Patents by Inventor Kristopher FORD

Kristopher FORD has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PRINTED MICROWAVE RESONATOR FOR MEASURING HIGH ELECTRON DENSITY PLASMAS
    Publication number: 20260081123
    Abstract: Embodiments disclosed herein include a module, comprising: a substrate, wherein the substrate comprises a dielectric material, and a microstrip resonator on the substrate. In an embodiment, a microstrip transmission line is on the substrate adjacent to the microstrip resonator, and the microstrip resonator is spaced from the microstrip transmission line by a gap. In an embodiment, a ground plane on a surface of the substrate is opposite from the microstrip resonator.
    Type: Application
    Filed: November 19, 2025
    Publication date: March 19, 2026
    Inventors: DAVID PETERSON, DAVID COUMOU, CHUANG-CHIA LIN, KELVIN CHAN, FARZAD HOUSHMAND, PING-HWA HSIEH, KRISTOPHER FORD
  • Printed microwave resonator for measuring high electron density plasmas
    Patent number: 12482641
    Abstract: Embodiments disclosed herein include a module, comprising: a substrate, wherein the substrate comprises a dielectric material, and a microstrip resonator on the substrate. In an embodiment, a microstrip transmission line is on the substrate adjacent to the microstrip resonator, and the microstrip resonator is spaced from the microstrip transmission line by a gap. In an embodiment, a ground plane on a surface of the substrate is opposite from the microstrip resonator.
    Type: Grant
    Filed: June 9, 2023
    Date of Patent: November 25, 2025
    Assignee: Applied Materials, Inc.
    Inventors: David Peterson, David Coumou, Chuang-Chia Lin, Kelvin Chan, Farzad Houshmand, Ping-Hwa Hsieh, Kristopher Ford
  • PRINTED MICROWAVE RESONATOR FOR MEASURING HIGH ELECTRON DENSITY PLASMAS
    Publication number: 20240412959
    Abstract: Embodiments disclosed herein include a module, comprising: a substrate, wherein the substrate comprises a dielectric material, and a microstrip resonator on the substrate. In an embodiment, a microstrip transmission line is on the substrate adjacent to the microstrip resonator, and the microstrip resonator is spaced from the microstrip transmission line by a gap. In an embodiment, a ground plane on a surface of the substrate is opposite from the microstrip resonator.
    Type: Application
    Filed: June 9, 2023
    Publication date: December 12, 2024
    Inventors: David PETERSON, David COUMOU, Chuang-Chia LIN, Kelvin CHAN, Farzad HOUSHMAND, Ping-Hwa HSIEH, Kristopher FORD