Patents by Inventor Kristin C. Cooley

Kristin C. Cooley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Introducing voids into polymeric material for buffering one or more stress sensitive components from one or more stresses
    Patent number: 8124661
    Abstract: A plurality of voids are introduced into a polymeric material. One or more stress sensitive components in abutment with a portion of the polymeric material are buffered from one or more stresses through employment of the portion of the polymeric material that comprises one or more voids of the plurality of voids. A movement of the portion of the polymeric material is accommodated through compression of one or more of the one or more voids.
    Type: Grant
    Filed: June 20, 2003
    Date of Patent: February 28, 2012
    Assignee: Northrop Grumman Guidance and Electronics Company, Inc.
    Inventors: Kurt R. Carlson, Kristin C. Cooley, John P. Rahn, Manfred Schiruska
  • Polymeric material with voids that compress to allow the polymeric material to absorb applied force and decrease reaction force to one or more sensor fibers
    Patent number: 6980709
    Abstract: In one example, the voids 208 comprise one or more gas (e.g., air) bubbles in the solid material 206. In another example, the voids 208 comprise a structure that preserves a space in the solid material 206. In a further example, the voids 208 comprise hollow elastomeric bubbles, for example, hollow elastomeric microspheres. The hollow elastomeric microspheres comprise microballoons with tin walls that encapsulate a gas to allow for easy compression. For example, the walls of the hollow elastomeric microspheres are strong enough to avoid breakage under pressure, but thin enough to easily compress. In a further example, once cured in the solid material 206, the hollow elastomeric microspheres comprise substantially similar compressibility characteristics as gas bubbles. The voids 208 in one example are added to a resin of the solid material 206 in a substantially uniform distribution. For example, the hollow elastomeric microspheres are stirred into the resin of the solid material 206.
    Type: Grant
    Filed: June 20, 2003
    Date of Patent: December 27, 2005
    Assignee: Northrop Grumman Corporation
    Inventors: Kurt R. Carlson, Kristin C. Cooley, John P. Rahn, Manfred Schiruska
  • Introducing voids into polymeric material for buffering one or more stress sensitive components from one or more stresses
    Publication number: 20040259964
    Abstract: A plurality of voids are introduced into a polymeric material. One or more stress sensitive components in abutment with a portion of the polymeric material are buffered from one or more stresses through employment of the portion of the polymeric material that comprises one or more voids of the plurality of voids. A movement of the portion of the polymeric material is accommodated through compression of one or more of the one or more voids.
    Type: Application
    Filed: June 20, 2003
    Publication date: December 23, 2004
    Inventors: Kurt R. Carlson, Kristin C. Cooley, John P. Rahn, Manfred Schiruska