Patents by Inventor Krupashankara M. Sethuram

Krupashankara M. Sethuram has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20030172772
    Abstract: The present invention relates to the production of ultrafine powders using a microwave plasma apparatus and chemical synthesis technique. Microwaves generated by a magnetron (1) are passed through waveguides (2) before they arrive at the head of a plasmatron (3). These high energy microwaves ionize a plasma gas, thus releasing large amounts of energy. The energy thus released is utilized to initiate and sustain chemical reactions between the desired elements being pumped in a spiral pattern into the plasmatron (3). The reaction products are quenched rapidly in a reactor column (4) into ultrafine powders.
    Type: Application
    Filed: March 11, 2003
    Publication date: September 18, 2003
    Applicant: Materials Modification, Inc.
    Inventors: Krupashankara M. Sethuram, Raja Kalyanaraman
  • Publication number: 20020112794
    Abstract: The present invention relates to the production of ultrafine powders using a microwave plasma apparatus and chemical synthesis technique. Microwaves generated by a magnetron (1) are passed through waveguides (2) before they arrive at the head of a plasmatron (3). These high energy microwaves ionize a plasma gas, thus releasing large amounts of energy. The energy thus released is utilized to initiate and sustain chemical reactions between the desired elements being pumped in a spiral pattern into the plasmatron (3). The reaction products are quenched rapidly in a reactor column (4) into ultrafine powders.
    Type: Application
    Filed: April 4, 2002
    Publication date: August 22, 2002
    Applicant: Materials Modification, Inc.
    Inventors: Krupashankara M. Sethuram, Raja Kalyanaraman
  • Patent number: 6409851
    Abstract: The present invention relates to the production of ultrafine powders using a microwave plasma apparatus and chemical synthesis technique. Microwaves generated by a magnetron (1) are passed through waveguides (2) before they arrive at the head of a plasmatron (3). These high energy microwaves ionize a plasma gas, thus releasing large amounts of energy. The energy thus released is utilized to initiate and sustain chemical reactions between the desired elements being pumped in a spiral pattern into the plasmatron (3). The reaction products are quenched rapidly in a reactor column (4) into ultrafine powders.
    Type: Grant
    Filed: March 5, 1999
    Date of Patent: June 25, 2002
    Assignee: Materials Modifciation, Inc.
    Inventors: Krupashankara M. Sethuram, Raja Kalyanaraman
  • Patent number: 6309591
    Abstract: An apparatus for bonding a particle material to near theoretical density, includes a chamber, a punch and die assembly for supporting a particle material, plungers for applying shear and/or axial pressures, and a power supply for applying a current. In the first stage, a pulsed current of about 1 to 20,000 amps., is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a shear force of about 5-50 MPa is applied. In the second stage, an axial pressure of about less than 1 to 2,000 MPa is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a steady current of about 1 to 20,000 amps. is applied. The apparatus may be used to bond metallic, ceramic, intermetallic and composite materials to near-net shape, directly from precursors or elemental particle material without the need for synthesizing the material.
    Type: Grant
    Filed: October 5, 1999
    Date of Patent: October 30, 2001
    Assignee: Materials Modification, Inc.
    Inventors: Sang H. Yoo, Krupashankara M. Sethuram, Tirumalai S. Sudarshan
  • Patent number: 6270718
    Abstract: A method of bonding a particle material to near theoretical density, includes placing a particle material in a die. In the first stage, a pulsed current of about 1 to 20,000 amps., is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a shear force of about 5-50 MPa is applied. In the second stage, an axial pressure of about less than 1 to 2,000 MPa is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a steady current of about 1 to 20,000 amps. is applied. The method can be used to bond metallic, ceramic, intermetallic and composite materials to near-net shape, directly from precursors or elemental particle material without the need for synthesizing the material. The method may also be applied to perform combustion synthesis of a reactive material, followed by consolidation or joining to near-net shaped articles or parts.
    Type: Grant
    Filed: October 5, 1999
    Date of Patent: August 7, 2001
    Assignee: Materials Modification, Inc.
    Inventors: Sang H. Yoo, Krupashankara M. Sethuram, Tirumalai S. Sudarshan
  • Patent number: 6187087
    Abstract: A method of bonding a particle material to near theoretical density, includes placing a particle material in a die. In the first stage, a pulsed current of about 1 to 20,000 amps., is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a shear force of about 5-50 MPa is applied. In the second stage, an axial pressure of about less than 1 to 2,000 MPa is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a steady current of about 1 to 20,000 amps. is applied. The method can be used to bond metallic, ceramic, intermetallic and composite materials to near-net shape, directly from precursors or elemental particle material without the need for synthesizing the material. The method may also be applied to perform combustion synthesis of a reactive material, followed by consolidation or joining to near-net shaped articles or parts.
    Type: Grant
    Filed: October 5, 1999
    Date of Patent: February 13, 2001
    Assignee: Materials Modification, Inc.
    Inventors: Sang H. Yoo, Krupashankara M. Sethuram, Tirumalai S. Sudarshan
  • Patent number: 6183690
    Abstract: A method of bonding a particle material to near theoretical density, includes placing a particle material in a die. In the first stage, a pulsed current of about 1 to 20,000 amps., is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a shear force of about 5-50 MPa is applied. In the second stage, an axial pressure of about less than 1 to 2,000 MPa is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a steady current of about 1 to 20,000 amps. is applied. The method can be used to bond metallic, ceramic, intermetallic and composite materials to near-net shape, directly from precursors or elemental particle material without the need for synthesizing the material. The method may also be applied to perform combustion synthesis of a reactive material, followed by consolidation or joining to near-net shaped articles or parts.
    Type: Grant
    Filed: October 5, 1999
    Date of Patent: February 6, 2001
    Assignee: Materials Modification, Inc.
    Inventors: Sang H. Yoo, Krupashankara M. Sethuram, Tirumalai S. Sudarshan
  • Patent number: 6001304
    Abstract: A method of bonding a particle material to near theoretical density, includes placing a particle material in a die. In the first stage, a pulsed current of about 1 to 20,000 amps., is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a shear force of about 5-50 MPa is applied. In the second stage, an axial pressure of about less than 1 to 2,000 MPa is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a steady current of about 1 to 20,000 amps, is applied. The method can be used to bond metallic, ceramic, intermetallic and composite materials to near-net shape, directly from precursors or elemental particle material without the need for synthesizing the material. The method may also be applied to perform combustion synthesis of a reactive material, followed by consolidation or joining to near-net shaped articles or parts.
    Type: Grant
    Filed: December 31, 1998
    Date of Patent: December 14, 1999
    Assignee: Materials Modification, Inc.
    Inventors: Sang H. Yoo, Krupashankara M. Sethuram, Tirumalai S. Sudarshan
  • Patent number: 5989487
    Abstract: An apparatus for bonding a particle material to near theoretical density, includes a chamber, a punch and die assembly for supporting a particle material, plungers for applying shear and/or axial pressures, and a power supply for applying a current. In the first stage, a pulsed current of about 1 to 20,000 amps., is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a shear force of about 5-50 MPa is applied. In the second stage, an axial pressure of about less than 1 to 2,000 MPa is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a steady current of about 1 to 20,000 amps. is applied. The apparatus may be used to bond metallic, ceramic, intermetallic and composite materials to near-net shape, directly from precursors or elemental particle material without the need for synthesizing the material.
    Type: Grant
    Filed: March 23, 1999
    Date of Patent: November 23, 1999
    Assignee: Materials Modification, Inc.
    Inventors: Sang H. Yoo, Krupashankara M. Sethuram, Tirumalai S. Sudarshan