Abstract: A method of remanufacturing a component having a heat treated hardened layer over a substrate material is disclosed. The method includes removing at least the heat treated hardened layer of the component to expose the substrate material. The method also includes providing a cladding material on the substrate material. The method further includes melting the cladding material via a laser beam to form a single layered coating with hardness greater than or substantially equal to hardness of the heat treated hardened layer, on the substrate material.

Abstract: A method of remanufacturing a wheel housing flange is provided. The wheel housing flange includes a hole configured to receive a fastener, the hole extending from a first face of the wheel housing flange to a second face of the wheel housing flange. The method includes machining the hole to a machined diameter larger than an original diameter. The method further includes securing a first insert in the hole adjacent to the first face. The method further includes securing a second insert in the hole adjacent to the second face.

Abstract: A method for salvaging a surface of a pin-bore assembly associated with a carrier is provided. The method includes inserting a sleeve within a bore of the carrier. The method also includes installing a retention mechanism that secures the sleeve within the bore of the carrier.