Abstract: A generic domain compute system that is customizable for at least one domain or zone compute in a vehicle having a gateway power and control (GAPAC). The GAPAC has a power supply, a scalable microcontroller, a power management integrated circuit, a set of standardized and scalable external connectors for external inter-connections for Ethernet and car connector, a standard and scalable internal connector for internal inter-connections for power, control and generic busses. At least a first compute extension (COMEX) has a standard and scalable connecter internally connected to the GAPAC. The COMEX has a scalable microcontroller, a power management integrated circuit and a set of standardized and scalable connectors for external inter-connections. The COMEX is supplied with a permanent voltage from the GAPAC power supply. The microcontrollers, external connectors and internal connectors are scaled according to the domain or zone compute application.

Abstract: An in-vehicle control device a mainboard with at least one connection exposed at a first panel of a housing. One or more connectors in a second panel of the housing are interconnected with the mainboard and accessible from outside the housing for connecting the mainboard to a vehicle system. A mounting frame cooperates with the housing at the first panel of the housing exposing the connection to the mainboard, and at least one interchangeable node, computing node and/or connectivity node, is detachably connected to the mounting frame. The at least one interchangeable node has a connector for connecting to the mainboard, and at least one System-on-a-Chip (SoC) having scalable performance capabilities, or a high-performance antenna.

Abstract: Methods for producing a circuit board system and a circuit board arrangement are disclosed. One method for producing a circuit board system includes: providing a first circuit board including a top side, a bottom side, a top metallization layer arranged at the top side, and a bottom metallization layer arranged at the bottom side, wherein the bottom metallization layer comprises a number of soldering pads; applying a first solder over the soldering pads; and applying a second solder over the top metallization layer. The method further includes providing a number of electronic components and a metallic or metallized shielding frame; arranging the number of electronic components and the shielding frame on the applied second solder; and soldering the number of electronic components and the shielding frame to the top metallization layer with the second solder.

Abstract: Methods for producing a circuit board system and a circuit board arrangement are disclosed. One method for producing a circuit board system includes: providing a first circuit board including a top side, a bottom side, a top metallization layer arranged at the top side, and a bottom metallization layer arranged at the bottom side, wherein the bottom metallization layer comprises a number of soldering pads; applying a first solder over the soldering pads; and applying a second solder over the top metallization layer. The method further includes providing a number of electronic components and a metallic or metallized shielding frame; arranging the number of electronic components and the shielding frame on the applied second solder; and soldering the number of electronic components and the shielding frame to the top metallization layer with the second solder.