Patents by Inventor Krit Pajuvang

Krit Pajuvang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor Device and Method of Disposing Electrical Components Above and Below Substrate
    Publication number: 20220320033
    Abstract: A semiconductor device has a substrate with a die mounting site and a plurality of leads. A first electrical component is disposed over a first surface of the die mounting site. A second electrical component is disposed over a second surface of the die mounting site opposite the first surface of the die mounting site. A first bond wire is coupled between the first electrical component and a first lead, and a second bond wire is coupled between the second electrical component and a second lead. A first encapsulant is deposited over the first electrical component, and a second encapsulant is deposited over the second electrical component with the leads exposed between the first encapsulant and second encapsulant. The leads are exposed from the first encapsulant and second encapsulant on a side of the semiconductor device.
    Type: Application
    Filed: March 25, 2022
    Publication date: October 6, 2022
    Applicant: UTAC Headquarters Pte. Ltd.
    Inventors: Krit Pajuvang, Siriwanna Ounkaew