Abstract: An electrically continuous, grounded conformal EMI protective shield and methods for applying same directly to the surfaces of a printed circuit board. The EMI shield adheres and conforms to the surface of the components and printed wiring board. The shield takes the shape of the covered surfaces while adding little to the dimensions of the surfaces. The EMI shield includes low viscosity, high adherence conductive and dielectric coatings each of which can be applied in one or more layers. The dielectric coating is initially applied to selected locations of the printed circuit board so as to be interposed between the conductive coating and the printed circuit board, preventing the conductive coating from electrically contacting selected components and printed wiring board regions. A high viscosity, non-electrically-conductive filler material is applied to printed circuit board regions that have surfaces that are cavitatious and/or which have a highly variable slope.

Abstract: An electrically continuous, grounded conformal EMI protective shield and methods for applying same directly to the surfaces of a printed circuit board. The EMI shield adheres and conforms to the surface of the components and printed wiring board. The shield takes the shape of the covered surfaces while adding little to the dimensions of the surfaces. The EMI shield includes low viscosity, high adherence conductive and dielectric coatings each of which can be applied in one or more layers using conventional spray techniques. The conductive coating prevents substantially all electromagnetic emissions generated by the shielded components from emanating beyond the conformal coating. The dielectric coating is initially applied to selected locations of the printed circuit board so as to be interposed between the conductive coating and the printed circuit board, preventing the conductive coating from electrically contacting selected components and printed wiring board regions.

Abstract: The disclosed embodiments relate to an expansion card support mechanism. In certain embodiments, a tool-free, chassis mountable arm comprising a support end and a card-configurable mount to orient the support end over an expansion card within a chassis, wherein the chassis mountable arm is adapted to bias the expansion card. In other embodiments, a system has a card support mechanism configurable for at least one electronics card. The card support mechanism has a chassis with at least one tool-free mounting mechanism, and an arm rotatably coupled to the chassis, wherein the arm comprises a card retention end springably engageable against a peripheral portion of the at least one electronics card.

Abstract: An electrically continuous, grounded conformal EMI protective shield and methods for applying same directly to the surfaces of a printed circuit board. The EMI shield adheres and conforms to the surface of the components and printed wiring board. The shield takes the shape of the covered surfaces while adding little to the dimensions of the surfaces. The EMI shield includes low viscosity, high adherence conductive and dielectric coatings each of which can be applied in one or more layers using conventional spray techniques. The conductive coating prevents substantially all electromagnetic emissions generated by the shielded components from emanating beyond the conformal coating. The dielectric coating is initially applied to selected locations of the printed circuit board so as to be interposed between the conductive coating and the printed circuit board, preventing the conductive coating from electrically contacting selected components and printed wiring board regions.

Abstract: A circuit card retention device includes a longitudinal retention bar hinge-mounted to a support member of a computer enclosure or chassis. First and second hand-releasable lock members are attached to the retention bar at either end. Each lock member includes a flexible stop. When the retention bar is in a retaining position, the flexible stops engage a substantially rigid surface of the enclosure or chassis, keeping the bar in the retaining position. The flexible stops may be disengaged from the rigid surface by application of finger pressure, allowing the retention bar to pivot from the retaining position to an open position.

Abstract: An electrically continuous, grounded conformal EMI protective shield and methods for applying same directly to the surfaces of a printed circuit board. The EMI shield adheres and conforms to the surface of the components and printed wiring board. The shield takes the shape of the covered surfaces while adding little to the dimensions of the surfaces. The EMI shield includes low viscosity, high adherence conductive and dielectric coatings each of which can be applied in one or more layers using conventional spray techniques. The conductive coating prevents substantially all electromagnetic emissions generated by the shielded components from emanating beyond the conformal coating. The dielectric coating is initially applied to selected locations of the printed circuit board so as to be interposed between the conductive coating and the printed circuit board, preventing the conductive coating from electrically contacting selected components and printed wiring board regions.

Abstract: An electrically continuous, grounded conformal EMI protective shield and methods for applying same directly to the surfaces of a printed circuit board. The EMI shield adheres and conforms to the surface of the components and printed wiring board. The shield takes the shape of the covered surfaces while adding little to the dimensions of the surfaces. The EMI shield includes low viscosity, high adherence conductive and dielectric coatings each of which can be applied in one or more layers using conventional spray techniques. The conductive coating prevents substantially all electromagnetic emissions generated by the shielded components from emanating beyond the conformal coating. The dielectric coating is initially applied to selected locations of the printed circuit board so as to be interposed between the conductive coating and the printed circuit board, preventing the conductive coating from electrically contacting selected components and printed wiring board regions.

Abstract: An electrically continuous, grounded conformal EMI protective shield and methods for applying same directly to the surfaces of a printed circuit board. The EMI shield adheres and conforms to the surface of the components and printed wiring board. The shield takes the shape of the covered surfaces while adding little to the dimensions of the surfaces. The EMI shield includes low viscosity, high adherence conductive and dielectric coatings each of which can be applied in one or more layers using conventional spray techniques. The conductive coating prevents substantially all electromagnetic emissions generated by the shielded components from emanating beyond the conformal coating. The dielectric coating is initially applied to selected locations of the printed circuit board so as to be interposed between the conductive coating and the printed circuit board, preventing the conductive coating from electrically contacting selected components and printed wiring board regions.

Abstract: A heat sink device for transferring heat from a computer chip is comprised of a base, a core and an array of fins that are in the form of a single, unitary piece. In a particularly preferred embodiment of this invention, the array of fins is comprised of a first subarray of fins that each extend to a core cavity wall and a second subarray of fins that extend into the device to a location that lies between the exterior of the device and the cavity wall.

Abstract: A heat sink device for transferring heat from a computer chip is comprised of a base, a core and an array of fins that are in the form of a single, unitary piece. In a particularly preferred embodiment of this invention, the array of fins is comprised of a first subarray of fins that each extend to a core cavity wall and a second subarray of fins that extend into the device to a location that lies between the exterior of the device and the cavity wall.

Abstract: An EMI containment assembly for an integrated circuit chip. A frame forms an eletrically conductive wall around the perimeter of the integrated circuit chip. The bottom of the frame makes an electrically conductive contact with a ground trace on the printed circuit board to which the chip is mounted. The top of the frame makes an electrically conductive contact with an electrically conductive heat removal assembly that is disposed over the top of the chip. An electrically conductive bolster plate is mounted on the side of the printed circuit board opposite the integrated circuit chip and is disposed beneath the chip. Because each component of the assembly is electrically conductive, the assembly creates an EMI cage around the integrated circuit chip. Because the frame does not cover the top of the chip, it does not interfere with a thermally conductive contact that is made between the top of the chip package and the heat removal assembly.

Abstract: A two-piece bus bar electrically couples a printed circuit board to a power supply. The power supply is mounted to a chassis. A power supply bus bar extends from the power supply, defining a power supply bus bar plane. A first printed circuit board is mounted to the chassis and oriented in a plane that is not parallel with the power supply bus bar plane. A first printed circuit board bus bar extends from the first printed circuit board. At least one of the power supply bus bar or the first printed circuit board bus bar includes a bend that creates a parallel relationship between a mating portion of the power supply bus bar and a mating portion of the first printed circuit board bus bar. A first fastener couples the mating portions of the bus bars together. A second printed circuit board may be mounted to the chassis and oriented in a plane at right angles with the power supply bus bar plane.

Abstract: A heatsink for use with an actively cooled daughterboard system. Plural transverse fins are integrally formed with a base portion. The fins are parallel to one another and orthogonal to the bottom of the base portion. The fins have a constant profile relative to the bottom of the base portion, but the base portion has a central portion that is thicker than its end portions. The thickness of the central portion varies according to a radius. The radius is approximated by step differences in the depths of the fins.

Abstract: EMI-attenuating air ventilation panel for electrical and electronic systems. An opening through a metallic panel is realized using an extrusion method in order to obtain a tube leaving the opening at one end. The periphery of the opening at the other side of the extruded tube has a smooth edge in order to improve air circulation. A multitude of such extruded holes are critically placed on the panel to form an array. The panel in turn is mounted in an electrical or electronic system to allow air cooling while the extruded tubes attenuate EMI radiation to and from electrical circuits.