielectric layer may be placed upon a conductive layer prior to curing, or conductive layers may be applied upon a cured dielectric layer, either by lamination or by metallization processes, such as vapor deposition or sputtering.

Abstract: A dielectric substrate useful in the manufacture of printed wiring boards is disclosed wherein the dielectric substrate comprises at least one organic polymer having a Tg greater than 140° C. and at least one filler material. The dielectric substrate of this invention has a dielectric constant that varies less than 15% over a temperature range of from −55 to 125° C.

Abstract: A method of fabricating a passive integrated circuit. The integrated circuitry is fabricated in a single plane, the circuitry including passive components such as capacitors, resistors, and inductors. The method features the steps of forming on a substrate a first pattern of conductive material and a first set of passive component elements, and depositing a patterned dielectric layer onto the substrate. The first pattern of conductive material provides electrical connectivity to the first set of passive component elements.

Abstract: A method for producing integral capacitance components for inclusion within printed circuit boards. Hydrothermally prepared nanopowders permit the fabrication of a very thin dielectric layers that offer increased dielectric constants and are readily penetrated by microvias. Disclosed is a method of preparing a slurry or suspension of a hydrothermally prepared nanopowder and solvent. A suitable bonding material, such as a polymer is mixed with the nanopowder slurry, to generate a composite mixture which is formed into a dielectric layer. The dielectric layer may be placed upon a conductive layer prior to curing, or conductive layers may be applied upon a cured dielectric layer, either by lamination or by metallization processes, such as vapor deposition or sputtering.

Abstract: A dielectric substrate useful in the manufacture of printed wiring boards is disclosed wherein the dielectric substrate comprises at least one organic polymer having a Tg greater than 140° C. and at least one filler material. The dielectric substrate of this invention has a dielectric constant that varies less than 15% over a temperature range of from −55 to 125° C.

Abstract: The present invention is a dielectric film, and method for making the film, suitable for use in the construction of capacitor devices, including wound capacitors. In order to overcome strength limitations associated with polymers having desirable dielectric properties, the invention includes a dielectric film featuring a polymer impregnated upon a strengthening substrate. The polymer is deposited directly upon the substrate, which substrate provides required physical strength for film processing and capacitor fabrication, without compromising dielectric performance. The inventive film is based on siloxane polymers modified with polar pendant groups to provide a significant increase in dielectric constant and dielectric strength. During film production, the polymer infiltrates the porous paper to provide an interfacial composite layer between the two materials, the interfacial layer consisting of polymer and paper.