Abstract: The present disclosure, in some embodiments, relates to a method of forming an integrated chip. The method includes forming a test line letter structure having one or more sidewalls continuously extending along a path that defines a shape of an alpha-numeric character from a top-view. The test line letter structure is formed by forming a first polysilicon structure over a substrate and forming a second polysilicon structure over the substrate at a location laterally separated from first polysilicon structure by a dielectric layer.

Abstract: The present disclosure, in some embodiments, relates to a method of forming an integrated chip. The method includes forming a test line letter structure having one or more sidewalls continuously extending along a path that defines a shape of an alpha-numeric character from a top-view. The test line letter structure is formed by forming a first polysilicon structure over a substrate and forming a second polysilicon structure over the substrate at a location laterally separated from first polysilicon structure by a dielectric layer.

Abstract: The present disclosure relates to a substrate having test line letters that are used to identify a test line on an integrated chip, while avoiding contamination of high-k metal gate processes, and a method of formation. In some embodiments, the substrate has a semiconductor substrate. A test line letter structure is arranged over the semiconductor substrate and has one or more trenches vertically extending between an upper surface of the test letter structure and a lower surface of the test line letter structure. The one or more trenches are arranged within the test line letter structure to form an opening in the upper surface of the test line structure that has a shape of an alpha-numeric character.

Abstract: The present disclosure relates to a substrate having test line letters that are used to identify a test line on an integrated chip, while avoiding contamination of high-k metal gate processes, and a method of formation. In some embodiments, an integrated chip is disclosed. The integrated chip has a semiconductor substrate. A test line letter is arranged over the semiconductor substrate. The test line letter comprises a positive relief that protrudes outward from the semiconductor substrate in the shape of an alpha-numeric character. One or more dummy structures are arranged over the semiconductor substrate. The one or more dummy structures are proximate to a boundary of the test line letter.

Abstract: The present disclosure relates to a substrate having test line letters that are used to identify a test line on an integrated chip, while avoiding contamination of high-k metal gate processes, and a method of formation. In some embodiments, an integrated chip is disclosed. The integrated chip has a semiconductor substrate. A test line letter is arranged over the semiconductor substrate. The test line letter comprises a positive relief that protrudes outward from the semiconductor substrate in the shape of an alpha-numeric character. One or more dummy structures are arranged over the semiconductor substrate. The one or more dummy structures are proximate to a boundary of the test line letter.

Abstract: The present disclosure relates to a substrate having test line letters that are used to identify a test line on an integrated chip, while avoiding contamination of high-k metal gate processes, and a method of formation. In some embodiments, the substrate has a semiconductor substrate. A test line letter structure is arranged over the semiconductor substrate and has one or more trenches vertically extending between an upper surface of the test letter structure and a lower surface of the test line letter structure. The one or more trenches are arranged within the test line letter structure to form an opening in the upper surface of the test line structure that has a shape of an alpha-numeric character.

Abstract: The present invention provides a linker for joining an electrode and a capture probe on a biochip, and a biochip comprising the linker. The impedance baseline of the linker of the present invention is three orders lower than the conventional long chain thiol linker when adopting in a fadaraic impedance biochip construction. With lower impedance baseline, the device designed to measure the signal of the biochip of the present invention could be further simplied on the electrical circuit design and be made in lower cost, compacter size and get the potential to be used in point-of-care applications. The present invention also provides a method of quantitatively detecting a concentration of a target analyte in a fluid sample by adopting the biochip and the linker of present invention.

Abstract: The present invention provides a linker for joining an electrode and a capture probe on a biochip, and a biochip comprising the linker. The impedance baseline of the linker of the present invention is three orders lower than the conventional long chain thiol linker when adopting in a fadaraic impedance biochip construction. With lower impedance baseline, the device designed to measure the signal of the biochip of the present invention could be further simplied on the electrical circuit design and be made in lower cost, compacter size and get the potential to be used in point-of-care applications. The present invention also provides a method of quantitatively detecting a concentration of a target analyte in a fluid sample by adopting the biochip and the linker of present invention.