Patents by Inventor Kristina MAYER

Kristina MAYER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for producing packaged semiconductor devices
    Patent number: 10923364
    Abstract: A method comprises: arranging a plurality of semiconductor chips above a carrier, wherein active main surfaces of the semiconductor chips face the carrier; filling a cavity with a molding material; pressing the semiconductor chips arranged on the carrier into the molding material; and separating the molding material with the semiconductor chips embedded therein from the carrier, wherein main surfaces of the semiconductor chips that are situated opposite the active main surfaces are covered by the molding material.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: February 16, 2021
    Assignee: Infineon Technologies AG
    Inventors: Kristina Mayer, Michael Ledutke, Johannes Lodermeyer
  • METHODS FOR PRODUCING PACKAGED SEMICONDUCTOR DEVICES
    Publication number: 20190074198
    Abstract: A method comprises: arranging a plurality of semiconductor chips above a carrier, wherein active main surfaces of the semiconductor chips face the carrier; filling a cavity with a molding material; pressing the semiconductor chips arranged on the carrier into the molding material; and separating the molding material with the semiconductor chips embedded therein from the carrier, wherein main surfaces of the semiconductor chips that are situated opposite the active main surfaces are covered by the molding material.
    Type: Application
    Filed: August 31, 2018
    Publication date: March 7, 2019
    Inventors: Kristina MAYER, Michael LEDUTKE, Johannes LODERMEYER