Patents by Inventor Kristoffer Steven Scheponik

Kristoffer Steven Scheponik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Corrosion resistant coating for copper substrate
    Patent number: 8871366
    Abstract: A protecting coating for a copper substrate is disclosed. The coating comprises seed layer comprising titanium ions that forms an “alloy-like” structure with the copper substrate. The coating further comprises a first layer of carbon disposed on the seed layer comprising titanium ions. A second layer comprising titanium is disposed on the first layer of carbon, and a second layer of carbon is disposed on the second layer comprising titanium.
    Type: Grant
    Filed: May 28, 2013
    Date of Patent: October 28, 2014
    Assignee: Seagate Technology LLC
    Inventors: Yongping Gong, Kristoffer Steven Scheponik
  • CORROSION RESISTANT COATING FOR COPPER SUBSTRATE
    Publication number: 20130252018
    Abstract: A protecting coating for a copper substrate is disclosed. The coating comprises seed layer comprising titanium ions that forms an “alloy-like” structure with the copper substrate. The coating further comprises a first layer of carbon disposed on the seed layer comprising titanium ions. A second layer comprising titanium is disposed on the first layer of carbon, and a second layer of carbon is disposed on the second layer comprising titanium.
    Type: Application
    Filed: May 28, 2013
    Publication date: September 26, 2013
    Applicant: Seagate Technology LLC
    Inventors: Yongping Gong, Kristoffer Steven Scheponik
  • Corrosion resistant coating for copper substrate
    Patent number: 8449995
    Abstract: A protecting coating for a copper substrate is disclosed. The coating comprises seed layer comprising titanium ions that forms an “alloy-like” structure with the copper substrate. The coating further comprises a first layer of carbon disposed on the seed layer comprising titanium ions. A second layer comprising titanium is disposed on the first layer of carbon, and a second layer of carbon is disposed on the second layer comprising titanium.
    Type: Grant
    Filed: March 31, 2009
    Date of Patent: May 28, 2013
    Assignee: Seagate Technology LLC
    Inventors: Yongping Gong, Kristoffer Steven Scheponik
  • CORROSION RESISTANT COATING FOR COPPER SUBSTRATE
    Publication number: 20100247883
    Abstract: A protecting coating for a copper substrate is disclosed. The coating comprises seed layer comprising titanium ions that forms an “alloy-like” structure with the copper substrate. The coating further comprises a first layer of carbon disposed on the seed layer comprising titanium ions. A second layer comprising titanium is disposed on the first layer of carbon, and a second layer of carbon is disposed on the second layer comprising titanium.
    Type: Application
    Filed: March 31, 2009
    Publication date: September 30, 2010
    Applicant: SEAGATE TECHNOLOGY, LLC
    Inventors: Yongping Gong, Kristoffer Steven Scheponik