Patents by Inventor Krupashankara M. Sethuram
Krupashankara M. Sethuram has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20030172772Abstract: The present invention relates to the production of ultrafine powders using a microwave plasma apparatus and chemical synthesis technique. Microwaves generated by a magnetron (1) are passed through waveguides (2) before they arrive at the head of a plasmatron (3). These high energy microwaves ionize a plasma gas, thus releasing large amounts of energy. The energy thus released is utilized to initiate and sustain chemical reactions between the desired elements being pumped in a spiral pattern into the plasmatron (3). The reaction products are quenched rapidly in a reactor column (4) into ultrafine powders.Type: ApplicationFiled: March 11, 2003Publication date: September 18, 2003Applicant: Materials Modification, Inc.Inventors: Krupashankara M. Sethuram, Raja Kalyanaraman
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Publication number: 20020112794Abstract: The present invention relates to the production of ultrafine powders using a microwave plasma apparatus and chemical synthesis technique. Microwaves generated by a magnetron (1) are passed through waveguides (2) before they arrive at the head of a plasmatron (3). These high energy microwaves ionize a plasma gas, thus releasing large amounts of energy. The energy thus released is utilized to initiate and sustain chemical reactions between the desired elements being pumped in a spiral pattern into the plasmatron (3). The reaction products are quenched rapidly in a reactor column (4) into ultrafine powders.Type: ApplicationFiled: April 4, 2002Publication date: August 22, 2002Applicant: Materials Modification, Inc.Inventors: Krupashankara M. Sethuram, Raja Kalyanaraman
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Patent number: 6409851Abstract: The present invention relates to the production of ultrafine powders using a microwave plasma apparatus and chemical synthesis technique. Microwaves generated by a magnetron (1) are passed through waveguides (2) before they arrive at the head of a plasmatron (3). These high energy microwaves ionize a plasma gas, thus releasing large amounts of energy. The energy thus released is utilized to initiate and sustain chemical reactions between the desired elements being pumped in a spiral pattern into the plasmatron (3). The reaction products are quenched rapidly in a reactor column (4) into ultrafine powders.Type: GrantFiled: March 5, 1999Date of Patent: June 25, 2002Assignee: Materials Modifciation, Inc.Inventors: Krupashankara M. Sethuram, Raja Kalyanaraman
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Patent number: 6309591Abstract: An apparatus for bonding a particle material to near theoretical density, includes a chamber, a punch and die assembly for supporting a particle material, plungers for applying shear and/or axial pressures, and a power supply for applying a current. In the first stage, a pulsed current of about 1 to 20,000 amps., is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a shear force of about 5-50 MPa is applied. In the second stage, an axial pressure of about less than 1 to 2,000 MPa is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a steady current of about 1 to 20,000 amps. is applied. The apparatus may be used to bond metallic, ceramic, intermetallic and composite materials to near-net shape, directly from precursors or elemental particle material without the need for synthesizing the material.Type: GrantFiled: October 5, 1999Date of Patent: October 30, 2001Assignee: Materials Modification, Inc.Inventors: Sang H. Yoo, Krupashankara M. Sethuram, Tirumalai S. Sudarshan
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Patent number: 6270718Abstract: A method of bonding a particle material to near theoretical density, includes placing a particle material in a die. In the first stage, a pulsed current of about 1 to 20,000 amps., is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a shear force of about 5-50 MPa is applied. In the second stage, an axial pressure of about less than 1 to 2,000 MPa is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a steady current of about 1 to 20,000 amps. is applied. The method can be used to bond metallic, ceramic, intermetallic and composite materials to near-net shape, directly from precursors or elemental particle material without the need for synthesizing the material. The method may also be applied to perform combustion synthesis of a reactive material, followed by consolidation or joining to near-net shaped articles or parts.Type: GrantFiled: October 5, 1999Date of Patent: August 7, 2001Assignee: Materials Modification, Inc.Inventors: Sang H. Yoo, Krupashankara M. Sethuram, Tirumalai S. Sudarshan
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Patent number: 6187087Abstract: A method of bonding a particle material to near theoretical density, includes placing a particle material in a die. In the first stage, a pulsed current of about 1 to 20,000 amps., is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a shear force of about 5-50 MPa is applied. In the second stage, an axial pressure of about less than 1 to 2,000 MPa is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a steady current of about 1 to 20,000 amps. is applied. The method can be used to bond metallic, ceramic, intermetallic and composite materials to near-net shape, directly from precursors or elemental particle material without the need for synthesizing the material. The method may also be applied to perform combustion synthesis of a reactive material, followed by consolidation or joining to near-net shaped articles or parts.Type: GrantFiled: October 5, 1999Date of Patent: February 13, 2001Assignee: Materials Modification, Inc.Inventors: Sang H. Yoo, Krupashankara M. Sethuram, Tirumalai S. Sudarshan
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Patent number: 6183690Abstract: A method of bonding a particle material to near theoretical density, includes placing a particle material in a die. In the first stage, a pulsed current of about 1 to 20,000 amps., is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a shear force of about 5-50 MPa is applied. In the second stage, an axial pressure of about less than 1 to 2,000 MPa is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a steady current of about 1 to 20,000 amps. is applied. The method can be used to bond metallic, ceramic, intermetallic and composite materials to near-net shape, directly from precursors or elemental particle material without the need for synthesizing the material. The method may also be applied to perform combustion synthesis of a reactive material, followed by consolidation or joining to near-net shaped articles or parts.Type: GrantFiled: October 5, 1999Date of Patent: February 6, 2001Assignee: Materials Modification, Inc.Inventors: Sang H. Yoo, Krupashankara M. Sethuram, Tirumalai S. Sudarshan
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Patent number: 6001304Abstract: A method of bonding a particle material to near theoretical density, includes placing a particle material in a die. In the first stage, a pulsed current of about 1 to 20,000 amps., is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a shear force of about 5-50 MPa is applied. In the second stage, an axial pressure of about less than 1 to 2,000 MPa is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a steady current of about 1 to 20,000 amps, is applied. The method can be used to bond metallic, ceramic, intermetallic and composite materials to near-net shape, directly from precursors or elemental particle material without the need for synthesizing the material. The method may also be applied to perform combustion synthesis of a reactive material, followed by consolidation or joining to near-net shaped articles or parts.Type: GrantFiled: December 31, 1998Date of Patent: December 14, 1999Assignee: Materials Modification, Inc.Inventors: Sang H. Yoo, Krupashankara M. Sethuram, Tirumalai S. Sudarshan
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Patent number: 5989487Abstract: An apparatus for bonding a particle material to near theoretical density, includes a chamber, a punch and die assembly for supporting a particle material, plungers for applying shear and/or axial pressures, and a power supply for applying a current. In the first stage, a pulsed current of about 1 to 20,000 amps., is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a shear force of about 5-50 MPa is applied. In the second stage, an axial pressure of about less than 1 to 2,000 MPa is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a steady current of about 1 to 20,000 amps. is applied. The apparatus may be used to bond metallic, ceramic, intermetallic and composite materials to near-net shape, directly from precursors or elemental particle material without the need for synthesizing the material.Type: GrantFiled: March 23, 1999Date of Patent: November 23, 1999Assignee: Materials Modification, Inc.Inventors: Sang H. Yoo, Krupashankara M. Sethuram, Tirumalai S. Sudarshan