Abstract: A hydrosilylation process is used to prepare a clustered functional polyorganosiloxane. The clustered functional polyorganosiloxane comprises a reaction product of a reaction of a) a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups; b) a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule; and c) a reactive species having, per molecule at least 1 aliphatically unsaturated organic group and 1 or more radical curable groups selected from an acrylate group and a methacrylate group; in the presence of d) a hydrosilylation catalyst, and e) an isomer reducing agent. The weight percent of silicon bonded hydrogen atoms in component b) divided by the weight percent of aliphatically unsaturated organic groups in component a) (the SiHb/Via ratio) ranges from 4/1 to 20/1. The resulting clustered functional polyorganosiloxane is useful in a curable silicone composition for electronics applications.

Abstract: An alkoxy-functional organopolysiloxane resin and polymer is disclosed that comprises the reaction product of a reaction of (i) an alkenyl-functional siloxane resin comprising R3SiO1/2 units and SiO4/2 units; (ii) an alkoxysilane-functional organosiloxane compound having at least one silicon-bonded hydrogen atom at a molecular terminal; (iii) an endcapper according to the formula to the formula R23Si—(R22SiO)s—SiR22H or R23Si—(R22SiO)t—(HR2SiO)—SiR23, or combinations thereof; and (iv) a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups in the presence of a (v) hydrosilylation catalyst. In this alkoxy-functional organopolysiloxane resin and polymer, each R2 is independently a hydrocarbon radical and the subscripts s and t independently have values ranging from 0 to 10.

Abstract: A stable thermal radical curable silicone composition is provided that comprises (I) a clustered functional polyorganopolysiloxane having one or more radical curable groups selected from an acrylate group and a methacrylate group; (II) a reactive resin and polymer; (III) a radical initiator; (IV) a moisture cure initiator; and (V) a crosslinker. The reactive resin and polymer includes (a) an organopolysiloxane polymer and (b) an alkoxy-functional organopolysiloxane resin. The alkoxy-functional organopolysiloxane resin comprises the reaction product of a reaction of (i) an alkenyl-functional siloxane resin, (ii) an alkoxysilane-functional organosiloxane, and (iii) an endcapper in the presence of (iv) hydrosilylation catalyst. The stable thermal radical curable silicone composition can be utilized for electronics applications.

Abstract: A silicone composition contains I) a shrink additive and II) a curable polyorganosiloxane composition. A method for fabricating an electronic device includes the steps of: 1) interposing the silicone composition between an IHS and a substrate, 2) curing the curable polyorganosiloxane composition to form a cured silicone product, and 3) removing the shrink additive during and/or after step 2), thereby compressing the IHS to the substrate. Compressing occurs as thickness of the cured silicone product decreases, as compared to thickness of the silicone composition interposed in step 1).

Abstract: A hydrosilylation process is used to prepare a clustered functional polyorganosiloxane. The clustered functional polyorganosiloxane comprises a reaction product of a reaction of a) a polyorganosiloxane having an average, per molecule, of at least 2 ahphatically unsaturated organic groups; b) a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule; and c) a reactive species having, per molecule at least 1 aliphatically unsaturated organic group and 1 or more radical curable groups selected from an acrylate group and a methacrylate group; in the presence of d) a hydrosilylation catalyst, and e) an isomer reducing agent. The weight percent of silicon bonded hydrogen atoms in component b) divided by the weight percent of aliphatically unsaturated organic groups in component a) (the SiHb/Via ratio) ranges from 4/1 to 20/1. The resulting clustered functional polyorganosiloxane is useful in a curable silicone composition for electronics applications.

Abstract: An alkoxy-functional organopolysiloxane resin and polymer is disclosed that comprises the reaction product of a reaction of (i) an alkenyl-functional siloxane resin comprising R3SiO1/2 units and SiO4/2 units; (ii) an alkoxysilane-functional organosiloxane compound having at least one silicon-bonded hydrogen atom at a molecular terminal; (iii) an endcapper according to the formula to the formula R23Si—(R22SiO)s—SiR22H or R23Si—(R22SiO)t—(HR2SiO)—SiR23, or combinations thereof; and (iv) a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups in the presence of a (v) hydrosilylation catalyst. In this alkoxy-functional organopolysiloxane resin and polymer, each R2 is independently a hydrocarbon radical and the subscripts s and t independently have values ranging from 0 to 10.

Abstract: A stable thermal radical curable silicone composition is provided that comprises (I) a clustered functional polyorganopolysiloxane having one or more radical curable groups selected from an acrylate group and a methacrylate group; (II) a reactive resin and polymer; (III) a radical initiator; (IV) a moisture cure initiator; and (V) a crosslinker. The reactive resin and polymer includes (a) an organopolysiloxane polymer and (b) an alkoxy-functional organopolysiloxane resin. The alkoxy-functional organopolysiloxane resin comprises the reaction product of a reaction of (i) an alkenyl-functional siloxane resin, (ii) an alkoxysilane-functional organosiloxane, and (iii) an endcapper in the presence of (iv) hydrosilylation catalyst. The stable thermal radical curable silicone composition can be utilized for electronics applications.