Patents by Inventor Kristopher E. Dayton

Kristopher E. Dayton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic assembly having a wetting layer on a thermally conductive heat spreader
    Patent number: 6504242
    Abstract: An electronic assembly including a die, having an integrated circuit formed therein, a thermally conductive heat spreader, and indium located between the die and the heat spreader, is described. The heat spreader has a layer of nickel. A gold layer is formed on the nickel layer, and provides better wetting of indium than nickel. A better structural connection between the indium and the heat spreader is provided, especially during thermal cycling.
    Type: Grant
    Filed: November 15, 2001
    Date of Patent: January 7, 2003
    Assignee: Intel Corporation
    Inventors: Carl L. Deppisch, Sabina J. Houle, Thomas J. Fitzgerald, Kristopher E. Dayton, Fay Hua