Abstract: A micro-fluid ejecting head for use in a micro-fluid ejecting apparatus includes a plurality of micro-fluid ejection devices, a plurality of driver devices for driving the plurality of micro-fluid ejection devices, and a nonvolatile programmable memory matrix. The memory matrix contains embedded programmable memory devices for storing information related to operation of the micro-fluid ejecting head. The memory matrix is configured to communicate with a controller which is external of the micro-fluid ejecting head. The information stored in the memory matrix may include identification information for the micro-fluid ejecting head, alignment characteristics of the micro-fluid ejecting head, information regarding properties of fluid used by the micro-fluid ejecting head, fluid level information, and fluid use information. The external controller accesses the information stored in the memory matrix and controls the plurality of driver devices based on the information accessed from the memory matrix.

Abstract: A micro-fluid ejecting device includes a semiconductor substrate, a plurality of fluid ejection elements formed on the semiconductor substrate, and a plurality of nonvolatile programmable memory devices for storing information related to the operation of the micro-fluid ejecting device. The programmable memory devices, which are at least partially embedded in the semiconductor substrate, each include a source region and a drain region formed in the semiconductor substrate. The source and drain regions have a conductivity type which is opposite the conductivity type of the semiconductor substrate. An insulative layer is formed on the semiconductor substrate over the source region and drain region. A floating gate region is formed on the insulative layer and is spatially disposed between the source region and drain region. The floating gate region is electrically insulated from the source and drain regions by the insulative layer. Electrical contacts are connected to the source region and the drain region.

Abstract: A semiconductor substrate for a micro-fluid ejection device. The substrate includes plurality of micro-fluid ejection actuators disposed adjacent a fluid supply slot in the semiconductor substrate. A plurality of power transistors, occupying a power transistor active area of the substrate, are disposed adjacent the ejection actuators and are connected through a first metal conductor layer to the ejection actuators. An array of logic circuits, occupying a logic circuit area of the substrate, is disposed adjacent the plurality of power transistors and is connected through a polysilicon conductor layer to the power transistors. A power conductor and a ground conductor for the ejection actuators is routed in a second metal conductor layer. The power conductor overlaps at least a portion of the power transistor active area of the substrate and the ground conductor overlaps at least a portion of the logic circuit area of the substrate.

Abstract: Some embodiments of the present invention provide an inkjet print head having a housing defining an ink reservoir, a nozzle portion including a nozzle plate deforming an ink chamber in fluid communication with the ink reservoir, and forming a fluid flow path between the ink chamber and the ink reservoir, and a substrate coupled to the nozzle plate and having a surface substantially positioned over the nozzle plate. At least one heating element can be coupled to the substrate, and can be positioned adjacent the surface to heat a portion of the ink chamber. In some embodiments, the inkjet print head comprises a control circuit coupled to the at least one heating element for controlling the heating element, and a temperature sense element positioned substantially between the at least one heating element and the control circuit or in at least partially overlapping relationship with the heating element.

Abstract: A heater chip that includes a circuit element, and a bus that can be used to power the circuit element. The heater chip also includes a feedback circuit that is coupled to the power bus. Particularly, the feedback circuit can be configured to indicate if the bus is powered the circuit element.

Abstract: An ejector chip (e.g., a heater chip) has at least one fluid (e.g., ink) via, and an elongated actuator (e.g., a resistive heating element) between an edge of the chip and the via. The chip also has a conductive trace connected to the actuator. The chip also has a bondpad central to the length of the actuator to reduce a length of the conductive trace.

Abstract: An integrated circuit having a plurality of devices. The plurality of devices have a plurality of device characteristics. A sectional cut through the integrated circuit reveals the plurality of device characteristics.

Abstract: A semiconductor substrate for a micro-fluid ejection device. The substrate includes plurality of micro-fluid ejection actuators disposed adjacent a fluid supply slot in the semiconductor substrate. A plurality of power transistors, occupying a power transistor active area of the substrate, are disposed adjacent the ejection actuators and are connected through a first metal conductor layer to the ejection actuators. An array of logic circuits, occupying a logic circuit area of the substrate, is disposed adjacent the plurality of power transistors and is connected through a polysilicon conductor layer to the power transistors. A power conductor and a ground conductor for the ejection actuators is routed in a second metal conductor layer. The power conductor overlaps at least a portion of the power transistor active area of the substrate and the ground conductor overlaps at least a portion of the logic circuit area of the substrate.

Abstract: An inkjet printhead heater chip has an ink via asymmetrically arranged in a reciprocating direction of inkjet printhead movement. The ink via has two sides and a longitudinal extent substantially parallel to a print medium advance direction. A column of fluid firing elements exists exclusively along a single side of the two sides. The heater chip and ink via each have a centroid and neither resides coincidentally with one another. Preferably, the heater chip centroid resides externally to a boundary of the ink via. In other aspects, the column of fluid firing elements can be a sole column or plural and may be centered in the reciprocating direction. The ink via can be a sole via or plural. The heater chip can be rectangular and the ink vias can be closer to either the long or short ends thereof. Inkjet printers for housing the printheads are also disclosed.

Abstract: An inkjet printhead. The inkjet printhead includes a temperature-sensing resistor with a low voltage end which is connected to a ground structure that at least partially encloses the temperature sensing resistor.

Abstract: Some embodiments of the present invention provide an inkjet print head having a housing defining an ink reservoir, a nozzle portion including a nozzle plate defining an ink chamber in fluid communication with the ink reservoir, and forming a fluid flow path between the ink chamber and the ink reservoir, and a substrate coupled to the nozzle plate and having a surface substantially positioned over the nozzle plate. At least one heating element can be coupled to the substrate, and can be positioned adjacent the surface to heat a portion of the ink chamber. In some embodiments, the inkjet print head comprises a control circuit coupled to the at least one heating element for controlling the heating element, and a temperature sense element positioned substantially between the at least one heating element and the control circuit or in at least partially overlapping relationship with the heating element.

Abstract: A method of error detection in an inkjet printing apparatus having a host coupled to a print head. The method comprises the acts of communicating a first data stream between the host and the print head, inserting a reference data stream into the first data stream, and validating the first data stream based on the reference data stream.

Abstract: An improved heater chip for an ink jet print head, the chip including an active heater array and an inactive heater array located adjacent to and extending away from the end of the active heater array. The inactive heater array provides a region adjacent the end of the active heater array that is substantially planar, and also provides a plurality of current paths which reduces energy differences between heater resistors adjacent the end of the active heater array and other heater resistors in the heater array.

Abstract: Power is provided from one portion of a printer, such as a printer electronics module, to another portion of the printer, such as a printhead. Logic signals produced in a first electronic module of the printer are transmitted to a second electronics module of the printer. A power signal is derived from the logic signals without interfering with the magnitude or duration of logic signals, and the logic power signal is applied to power the second electronic module without having a separate dedicated power line.

Abstract: A semiconductor substrate for a microfluid ejection head. The substrate includes a plurality of fluid ejection actuators disposed on the substrate. A plurality of driver transistors are disposed on the substrate for driving the plurality of fluid ejection actuators. Each of the driver transistors have an active area ranging from about 1000 to less than about 15,000 ?m2. A plurality of logic circuits including at least one logic transistor are coupled to the driver transistors. The driver and logic transistors are provided by a high density array of MOS transistors wherein at least the logic transistors have a gate length of from about 0.1 to less than about 3 microns.

Abstract: A semiconductor substrate for a micro-fluid ejecting device. The semiconductor substrate includes a plurality of fluid ejection devices disposed on the substrate. A plurality of driver transistors are disposed on the substrate for driving the plurality of fluid ejection devices. A programmable memory matrix containing embedded programmable memory devices is operatively connected to the micro-fluid ejecting device for collecting and storing information on the semiconductor substrate for operation of the micro-fluid ejecting device. The programmable memory matrix provides a high density of memory bits embedded on the substrate for storing information about the micro-fluid ejecting device.

Abstract: A method of fault correction for an array of fusible links includes the steps of storing digital information in a first plurality of fusible links to place the first plurality of fusible links in a first programmed state; storing the digital information in a second plurality of fusible links to place the second plurality of fusible links in a second programmed state; and performing a logic operation to combine the first programmed state with the second programmed state, the logic operation providing an output that is identical to one of the first programmed state and the second programmed state for a respective one of the first plurality of fusible links and the second plurality of fusible links that does not include a faulty bit.

Abstract: An ink jet printer includes a printhead control circuit that produces printhead command signals based on data signals provided by the printer. A power circuit actuates ink ejectors in response to the printhead command signals and includes a plurality of compensation circuits. Each ink ejector is associated with a single compensation circuit and each compensation circuit includes a number of switches connected in parallel with each other. Each switch in a single compensation circuit is connected to actuate a single ink ejector when the switch is turned on. The compensation circuits adjust their internal resistance by turning on more or less switches and thereby compensate for changing effective parasitic resistance of the power lines.

Abstract: A low-profile ink jet cartridge assembly for an ink jet printer. The low profile ink jet cartridge assembly includes a substantially rectangular ink jet cartridge body having a printhead side, opposing side surfaces attached to the printhead side and a length, a height, and a width, wherein the length is greater than the height and the width. A printhead containing a semiconductor substrate is attached to the printhead side of the ink cartridge. A flexible circuit having a width, a length, a first edge along the length thereof, a second edge along the length thereof, first printer contact pads along at least a portion of the length thereof adjacent the first edge, and second printer contact pads along at least a portion of the length thereof adjacent the second edge is attached to the ink cartridge on the opposing side surfaces of the cartridge body.

Abstract: An inkjet print head chip having MOS logic blocks that also includes temperature sense resistors implanted in the chip. These resistors are preferably made of N-Well material.