Abstract: Techniques are disclosed for fabricating a relatively thin package for housing a micro component, such as an opto-electronic or MEMs device. The packages may be fabricated in a wafer-level batch process. The package may include hermetically sealed feed-through electrical connections coupling the micro component to electrical contacts on an exterior surface of the package.

Abstract: A passive alignment technique is disclosed to facilitate accurate positioning of components of an optical assembly. In one aspect, a method includes directing light onto components of an optical assembly in which a first component includes a first pattern of marks with a first frequency and a second component includes a second pattern of marks with a second different frequency. An optical signal corresponding to the superposition of the first and second patterns is detected. Based on the detected optical signal, a determination may be made as to whether the first and second components are properly positioned with respect to one another.

Abstract: Techniques are disclosed for hermetically sealing one or more devices within a package. According to one aspect, a lid is attached to a substrate on which one or more devices are provided such that the devices are encapsulated within an area defined by the substrate and the lid. A substance, such as a lubricant or gas, is introduced via one or more through-holes in the lid to a region that is separated from the devices by a wall having at least one opening through which the substance can pass to the devices. The through-hole then may be hermetically sealed, for example, using a local heating process that does not degrade the lubricant or other substance.

Abstract: A passive alignment technique is disclosed to facilitate accurate positioning of components of an optical assembly. In one aspect, a method includes directing light onto components of an optical assembly in which a first component includes a first pattern of marks with a first frequency and a second component includes a second pattern of marks with a second different frequency. An optical signal corresponding to the superposition of the first and second patterns is detected. Based on the detected optical signal, a determination may be made as to whether the first and second components are properly positioned with respect to one another.

Abstract: A passive alignment technique is disclosed to facilitate accurate positioning of components of an optical assembly. In one aspect, a method includes directing light onto components of an optical assembly in which a first component includes a first pattern of marks with a first frequency and a second component includes a second pattern of marks with a second different frequency. An optical signal corresponding to the superposition of the first and second patterns is detected. Based on the detected optical signal, a determination may be made as to whether the first and second components are properly positioned with respect to one another.

Abstract: Techniques are disclosed for hermetically sealing one or more devices within a package. According to one aspect, a lid is attached to a substrate on which one or more devices are provided such that the devices are encapsulated within an area defined by the substrate and the lid. A substance, such as a lubricant or gas, is introduced via one or more through-holes in the lid to a region that is separated from the devices by a wall having at least one opening through which the substance can pass to the devices. The through-hole then may be hermetically sealed, for example, using a local heating process that does not degrade the lubricant or other substance.

Abstract: Techniques are disclosed for fabricating a relatively thin package for housing a micro component, such as an opto-electronic or MEMs device. The packages may be fabricated in a wafer-level batch process. The package may include hermetically sealed feed-through electrical connections coupling the micro component to electrical contacts on an exterior surface of the package.

Abstract: Techniques are disclosed for hermetically sealing one or more devices within a package. According to one aspect, a lid is attached to a substrate on which one or more devices are provided such that the devices are encapsulated within an area defined by the substrate and the lid. A substance, such as a lubricant or gas, is introduced via one or more through-holes in the lid to a region that is separated from the devices by a wall having at least one opening through which the substance can pass to the devices. The through-hole then may be hermetically sealed, for example, using a local heating process that does not degrade the lubricant or other substance.

Abstract: Techniques are disclosed for hermetically sealing one or more devices within a package. According to one aspect, a lid is attached to a substrate on which one or more devices are provided such that the devices are encapsulated within an area defined by the substrate and the lid. A substance, such as a lubricant or gas, is introduced via one or more through-holes in the lid to a region that is separated from the devices by a wall having at least one opening through which the substance can pass to the devices. The through-hole then may be hermetically sealed, for example, using a local heating process that does not degrade the lubricant or other substance.

Abstract: A passive alignment technique is disclosed to facilitate accurate positioning of components of an optical assembly. In one aspect, a method includes directing light onto components of an optical assembly in which a first component includes a first pattern of marks with a first frequency and a second component includes a second pattern of marks with a second different frequency. An optical signal corresponding to the superposition of the first and second patterns is detected. Based on the detected optical signal, a determination may be made as to whether the first and second components are properly positioned with respect to one another.